DRAM INDUSTRY Types of Memory Volatile DRAM: Dynamic RAM Higher density, lower cost, power hungry SRAM: Static RAM Lower density, higher cost, 2-4X faster than DRAM New technologies: ZRAM (Hynix, AMD), TTRAM (Renesas)
Non-volatile Flash High growth market (mobile, digital music and imaging) Slow to write, degrades over time PCM (PRAM) - Most promising new technology Fast, long lasting Prototypes by Samsung (512Mb), Intel/STM, Sep 2006 Sources: Introduction to Memory Types http://www.netrino.com/Publications/Glossary/MemoryTypes.php Samsung Sep 11,2006 Press release and http://www.eweek.com/article2/0,1895,2021822,00.asp Memory Industry Global Memory Chip Industry Approx $250 billion in 2006 (10% growth) $227.5 billion in 2005 from $213.0 billion in 2004
Segmentation DRAM ( over 50% of this market) SRAM (10%) Flash (32%)
Asia-Pacific projected to be the largest and fastest growing market
Cyclic industry with massive swings 2006 was a good year, prices were rising (revenue had 10% growth) 1 2007 was a bad year, significant price plunge (by 39%) 2 1. http://www.infoworld.com/article/06/05/31/78779_HNchipforecast_1.html 2. http://www.informationweek.com/showArticle.jhtml?articleID=201201654 Cyclic Structure of Semiconductor Industry Factors : Rapid Technical Progress
High Sunk Costs and Large Lag Times $1.5-2 billion for a fab, ready in 1-2 years
Steep Learning Curves higher variations of price
Large R&D investments
Periodic Technology Shocks Global Market Share by Countries, DRAM Sector
(Source: Dataquest, May 2001) www.american.edu Products Breakdown DRAM : - Traditionally in PCs ( 80% of DRAM shipments in 1990,declined to 67% by 2003)
- Telecommunications and consumer electronic markets are growing consumers : mobile phones, switches, hubs
- 2008 Prediction: TVs, set top boxes and game devices to represent 7% of this DRAM market Value Chain Powerful players - only 2 or 3 main dominating players
Price conscious customers End user is not aware of DRAM brand Customers were fragmented No single OEM controlled more than 20% of the global PC market
OEMS negotiated high on price Porter Analyses Factor Conditions Location Ports, Major markets Labor High concentration of skilled engineers, HR policies Government policies for trade, education Strategy and Structure High internal competition Hynix Technology know-how, experience Demand Conditions Korea has early adopters Demand in east Asia is high
Porters Diamond Model for Samsung/Korea Related/Supported Industries LCD, Mobile Phone and PC industries Porters five forces for DRAM Substitute products Danger of future substitutes given rapid changes Probable little switch cost Rivalry Small no. of competitors Significant exit barriers Cyclic Industry growth New entrants Guarded by economies of scale Significant capital costs Learning Curve Threat of retaliation Little brand identity significance Government Policy e.g. China Customers No significant buyers by volume Buyers are very price sensitive Price limited by other memory substitutes Little threat of backward integration? Suppliers No significant differentiation of inputs Suppliers not concentrated No threat of forward integration SAMSUNG Samsung History
Established in 1969 to manufacture black and white TV sets
Purchased a Korea Semiconductor Business in 1974
In 1980 dedicated most of its resources to semiconductor business and built its first manufacturing facility.
By early 1990s, was amongst the industrys top contenders
Brand value rank grew from 43 rd in the world ($ 5.2 billion) in 2000 to 21 st in the world ( $12.6 billion) in 2004 and 20 th in 2006 (16.1 billion)
Ahead of many brands such as Pepsi, Google, and Siemens
Total net revenue in 2004 was $78.5 billion, and $78.7 billion in 2006
Samsung Structure Spans 58 countries Samsung Electronics has 5 business divisions : Semiconductor Digital Media Telecommunications LCD Digital Appliances Samsung DRAM Facts 2nd Largest chipmaker worldwide (2006) 1
Market leader in DRAM 92 - 07 2 Total DRAM Volume 896.4M units (2003) Over 1200 DRAM products Frontier to legacy products Specialty and customized products Versus competitors (1Q00-1Q04): Average price premium: 34% Average operating margin difference: +53% 1. www.dailytech.com 2. Samsung 2006 Annual Report DRAM Operating Profits 0 1 2 3 4 5 6 7 S a m s u n g M i c r o n I n f i n e o n H y n i x S M I C SG&A R&D Depreciation Labor Raw Materials Price Samsung Performance Cost Advantages Lowest raw materials cost (volume) Lowest depreciation Labor and SG&A not high Shared core designs Lower cost fabs (12%) Flexible production lines Higher yields (because of process quality) Highest Price Highest reliability in industry: >$1 premium Cost of Materials DRAM Cost of Materials vs Volume (2003) 0 0.5 1 1.5 2 2.5 0 200 400 600 800 1000 Prod. Volume 256Mbit equiv (M Units) C o s t
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SMIC Samsung Micron Hynix Infineon SAMSUNG STRATEGY Kun-Hee Lee Chairman & CEO Generic Competitive Strategies Two dimensions of competitive strategy Competitive advantage - low cost vs. differentiated play Target Market - broad vs. niche play
Samsung, because of the unique ecosystem created around it, has successfully spread its product line across both of these dimensions
Generic Competitive Strategies T a r g e t
M a r k e t
Overall Low-Cost Provider Strategy (Commodity DRAM) Broad Differentiation Strategy (Cutting Edge DRAM) Focused Low-Cost Strategy (Low cost flash memory) Focused Differentiation Strategy (Rambus DRAM) Best-Cost Provider Strategy (Samsungs Strategy) Lower Cost Differentiation Broad Range of Buyers Narrow Buyer Segment or Niche Combined low-cost/differentiated strategy is difficult to achieve Difficult to implement Firms aiming to do this are often stuck in the middle Firms products are too costly to compete with low costs providers product, and too undifferentiated to command the price premium gained by the differentiated firm A variety of internal and external factors have helped Samsung achieve this desirable position Samsungs Combined Low- cost/Differentiated Strategy Samsungs success has been due to a variety of factors: Successfully customize products around a core design Large product portfolio (occupy the entire spectrum for a broad market play) Collocation of fab and R&D facilities (internal conversation among engineers to decrease time to market) Samsungs Combined Low- cost/Differentiated Strategy (contd) Easy access to Asian market Combination of educated guessing and pure luck (e.g. stack design vs trench design) Talent pool strategy: Access to local talents, sponsoring employees for PhD and MBA education) Availability of capital: E.g. from 1983 to 1985 during recession of semiconductor industry, Samsung allocated significant capital to build capacity
CHINESE THREAT Emerging Competitors Elpida Japans only remaining DRAM producer Hynix Has many financial problems Infineon Major DRAM player with 25 R&D locations all over the globe Micron Technology Investing in next generation DRAM technology with a $500 million investment from Intel Nanya Technology Producing 256 Mbit DRAM in a Joint Venture with Infineon SMIC The only Chinese DRAM manufacturer. It is Chinas most advanced producer and a major competitor for Samsung Chinese Environment Regulatory A zero tariff rate for importing semi-conductors Tax rebates to domestically produced semiconductors (avail in 2003 but stopped since April 2004) Other preferential policies although not announced in detail, are in the pipeline to encourage investment in semiconductors Market Access issues still exist Technology China lacks the critical infrastructure necessary to support a cutting edge semi-conductor industry The US and Taiwan governments have forbidden shipment of cutting edge production technology to China. So China went to other countries Alliances Chinese government provided cheap credit, abundant land, cheap utilities, engineering talent, tax incentives to anyone who was willing to partner with a Chinese company Labor China still enjoys an advantage in labor intensive activities Chinese Advantages Ample access to capital Low cost of labor and administration Government incentives Cheap credit, land, utilities Tax incentives Engineering talent Strategy Licence technology, designs Sell at low prices to gain market share, increase volume RECOMMENDATIONS Options (1) 1. Do not cooperate with the Chinese Save the current ecosystem in Korea A. Try to suppress the Chinese firms Cost reduction on low end DRAM: reduce from a margin of 24% close to zero with the extra benefit of reliability incurring significant losses to Chinese companies (already at -9%) For how long can both sustain the war? Chinese gain in workforce and capital whereas Samsung in volume B. Focus only on cutting edge high-end products Danger in the future that Chinese might learn and overtake (just as Samsung did in the past) C. Search for a new technology Will it appear in time? Options (2) 2. Collaborate with Chinese firms Lose the local ecosystem and increase some costs Lose perhaps on quality, i.e. reliability Easier to penetrate the Chinese Market A. Build a fab in China Benefit the long term cost reduction in salaries and SG&A Keep under control the Chinese firms Pay an initial potentially large cost of entry A large part needs to be controlled by Chinese local partner Could also lose sensitive information, helping competition B. Cooperate as Infineon by providing technology Not clear what the benefit is since they currently produce at a lower cost and by partnering could create a future competitor Recommendation Do not Open a fab in China for now Currently, it is not yet viable to move to China current prices are higher; extra cost of a new fab; potential decrease in quality might even affect other Samsung products; If future prices of the Chinese products will be lower, consider building a fab there with the low-end Samsung technology Focus on R&D to maintain technological lead Try to suppress the Chinese companies by price reduction on low end DRAMs Do not allow them to gain market share Also affect Infineon and Micron which provide them with the initial design Samsung is a large company that can afford to have lower margins in one segment (lower end DRAM) Not even the Chinese can afford to lose a lot of money on long term BACKUP SLIDES Largest Chip Manufacturers 2006 DRAM Competitors Samsung, 2 nd (+11%,+2B) Hynix, 8 th ,first time among top 10 (+32%, +1.8B) Qimonda AG, newly created Infineon memory division spin off, 12 th
Micron, 13 th (+10.8%, +.5B) Elpida 20 th (+89%, +1.6B) What makes DRAM special?
Type of RAM that stores each bit of data in a separate capacitor within an integrated circuit
Since real capacitors leak charge, the information eventually fades unless the capacitor charge is refreshed periodically.
Because of this refresh requirement, it is a dynamic memory as opposed to SRAM and other static memory.
Its advantage over SRAM is its structural simplicity
This allows DRAM to reach very high density Major Players Samsung is the market leader, ahead of Japanese rivals in both size and profits
In 2005, large scale entry by Chinese firms Easy access to money from local and international forces Were willing to sacrifice profits for market share.
In 2004 Samsung announced sharp drop in market prices due to increase in industry capacity and partly due to cyclic downturn