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• Most lead free alloys have a higher melting point than SnPb. The melting point of eutectic SnPb solder is
183°C. Other than tin bismuth (SnBi), most of the popular lead free solder alloys have a melting
temperature between 215°C and 227°C.
• The components and board will be more sensitive to heat-related soldering damage with lead free solders
than with SnPb solders.
• It has been shown that components will increase their moisture resistance sensitivity by two levels, based
on IPC-J-STD-020 testing specifications.
• The higher lead free soldering temperatures can result in an increase in board delamination, measling, and
blistering. For example, measling bridging over 50% of the span between conductors is a defect, in
accordance to IPC J-STD-001.
• OSP board finishes are prone to developing a halo around the solder joint. Because lead free solders do
not wet as well, this halo effect is more prominent with lead free than with SnPb solders.
• The following are various alternative finishes provided by component manufacturers: Sn, SnAg, SnCu,
SnAgCu, Ni, NiPd and Pd.
• According to EMPF, there are no process incompatibilities and no reliability issues between the various
lead free solders and the above lead free board finishes.
• There are possible incompatibilities between lead free component finishes and SnPb solders. This is
known as “backwards compatibility”. This is especially true when Sn-Ag-Cu finish is used in the component
metallization as is the case in BGAs. The use of Sn-Pb solder paste could render the solder joints
unreliable.
• Tin-finished components pose a major reliability risk because they are susceptible to tin whiskers, which
can cause electrical system failures.
Lead Free Hand Soldering – Conclusion