MEMS Based Pressure Sensing

What are MEMS?

Micro Electro Mechanical System is a highly miniaturized device or an array of devices combining electrical and mechanical components that is fabricated using integrated circuit (IC) batch processing techniques and can range in size from micrometers to millimeters.

Applications of MEMS

Accelerometers Gyroscopes Microphones

Pressure Sensors
Displays Bio-MEMS

Types of MEMS Pressure Sensors

Piezoresistive Pressure Sensors Capacitive Pressure Sensors

Resonant Pressure Sensors

Microphones Optical Pressure Sensors

Fabrication of Micro Machined Silicon Diaphragms

MEMS pressure sensors typically employ a diaphragm as the sensor element. The most common fabrication method is anisotropic wet silicon etching. Diaphragm thickness can be controlled either by timing etch duration or by
boron doping or by electrochemical etch stops.

The diaphragms are generally rectangular.

Piezoresistive Pressure Sensors

The Piezoresistive effect describes change in the electrical resistivity of a
semiconductor when mechanical stress is applied.

In Piezoresistive pressure sensors, piezoresistors (made of semiconductors)

are diffused into the membrane.

Piezoresistive Pressure Sensors

Piezoresistors are placed at four edges. They are all oriented in the same direction. The change In resistance is calculated from

= +

The two pairs of piezoresistors are placed on opposite sides of a full bridge circuit. The galvanometer reading in the
bridge circuit can be calibrated to
give pressure reading directly.

Piezoresistive Pressure Sensors

The temperature sensitivity of piezoresistor is a drawback. In the shown arrangement, since all the piezoresistors are at same
temperature, the temperature effects should cancel out. But due to manufacturing tolerances, temperature coefficients will be different and hence error arises.

Overcoming the Drawbacks

A temperature sensor can be placed on board and an algorithm can be
generated to nullify temperature effects.

Inclusion of a dummy bridge on the sensor chip in addition to the pressure

sensitive bridge.

Capacitive Pressure Sensors

Capacitive pressure sensors are typically based upon a parallel plate
arrangement whereby one electrode is fixed and the other flexible, the diaphragm.

As the flexible electrode deflects under applied pressure, the gap between
electrodes decreases and the capacitance increases.

The change in capacitance can be measured using a bridge impedence circuit

and the pressure reading can be obtained.

Capacitive Pressure Sensors

Capacitive sensors are highly sensitive to pressure, have low power consumption and
low temperature sensitivity.

The fixed electrode is another diaphragm that is free to deflect but does not experience
any pressure, and hence is acceleration insensitive.

Drawbacks associated with the capacitive approach are the inherently nonlinear output
of the sensor.

Overcoming the Drawbacks

Use of bossed diaphragms. Sensing capacitance is measured from a particular part of the diaphragm
(non linearity reduced at the expense of sensitivity).

Operating the sensor in touch mode, where the diaphragm is touching the
fixed electrode.

Resonant Pressure Sensors

This sensor works on the principle that the measurand typically alters the
stiffness, mass, or shape of the resonator, hence causing a change in its resonant frequency.

Resonant pressure sensors typically use a resonating mechanical structure as

a strain gauge to sense the deflection of the pressure-sensitive diaphragm.

Resonant Pressure Sensors

As the pressure is applied on the diaphragm, it is pushed in. The nitride seal bends the mechanical member and subjects it to tension.

Hence the resonating frequency of the member changes.

The resonating frequency can be measured and calibrated to give direct pressure readings. oscillations.

A vacuum is trapped around the resonator, to prevent damping of

Performance features of different types of sensing