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Course Code: ECL305(odd semester)
Naman Joshi
(Assistant Professor)
(EECE Department, ITMU)
Flow:
1. Block Diagram of an Op-Amp
2. Schematic symbol & Equivalent Circuit
3. Integrated Circuits & their classifications
4. Types of IC packages
5. Pin identifications
6. Interpretations of data sheets
7. Characteristics and Parameters of Op-Amp
1. Block Diagram
1. First Stage:
Provides most of the voltage gain and offers high input
resistance
2. Second Stage:
An intermediate stage, usually another DA with Dual Input
Unbalanced output.
3. Third Stage:
A level translator, to shift the dc level to ground (DC level is
above ground level because of direct coupling )
4. Final stage:
A Push-Pull Amplifier, offers high voltage swing , high current
supplying capability and low output resistance.
2. Schematic Symbol
3. Integrated Circuit
When all component of each circuit are fabricated on the same chip, the chip is called an
Integrated Circuit (IC)
Classifications:
A) Mode of Operations
(I) Digital IC
(II) Linear IC
NOTE : Op amp can be divided into two categories , General purpose and Special
purpose. General purpose: used for many application like integrator ,differentiator,
active filters comparators.(Example: 741IC). Special purpose : used for specific
application like LM 380 used only for audio power application
(B)Production process
(I) Monolithic
(II) Hybrid IC
1.Active components are fabricates on
Semiconductor piece but passive
components ( R and C) and their
interconnects are formed on an
insulating substrate
2.This substrate works as a chasis for
chip
3. Depending upon method to form R,C
and interconnections Hybrid IC is
two types : thin film and thick film.
4. Thin film when suitable material is
evaporated.
5. Thick film when etching is performed
on substrate by silk screening.
IC package Types
Flat Pack
1. Enclosed in rectangular ceramic case
2. 8, 10 , 14 ,16 pins
3.Leads accommodate power supply, input output and several special connections
4. more reliable
5. lighter than Comparable DIP package
6. best suited for airborne application
Metal Can transistor pack
1. enclosed in metal or plastic case
2. 3, 5, 8 ,10, 12
3. best suited for power amplifiers as has good heat dissipation capability
4. also permits external heat sinks.
5. It is the only choice if IC is to be operated at relatively high temperature.
6. Costly
Dual in line package (DIP )
1. mounted inside a plastic or ceramic case.
2. Most widely used as easy to mount on bread board and for soldering. Best
suited for experimentation
3. lowest cost. Ceramic DIP able to dissipate more so more costly than plastic DIP.
Electrical Parameters
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Dependencies - I
AC Parameters
1.
2.
3.
4.
5.
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7.
8.
9.
Input resistance
Output resistance
Large Signal voltage gain
Output voltage swing
Average input oofset
voltage and current drift
Long term input offset
voltage and voltage stability
Gain Bandwidth product
and transient response
Slew rate
Equivalent input noise
voltage and current.
DC Parameters
1.
2.
3.
4.
5.
Input resistance
Output resistance
Large Signal voltage gain
Output voltage swing
Input offset voltage and
input offset current.
6. Average input offset
voltage and current drifts
7. Long term input offset
voltage and stability.
Dependencies - II
Supply voltage dependent parameters:
Voltage Gain, output voltage swing, input common mode voltage range,
power consumption and input offset current
An Ideal Op-Amp
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