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Joseph M. PettitClass
Endowed Chair
Professor in ECE & MSE
by System
Scaling
Director,SOP
3D Systems
Packaging Research
Center
Todays Class
What is SOP?
What are SOP Technologies?
Industry Collaborations in SOP at GT
GT PRC model for R&D
Slide 2 | 08-20-2015
GT APPROACH TO SYSTEM
SCALING
Research
Industry Collaboration
Education
Slide 3 | 08-18-2015
Slide 4 | 08-20-2015
10
00
X
5X
1,000
100
100
Gap
Transistor Scaling (Node)
0
1960
10
1970
1980
1990
Year
2000
2010
2020
bump pitch(um)
10,000
Ceramic MCM
Packaging
MCM
Organic
Packaging
3D Packaging
BGA Packaging
Build Up
Organic
GTs 3D Interposer
SIPs
Memory
40 Memory
um
Memory
Memory
Glass Package
CPU
GPU
PWB
3D Photonics
Logic
Photo-detector array
3 1
Logic
2
5
Fiber
Slide 6 | 08-18-2015
What is SOP?
Slide 7 | 08-20-2015
SOP Concept @ GT
Slide 8 | 08-20-2015
Digital + Analog + RF +
Optical + Sensors
Slide 9 | 08-20-2015
Computing/Internet
Digital Audio
Digital Imaging/Video
Cellular/Wireless
GPS/Satellite
Sensors
And, of course, timekeeping!
SOP @ PRC
SOP
Slide 10 | 08-20-2015
Slide 11 | 08-20-2015
Slide 12 | 08-20-2015
System-on-Board
(SOB)
Current approach is
bulky, expensive
Future limits in
thickness and
functionality,
Board is biggest barrier
to system
miniaturization
System-on-Package
(SOP)
Most strategic, focus
on miniaturization and
integration
Two integration
platforms
1) Wafer-based
devices
2) Panel-based
modules
Module architectures
2D SCM & MCM
2.5D MCM
Si, glass, organics
3D MCM
6. 3D Opto
3. 3D ThinPack
PD/TIA
LASER
PHOTODETECTOR
CHIP-LAST
EMBEDDED IC
Waveguide
NANOMAGNETICS
EBG &
Isolation
5. MEMS
Packaging
SENSORS
MEMS
Bio-Sensor
GaAs RFIC
THERMAL SOP
ANTENNAS &
FILTERS
50m
3D CAPACITORS
4. TPI
Glass or Si Core
30m
1. Glass Interposer
2. Low Cost Si
Interposer
7. SLI
HIGH DENSITY I/O
3D ICs
50m
8. 3D Design Tools
and Architecture
4. THINFILM
PASSIVES
Slide 13 | 08-20-2015
5. THERMAL
TECHNOLOGIES
6.INTERCONNECTIONS,
ASSEMBLY & RELIABILITY
7. INTERPOSERS
AND PACKAGES
Chapter 2
Slide 14 | 08-20-2015
Chip
ChipStacking
Stacking
Chip Stacking
(Non-TSV)
(Non-TSV)
(Non-TSV)
SIP
Stacked
ICs
Package
Package
Package
Stacking
StackingStacking
(Non-TSV)
(Non-TSV)
(Non-TSV) TSV
TSVChip/Wafer
Chip/Wafer
TSVICs
Chip/Wafer
Stacking
Stacking
SIP
Stacked
Packages
3D
withStacking
TSV
Logic IC
SOP Platform
Slide 15 | 08-20-2015
Slide 16 | 08-20-2015
System-On-Package Technologies
SENSORS
3D ICs
MEMS PACKAGING
THERMAL SOP
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 17 | 08-20-2015
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 18 | 08-20-2015
MEMS PACKAGING
THERMAL SOP
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 19 | 08-20-2015
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED
MIXEDSIGNAL
SIGNALDESIGN
DESIGN
Slide 20 | 08-20-2015
MEMS Packaging
SENSORS
3D ICs
MEMS PACKAGING
THERMAL SOP
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 21 | 08-20-2015
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 22 | 08-20-2015
Optoelectronics
SENSORS
3D ICs
MEMS PACKAGING
THERMAL SOP
PD/TIA
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 23 | 08-20-2015
Thermal SOP
SENSORS
3D ICs
MEMS PACKAGING
THERMAL SOP
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 24 | 08-20-2015
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
POWER
MIXED SIGNAL DESIGN
Slide 25 | 08-20-2015
Nano Bio-Components
SENSORS
3D ICs
MEMS PACKAGING
THERMAL SOP
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 26 | 08-20-2015
Sensors
SENSORS
3D ICs
MEMS PACKAGING
THERMAL SOP
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 27 | 08-20-2015
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 28 | 08-20-2015
DESIGN
DESIGNFOR
FORRELIABILITY
RELIABILITY
1st Level
Chip-Package Interconnections
SENSORS
3D ICs
MEMS PACKAGING
THERMAL SOP
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 29 | 08-20-2015
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 30 | 08-20-2015
System-On-Package Technologies
SENSORS
3D ICs
MEMS PACKAGING
THERMAL SOP
OPTO SOP
Ga-As
MEMS
EMBEDDED COMPONENTS
ANTENNAS AND
FILTERS
Si or GLASS INTERPOSER
POWER
MIXED SIGNAL DESIGN
Slide 31 | 08-20-2015
GT APPROACH TO SYSTEM
SCALING Research
Industry Collaboration
Education
Slide 32 | 08-18-2015
NEW INDUSTRY-ACADEMIC
MODEL
Slide 33 | 08-20-2015
System
Scaling
New
AcademicIndustry
Model
New Technologies
Skilled Resources
Global
End-User-to-Supply
Chain Mfg.
Slide 34 | 08-20-2015
Strategic
Research
Technology
Development
Manufacturing
Traditional
Technology Transfer ~5%
Technical Scope
Corporate
Technology Transfer ~ 20%
Traditional
Academic
Research
Corporate
Research
Government Funding
Industry
Funding
Industry Manufacturing
GT PRC
GT PRC
Technology Transfer ~ 50%
10
Slide 35 | 08-20-2015
3
Time in Years
ECE/ME/MSE 6776 SOP by System Scaling
PRC
Staff
Graduate
Students
Research
Faculty
Engineers
on Campus
Industry
Partners
Slide 36 | 08-20-2015
Highly-Interdiscipline Faculty
System Fab
Facilities
Academic
Faculty
PRC
Staff
Interdisciplinary
Academic Faculty
Graduate
Students
Research
Faculty
Engineers
on Campus
Industry
Partners
Prof. Maysam
Prof. GK Chang
Prof. Peter Hesketh
Plus
Ghovanloo
Sensors
Optomany more
Prof. Yogendra
Joshi
Thermal
Bioelectronics
Prof. Madhavan
Prof. CP Wong
Swaminathan Polymer Materials
RF
Slide 37 | 08-20-2015
GT PRCS
GLOBAL INDUSTRY CONSORTIUM
To Stimulate Global Interest
Slide 38 | 08-20-2015
2. Materials
3. Devices
Communication
Electronics
Electronics
Photonics
mm-Wave
Power Electronics
Sensor Electronics
4. Electronic Substrates
5. Photonic Substrates
6. High-temp Electronics
7. Power Electronics
8. Sensing Electronics
9. RF and mm-Wave Electronics
10. EMI Design & Materials
11. Interconnections & Assembly
Slide 39 | 08-20-2015
SubSystem
Integration
SOP
Device
Manufacturers
Package
Integrators
(OSAT)
Material &
Tool Suppliers
Interposer
Manufacturers
Slide 40 | 08-20-2015
Ultra-thin Actives
and Passives
(3D IPAC)
2D
2D or
or 3D
3D IC
IC
3D Glass Photonics
(3D GP)
Board-level
Interconnect,
Assembly &
Reliability (BLIAR)
10m Pitch
Off-chip
Interconnects
Electrical Design
for Power, Signal,
Noise & Bandwidth
Mechanical Design
for Warpage and
Reliability
IC
Si or Glass
BLIAR
PWB
Slide 41 | 08-20-2015
All-Glass MEMS
Packaging (with
CMMT Center)
Dr. K. Panayappan
Electrical
2.5D Interposer for
bandwidth
Signal, power delivery, noise, X-talk
2. Electronic
Substrates
Slide 42 | 08-20-2015
3. Photonic
Substrates
4. Functional
Components
5. High-power &
High-temp, Mixed
Function Electronics
6. Interconnects &
Assembly
Materials
Slide 43 | 08-20-2015
EUROPE
HC Starck Capacitors
Schott Glass
Atotech Plating
EVG Spray Coating
Suss Laser Via
Nanium Bumping
TDK-Epcos RF
CHINA
JCET Bumping
KOREA
UNID Materials
Fusei Menix Lamination
Gigalane RF
TAIWAN
Unimicron 2.5D
ASE Assembly
Quanta Assembly
TSMC User
Tools
Substrates
ECE/ME/MSE 6776 SOP by System Scaling
Assembly
JAPAN
Ajinomoto Dry Film
Asahi Glass Glass
Hitachi Chemical Photoresist
MGC Laminates
TOK Photopolymer
Zeon Dielectrics
Asahi Glass TPV
Disco Dicing
Mitsubishi Electric Laser
Ushio Lithography
NGK/NTK 2.5D
Shinko 2.5D
Namics Underfill
Users
GT APPROACH TO SYSTEM
SCALING
Research
Industry Collaboration
Education
Slide 44 | 08-18-2015
Education Strategy
Inter-disciplinary
&
System
Education
Disciplinary
Education
Packaging Education
Slide 45 | 08-20-2015
Education Strategy
Disciplinary Education
VLSI Design
Semiconductor Devices
Microwave Design
Wireless IC Design
Analog Electronics
Nanoscale Devices
Gigascale Integration
MEMS
Radar and EM Sensing
Optoelectronics
Finite-Element
Functional Materials
Electro Optics
Nanomaterials and Structures
Slide 46 | 08-20-2015
Packaging and
System Level Education
Packaging Design
Package Substrates
Packaging Assembly
System Packaging
EMI Packaging
Hands-on Substrate
Fabrication
Hands-on Assembly
Bioelectronics
Power Electronics