NOTA: Estas diapositivas son una cortesa de los autores

del libro principal de nuestra bibliografa: Digital Integrated

Circuits: A design perspective. (Jan M. Rabaey Anantha
Chandrakasan, Borivoje Nikolic)
Mis agradecimientos, Profr. Hctor Santiago Ramrez
Algunas modificaciones se han hecho con la finalidad de
actualizar los datos.

Unidad I: Introduccin

TPICOS SELECTOS DE DISEO DE

CIRCUITOS INTEGRADOS II (DISEO DE
CIRCUITOS INTEGRADOS DIGITALES II)
EE141 Integrated Circuits
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Introduction

Digital Integrated
Circuits
Jan M. Rabaey

AAnantha
Design
Perspective
Chandrakasan
Borivoje Nikolic

Introduction
July 30, 2002
EE141 Integrated Circuits
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Introduction

What is this book all about?

Introduction to digital integrated circuits.

CMOS devices and manufacturing technology.
CMOS inverters and gates. Propagation delay,
noise margins, and power dissipation. Sequential
circuits. Arithmetic, interconnect, and memories.
Programmable logic arrays. Design
methodologies.

What will you learn?

Understanding, designing, and optimizing digital
circuits with respect to different quality metrics:
cost, speed, power dissipation, and reliability

EE141 Integrated Circuits

Digital

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Introduction

Digital Integrated Circuits

Introduction: Issues in digital design
The CMOS inverter
Combinational logic structures
Sequential logic gates
Design methodologies
Interconnect: R, L and C
Timing
Arithmetic building blocks
Memories and array structures

Diseo de Circuitos
integrados Digitales I

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Tpicos Selectos de
Diseo de Circuitos
integrados II

Introduction

Introduction
Why

is designing
digital ICs different
today than it was
before?
Will it change in
future?

EE141 Integrated Circuits

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Introduction

History
Vacuum tubes,
1904

ENIAC
University of Pennsylvania,
Vacuum tubes, cristal diodes,
relays
1946

First transistor
Bell Labs, 1948
The Babbage
Difference Engine,
mechanical
1832

TRADIC
Bell labs, 1956
Junction Transistors

ECL 3-input Gate

Motorola 1966
Bipolar logic
1960s
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Intel Microprocessors

Pentium IV Willamette
Year 2000
42 000 000 transistors
1.5 GHz operation
180nm process

4004
Year 1971
2300 transistors
1 MHz operation
10m process

2015
Intel 5th Generation Core I7
Core i7 5500
Year 2015
1 900 000 000 transistors
up to 3 GHz operation
14nm process
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1975

1974

1973

1972

1971

1970

1969

1968

1967

1966

1965

1964

1963

1962

1961

16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0

1960

noted that the number of

transistors on a chip doubled
every 18 to 24 months.
He made a prediction that
semiconductor technology
will double its effectiveness
every 18 months

Grfica del artculo original de Gordon Moore.

1959

In 1965, Gordon Moore

LOG
2 OF THE NUMBER OF
COMPONENTS PER INTEGRATED FUNCTION

Moores Law

Gordon Moore: Cofundador de Intel y creador de la

famosa ley de Moore publicada en la revista Electronics
en 1965: predice que el nmero de transistores dentro
de un chip se duplica cada 18 meses (originalmente
Moore mencion que cada 2 aos).

Electronics, April 19, 1965.

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Transistor Counts

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Nmero de transistores en un chip

Introduction

Moores law in Microprocessors

Transistors (MT)

1000

2X growth in 1.96 years!

100
10

486

P6
Pentium proc

386
286

0.1
8086

8085
Transistors
on Lead Microprocessors double every 2 years
0.01
8080
8008
4004

0.001
1970

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1980

2nd

1990
Year

Courtesy, Intel

2000

2010

10

Introduction

Die Size Growth

Die size (mm)

100

10
8080
8008
4004

8086
8085

286

386

P6
Pentium
proc
486

~7% growth per year

~2X growth in 10 years

1
1970

1980

1990
Year

2000

2010

Die size grows by 14% to satisfy Moores Law

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Courtesy, Intel

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Introduction

Frequency
Frequency (Mhz)

10000

Doubles every
2 years

1000
100
10

8085

1
0.1
1970

8086 286

386

486

P6
Pentium proc

8080
8008
4004
1980

1990
Year

2000

2010

Lead Microprocessors frequency doubles every 2 years

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Courtesy, Intel

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Introduction

Power Dissipation
Power (Watts)

100
P6
Pentium proc
10
8086 286
1

8008
4004

486
386

8085
8080

0.1
1971

1974

1978

1985

1992

2000

Year

Lead Microprocessors power continues to increase

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Courtesy, Intel

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Introduction

Power will be a major problem

100000

18KW
5KW
1.5KW
500W

Power (Watts)

10000
1000

Pentium proc

100

286 486
8086
10
386
8085
8080
8008
1 4004
0.1
1971 1974 1978 1985 1992 2000 2004 2008
Year

Power delivery and dissipation will be prohibitive

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Courtesy, Intel

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Introduction

Power density
Power Density (W/cm2)

10000

Rocket
Nozzle

1000

Nuclear
Reactor

100

8086
10 4004
Hot Plate
P6
8008 8085
Pentium proc
386
286
486
8080
1
1970
1980
1990
2000
2010
Year

Power density too high to keep junctions at low temp

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Courtesy, Intel

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Introduction

Improving TDP (Total Dissipation

Power): scaling manufacturing

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Introduction

Not Only Microprocessors

Cell
Phone

Se espera que
sean 7300
millones de
celulares en el
mundo en el 2014
Digital Cellular Market
(Phones Shipped)

Small
Signal RF

Power
RF

Power
Management

1996 1997 1998 1999 2000

Units

48M 86M 162M 260M 435M

Analog
Baseband
Digital Baseband
(DSP + MCU)

(data from Texas Instruments)

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Introduction

Challenges in Digital Design

Macroscopic Issues

Microscopic Problems

Time-to-Market
Millions of Gates
High-Level Abstractions
Reuse & IP: Portability
Predictability
etc.

Ultra-high speed design

Interconnect
Noise, Crosstalk
Reliability, Manufacturability
Power Dissipation
Clock distribution.
Everything Looks a Little Different

?
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and Theres a Lot of Them!

18

Introduction

Why Scaling?

Technology shrinks by 0.7/generation

With every generation can integrate
2x more functions per chip; chip cost
does not increase significantly
Cost of a function decreases by 2x
But
How to design chips with more and more
functions?
Design engineering population does not
double every two years

Hence, a need for more efficient

design methods
Exploit different levels of abstraction

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Introduction

Design Abstraction Levels

SYSTEM

MODULE
+
GATE

CIRCUIT

DEVICE
G
S
n+

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D
n+

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Introduction

Summary
Digital integrated circuits have come a long
way and still have quite some potential left for
the coming decades
Some interesting challenges ahead

Getting a clear perspective on the challenges and

potential solutions is the purpose of this book

Understanding the design metrics that govern

digital design is crucial
Cost, reliability, speed, power and energy
dissipation

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Introduction