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objective
To improve surface properties of the
Nanolayered multilayer coatings of TiN/NbN and TiAlN/TiN were deposited on Si (100) substrates at various
modulation wavelengths (i.e.bilayer thickness, K) using a reactive direct current magnetron sputtering system
II. Characterized using XRD), X-ray reflectivity, nano indentation tester and micro-Raman spectroscopy.
III. TiN/NbN and TiAlN/TiN multilayer showed maximum nano indentation hardness values of 4000 and 3750
kg/mm2, respectively.
IV. DC bias of -850 V was applied to the substrate at an argon pressure of 6.0x10^-1 Pa. TiAlN films were prepared
from reactive sputtering of a TiAl (50 : 50) composite target in Ar+N2 plasma operated at a pressure of 2.0x10^-1
Pa.
V. Typical deposition conditions for TiN were: sputtering power=225W, substrate bias=200 V,
current density on the substrate=1.1 mA/cm2, flow rate of nitrogen=2.5 sccm and
operating pressure=0.4 Pa. For TiAlN coatings also similar deposition conditions were used
and the sputtering was carried out using a TiAl (50: 50) target.
A.
B.
C.
Thin films of about 1m Titanium Aluminum Nitride (TiAlN) were deposited onto mild steel substrates by
reactive direct current (DC) magnetron sputtering using a target consisting of equal segments of titanium and
aluminum.
The layers of TiAlN were deposited on well-cleaned mild steel (MS) substrates using a DC magnetron
sputter deposition unit HIND HIVAC.The base vacuum of the chamber was below 10-6 Torr and the
substrate temperature was kept at 400C. High purity argon was fed into the vacuum chamber for the
plasma generation.The substrates were etched for 5 min at a DC power of 50 W and an argon
pressure of 10mTorr(1.33Pa).
Micro hardness of the films on mild steel was evaluated by using a DM-400
introduction
Surface coating is one of the most useful and
Vacuum Evaporation
Reactive Evaporation
Electron Beam Evaporation
Sputtering
Molecular Beam Evaporation
Hot wall Vacuum Evaporation
Pulsed Laser Deposition
Why sputtering ?
Sputtering can get better uniformity over a large
size (from larger targets).
There can be tighter (and easier) control over
alloy
composition.
Pre-surface sputter cleaning of surface and
deposition/ etching processes to control uniformity
are possible.
CON: Certain sputtering systems (glow discharge
plasmas) require a medium level vacuum that can
increase contamination over evaporation!
What is sputtering ?
What to be analysed?
wear resistance,
corrosion resistance
Thank you