Vous êtes sur la page 1sur 4

TRAINING REPORT

Name: CAO VN T E.code: 20122665 Department: PE Position: Engineer Date join HOGV: 25/6/2012 Report Date: 30/6/2012 Subject: 1,5P Process (First Polishing Process) Object: Comprehension of flow and process in 1,5P process 1, Purpose: Polishing surface of disks to make them very smooth and flat, increase flatness, parallel and remove waviness. 2, Principle: Using slurry and force of pads with pressure to polish surface of disks. Movement of disk and joban (pad) is rotation. The direction rotation of two pads is opposite.

Pads

Input disk

Force

Slurry

Output disk

Before and after the process, disks are kept in water to prevent dust and chemical on

surface of them. 3, Flow: Machine Cleaning Machine Dressing Change slurry

At batch 1

Receive disks from EP QC check thickness before (1 disk/batch)

Re-polishing

Polishing

Shower NG thickness QC check thickness after (1 disk/batch) Cleaning 2P NG thin

Put in Bin 4, Machine: 4.1 Machine

Including two joban, pad is pasted on surface of joban. Jobans are cooled in the polishing process , otherwise heating producing will make uneven pads. Tempature of coolant solution in jobans are 17oC in VA and 15oC in VB, that of out jobans are 20oC in VA and 26oC in VB.

Pad: NP 515, pad life: 70 hours. Having carrier to contain disks. 100 disks are polished each process. Weight: 480 kg, rpm: 18/12

P time = ( thickness before thickness target) / Polishing rate setting batch 1. Now Prate setting = 0.00120 mm / min = 1.2 um/ min. After polishing batch 1:P time = Prate (n)
actual rate

= (thickness before thickness after)/ Polishing

Batches after: Polishing time(n+1) = (thickness before thickness target) / Prate(n) Pads are dressed by dressers. Carriers contain the dressers. Having 2 kinds of dresser are D325 and D600. Principle dressing process is similar to polishing process but slurry is not used and having difference about polishing time. D325 dresser is used for new pad and pad life which is larger than 30 hours.

4.2, Slurry: Recipe: compound of TE98 and RO VA: 1.6 kg TE98 + 11 kg RO + 12 g add A + 12 g add B. VB: 1.8 kg TE98 + 11 kg RO + 14 g add A + 14 g add B. Slurry life: after 13 batches.

5, Important Data Thickness Flatness : Waviness Parallel : machine

6, Defect:

Broken, crack, chip, defects due to collision of disk, carrier, pads. polishing machines are cleaned more frequently.

To prevent bad effects of dust, disks in this process are sunk into water, and