MEMS Fabrication

By Thomas Szychowski

MEMS overview
Micron Made

level mechanical parts

from transistor materials and metals Der Waals forces

Van

Intermolecular

bonding Plays an important part in design

Fabrication Techniques
Mask

Lithography Injection molding Microstereolithography Silicon Surface Micromachining Silicon Bulk Micromachining

Mask Lithography
Use

of photo resist
Dissolves under light Hardens under light

Positive

Negative

Both

get covered with desired material, then photo resist is dissolved by a solvent

Multiple

layers Multiple steps

Mask Lithography

Injection Molding
Starts

with mask lithography Metal poured over resist Resist gets dissolved Metal form is left for plastic injection molding

Injection Molding

Microstereolithography

Similar principal to mask lithography, but for 3D pieces Uses an active mask

Not a physical mask

Utilizes a photo-reactive acrylic resin Each layer image projected through a DMD(digital mirror device) Projected into the resin

Uses lenses

Resin that is illuminated, Cross-links and hardens Piece is then covered in a hardened layer

Microstereolithography
Dimensional

capabilities Lateral and Vertical resolution: 10m Maximum field size: 10.24mm x 7.68mm Structural height: up to 5mm

Microstereolithography

Microstereolithography

Silicon Surface Micromachining

Uses the same process as IC fabrication Needs multiple layers to create structures Cheapest form of Micromachining Similar to lithography

Sacrificial material Structural material

When sacrificial material is removed, only whole structures are left

Silicon Surface Micromachining

Silicon Surface Micromachining

Silicon Surface Micromachining

Silicon Bulk Micromachining

Done with Crystalline silicon Constructed using etch stop planes Chemical process Anisotropic Etching

Speed dependent Directional etch in different crystallographic directions at different rates Slower directions create and etch stop plane

Deep Reactive Ion Etching (DRIE)

Uses photo resist and a mask to create structures

Sapphire Etching

Metal Mask 100m etch depth .28m/min etch rate Chlorine etching

Pressure Sensor Etching

Used on silicon Metal mask .81m etch depth Utilizes Fluorine

High-Speed Etching

Silicon material 1m/min etch rate W-Si Mask

Whacky Neato Pictures

Questions

References

http://home.earthlink.net/~trimmerw/mems/tour.html http://home.earthlink.net/~trimmerw/mems/BM_bulk.h tml http://www.samcointl.com/apps/mems.html http://www.cmf.rl.ac.uk/latest/msl.html http://www.chemguide.co.uk/atoms/bonding/vdw.html Micromachining for Optical and Optoelectronic Systems. MING C. WU