NUMERICAL AND EXPERIMENTAL

INVESTIGATION OF MIXED CONVECTIVE

COOLING OF ELECTRONIC CHIP WITH
VORTEX GENERATOR AT THE ENTRY REGION

PROJECT GUIDE: Dr. ASIS GIRI and CO-GUIDE: Dr.

BIPLAB DAS
PRESENTED BY : KRISHNA ROY (MT/14/TFE/06)

INTRODUCTION

Electronic chips finds wide application in heat transfer devices used in

industrial, transportation, or domestic equipment such as air cleaning
and air conditioning systems, humidity control systems, thermal power
plants, etc.
To avoid unacceptable temperature rises in electronic devices, an
industrial system and metallurgy to prevent thermal problems,
improvements in cooling methods are obligatory.
Advancement of technology demands for high performance heat
transfer components to prolong the longevity of device/equipment or to
remove heat more efficiently.
Varieties of applications drive the researchers to find the better cooling
of electronic chip. It is always desirable to have engineering systems
requiring high performance heat transfer components with
progressively smaller weights, volumes and costs.

TANTATIVE OBJECTIVE

To study the heat transfer in an electronic chip or heated

blocks in a channel.
To study the role of vortex generator in heat transfer and other.
To predict velocity, pressure and temperature profiles on the
chips.
To predict temperature distribution along the channel.
And effects on Reynolds number, Nusselt number and Grashof
number.

SURVEY OF ELECTRONIC CHIP COOLING

Cooling of electronic chip is a subject of interest for many investigators

since its introduction.
All early computers in 1940s used vacuum-tube electronics and were
cooled with forced air.
As a replacement for vacuum tubes, the miniature transistor generated less
heat, was much more reliable, and promised lower production costs.
The trend toward higher packaging densities dramatically gained
momentum with the invention of the integrated circuit. (The SSI (smallscale integration) and MSI(medium-scale integration) in 1960s).
In 1980s with the development of VLSI(very large-scale integration)
technologies offering thousands to tens of thousands of devices per chip.
There was a brief respite with the transition to CMOS(Complementary
metaloxidesemiconductor) circuit technologies in the 1990s.

It has been found that for every 2 C temperature rise, the reliability of
a silicon chip will be decreased by about 10 %.
Cause of an electronic chip failure are:

LITERATURE REVIEW
S.No. Author/Year

TITLE

Solution
Method

Remarks

1.

Braaten M E,
Patankar S V
(1985)

Analysis of laminar
mixed convection in
shrouded array of
heated rectangular
blocks.

Analytical Buoyancy effects were found

to lead to a significant increase
in heat transfer and flow
friction over the forced
convection values.

2.

Kamiski D A, Conjugate natural

Prakash C
convection in a
(1986).
square enclosure;
effect of conduction
in one of the vertical
walls.

Numerical One dimensional and lumped

parameter network approaches
are viable, quick and
economical alternatives to a
complete two dimensional
analysis.

3.

Davalath J,
Bayazitoglu Y
(1987).

Forced convection cooling

across rectangular blocks.

Numerical

The effects of Reynolds

number on fluid flow and
heat transfer were analyzed
and results were also
presented on the effect of
prandtl number.

4.

Seo Young
Kim, Hyung
Jin Sung, Jae
Min Hyun
(1992).

Mixed convection from

multiple layered boards with
cross-stream wise periodic
boundary conditions.

Analytical

For vertically-oriented
channel, the impact of
buoyancy effect on the
flow and thermal fields is
more pronounced then the
horizontally-oriented
channel.

5.

Molki M,
Faghri M,
Ozbay O
(1995).

A correlation for heat transfer

and wake effect in the
entrance region of an in line
array of rectangular block
simulating electronic
components.

Experimental They obtained a typical

computer output indicated
that the mean deviation
between the measure and
predicted temperature is
11.0 percent.

6.

Jubran B A,
Swiety S A,
Hamdan M A
(1995).

Convective heat transfer

and pressure drop
characteristics of various
array configurations to
simulate the cooling of
electronic modules.

Numerical

The implantation of odd-size

modules in the array is shown
to be an effective means of
heat transfer enhancement with
a maximum enhancement
value of 40%.

7.

Young T J,
Vafai K
(1998).

Convection cooling of a
heated obstacle in a
channel.

Experimental

A reasonable estimate for the

Nusselt number on the top face
of the obstacle if the bypass
height was utilized to
characterize the flow.

8.

Kim S Y ,
Kang B H
(1998).

Forced convection heat

transfer from two heated
blocks in pulsating
channel flow.

Numerical

A tolerance limit in view of

increased pressure drop and to
determine the optional
frequency of external pulsation
according to the geometrical
parameter w/H.

9.

Young T J,
Vafai K (1999).

Experimental and
Numerical Investigation
of forced convection
characteristics of arrays
of channel mounted
obstacles.

Experimental
and
Numerical

The proper placements

of geometrically
dissimilar obstacles .

10.

Premachandra
B, Balaji C
(2005).

Mixed convection heat

transfer from a horizontal
channel with protruding
heat source.

Numerical

A correlation for
maximum temperature
based on asymptotic
expansion gives
reasonably accurate
prediction.

11.

Premachandran
B, Balaji C
(2006).

Conjugate mixed
convection with surface
radiation from a
horizontal channel with
protruding heat sources.

Numerical

The non-dimensional
temperature decreases
non-linearly as the
Reynolds number
increases.

12.

Sawant S M,
Gururaja C R
(2008).

Conjugate mixed
convection with surface
radiation from a
electronic board with
multiple discrete
sources.

Numerical

To undermine
buoyancy (free
convection
component) here
would over estimate
the peak temperature
attained by the
board.

13.

Alahyari Beig S,
Mirzakhalili E,
Kowsari F
(2011).

Investigation of optimal
position of a vortex
generator in a blocked
channel for heat transfer
enhancement of
electronic chips.

Numerical

The optimal
locations of
triangular bar for
different value of
Reynolds number are
almost the same.

14.

Ahammad Basha
D, Prasanna S,
Venkateshen S P
(2012).

Mixed convection from

an upward facing
horizontal flat plate
effect of conduction and
radiation.

Experimental

For small
Ri(Richardson
no.=GrL/Re2), the
contribution of
radiation to total heat
transfer reduces.

RESEARCH FINDINGS

A survey of the above papers reveals that analytical

investigation on electronic chip has been made assuming the
buoyancy effect in it.
A coupled conduction-convection problem which can account
for non-uniform heat transfer coefficient is too difficult to
solve analytically because of its complex mathematical
formulation.
A series of numerical and experimental work has also been
done on horizontal setup with or without vortex generator till
date but simultaneous heat transfer analysis of mixed flow
with vortex generator on vertical setup is almost absent.
Review of these literatures unveils the fact that simultaneous
heat transfer has been studied for a limited case.

The investigative work of Alahyari Beig et al. (2011) is

reported where optimal position of a vortex generator in a
blocked channel for heat transfer enhancement of electronic
chips has been studied. Moreover, they kept the setup
horizontally, thus for vertical setup necessitates better
mathematical description of heat transport and fluid flow
phenomena.

CONCLUSION
Since mixed convective heat transfer in cooling of electronic
chip is significant and is not attempted by many with vortex
generator on vertical setup , there will be a lot of opportunities
in the near future to develop and upgrade the studies.

PLANED TO ORGANIZE

To simulate the problem described above, it is planned to

organize the study in the following way:
Journal paper analysis
Physical and mathematical modeling of the problem from
05/10/2015 to 14/12/2015.
Simulation of the computer code for a range of parameters
from 15/12/2015 to 15/02/2016.
Experimental work from 16/02/2016 to 16/03/2016.
Explanation of results and thesis writing during rest of the
period.

REFERENCES

1. Braaten M E, Patankar S V (1985). Analysis of laminar mixed convection in shrouded

array of heated rectangular blocks. Int. J. Heat Mass Transfer. Vol. 28, Pg. 1699-1709.
2.Kamiski D A, Prakash C (1986). Conjugate natural convection in a square enclosure;
effect of conduction in one of the vertical walls. Int. J. Heat Mass Transfer. Vol. 29,
Pg. 1979-1988.
3. Davalath J, Bayazitoglu Y (1987). Forced convection cooling across rectangular
blocks. ASME J. Heat Transfer. Vol. 109, Pg. 321-328.
4. Seo Young Kim, Hyung Jin Sung, Jae Min Hyun (1992). Mixed convection from
multiple layered boards with cross-stream wise periodic boundary conditions. Int. J.
Heat Transfer, Vol. 35, Pg 2941-2952.
5. Molki M, Faghri M, Ozbay O (1995). A correlation for heat transfer and wake effect in
the entrance region of an in line array of rectangular block simulating electronic
components. ASME J Heat Transfer. Vol. 117, Pg. 40-46.
6. Jubran B A, Swiety S A, Hamdan M A (1995). Convective heat transfer and pressure
drop characteristics of various array configurations to simulate the cooling of
electronic modules. Int. J. Heat Mass Transfer. Vol. 39, Pg. 3519-3529.
7. Young T J, Vafai K (1998). Convection cooling of a heated obstacle in a channel. Int.
J. Heat Mass Transfer. Vol. 41, Pg. 3131-3148.

8. Kim S Y , Kang B H (1998). Forced convection heat transfer from two heated
blocks in pulsating channel flow. Int. J. Heat Mass Transfer. Vol. 41, Pg. 625-634.
9. Young T J, Vafai K (1999). Experimental and Numerical Investigation of forced
convection characteristics of arrays of channel mounted obstacles. ASME J. Heat
Transfer. Vol. 121, Pg. 34-42.
10. Premachandra B, Balaji C (2005). Mixed convection heat transfer from a horizontal
channel with protruding heat source. Heat Mass Transfer. Vol.41, Pg.510-518.
11. Premachandran B, Balaji C (2006). Conjugate mixed convection with surface
radiation from a horizontal channel with protruding heat sources. Int. J. Heat Mass
Transfer. Vol. 49, Pg. 3568-3582.
12. Sawant S M, Gururaja C R (2008). Conjugate mixed convection with surface
radiation from a electronic board with multiple discrete sources. Heat Mass
Transfer. Vol. 44, Pg. 1485-1495.
13. Alahyari Beig S, Mirzakhalili E, Kowsari F (2011). Investigation of optimal
position of a vortex generator in a blocked channel for heat transfer enhancement of
electronic chips. Int. J. Heat Mass Transfer. Vol. 54, Pg. 4317-4324.
14. Ahammad Basha D, Prasanna S, Venkateshen S P (2012). Mixed convection from
an upward facing horizontal flat plate effect of conduction and radiation. Heat Mass
Transfer.

THANK YOU