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Project guide :

Prof. S.Senthil Kumar,


Asst. Professor
Mechanical department,
ACCET.
Presented by
T arun selva kumar
II ME Manufacturing Engg.

objective
To improve surface properties of the

substrate, such as appearance, adhesion,


wetability, corrosion resistance, wear
resistance, and scratch resistance and heat
transfer.

This objective arises from the


industrial need of reducing machining
time and consumption of lubricants,
in order to reduce machining costs,
environmental impact and health
risks for the operators, improve the
die life of tool.

A comparative study on the structure and properties of nanolayered


TiN/NbN and TiAlN/TiN multilayer coatings prepared by reactive direct
current magnetron sputtering.
Harish C. Barshilia a,*, K.S. Rajam a, Anjana Jain b, K. Gopinadhan c,
Sujeet Chaudhary c
I.

Nanolayered multilayer coatings of TiN/NbN and TiAlN/TiN were deposited on Si (100) substrates at various
modulation wavelengths (i.e.bilayer thickness, K) using a reactive direct current magnetron sputtering system

II. Characterized using XRD), X-ray reflectivity, nano indentation tester and micro-Raman spectroscopy.
III. TiN/NbN and TiAlN/TiN multilayer showed maximum nano indentation hardness values of 4000 and 3750

kg/mm2, respectively.

IV. DC bias of -850 V was applied to the substrate at an argon pressure of 6.0x10^-1 Pa. TiAlN films were prepared

from reactive sputtering of a TiAl (50 : 50) composite target in Ar+N2 plasma operated at a pressure of 2.0x10^-1
Pa.
V. Typical deposition conditions for TiN were: sputtering power=225W, substrate bias=200 V,

current density on the substrate=1.1 mA/cm2, flow rate of nitrogen=2.5 sccm and
operating pressure=0.4 Pa. For TiAlN coatings also similar deposition conditions were used
and the sputtering was carried out using a TiAl (50: 50) target.

Characterization of reactive DC magnetron sputtered TiAlN thin films.


B. Subramanian*1, K. Ashok1, P. Kuppusami2, C. Sanjeeviraja3, and M. Jayachandran1

A.

B.

C.

Thin films of about 1m Titanium Aluminum Nitride (TiAlN) were deposited onto mild steel substrates by
reactive direct current (DC) magnetron sputtering using a target consisting of equal segments of titanium and
aluminum.
The layers of TiAlN were deposited on well-cleaned mild steel (MS) substrates using a DC magnetron
sputter deposition unit HIND HIVAC.The base vacuum of the chamber was below 10-6 Torr and the
substrate temperature was kept at 400C. High purity argon was fed into the vacuum chamber for the
plasma generation.The substrates were etched for 5 min at a DC power of 50 W and an argon
pressure of 10mTorr(1.33Pa).
Micro hardness of the films on mild steel was evaluated by using a DM-400

introduction
Surface coating is one of the most useful and

economical way to improve the surface


properties of the metals. The aim of this work
is the development and characterization of
innovative ceramic coatings for cutting tools
with high wear resistance properties at high
temperatures.

Technical review: materials science, tool coatings and machining processes


Somebasic considerations in metal cutting
Workpiece mechanical properties and heat generation during machining
Tool failure mechanisms
Coatings enlarge the tool safe zone in operation
Coating properties and control by PVD process
Matching the coating tothe application
Coating properties greatly determine the tool response to the wear
environment.

What ? How ? Where ?


Titanium nitride ?
Physical vapour deposition using sputtering ?
In mild steels like MS 420 ?

Titanium nitride, it is deposited by PVD, has the


following properties:
- high hardness (2500 - 3000 HV)
compared high speed steel;
- good abrasion resistance and low
coefficient of friction;
- corrosion resistance and stable chemical
properties at high temperatures;
- low solubility in steel just below 1350C;
- high thermal conductivity and high
melting temperature (2950C) than high
speed steel (1250 -1300C).

Vacuum Evaporation
Reactive Evaporation
Electron Beam Evaporation
Sputtering
Molecular Beam Evaporation
Hot wall Vacuum Evaporation
Pulsed Laser Deposition

Why sputtering ?
Sputtering can get better uniformity over a large
size (from larger targets).
There can be tighter (and easier) control over
alloy
composition.
Pre-surface sputter cleaning of surface and
deposition/ etching processes to control uniformity
are possible.
CON: Certain sputtering systems (glow discharge
plasmas) require a medium level vacuum that can
increase contamination over evaporation!

What is sputtering ?

The impact of an atom or ion on a surface produces


sputtering from the surface as a result of the momentum
transfer from the in-coming particle. Unlike many other
vapour phase techniques there is no melting of the material.

What to be analysed?
wear resistance,
corrosion resistance

Thank you

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