PRINTED CIRCUIT

BOARD
PRESENTED BY
RUBY KUMARI
B.SC(MATHS),B.E(ECE)

What is PCB?

PCB is an acronym for Printed Circuit Board.

Printed Circuit Board is a plate used for placing the different
elements that conform an electrical circuits that contains the
electrical interconnection between them.
It is a board that has lines and pads that connects various points
together.

Why PCB?

Before printed circuits became the common component used in

electronics, Point to point construction was used.
This means some bulky and unreliable designs that required large
sockets and regular replacement.
Most of these issues were directly addressed when PCB went into
direct production.
Pcbs are rugged, inexpensive and can be highly reliable.
Mass manufacturing .
Professional.
Reduced space and time.
Bulky construction

History of PCB

The first Printed Circuit Board can be traced all the back on early
1900 and a patent for Printed wire.
In 1925 that Charles Ducas first submitted a patent that involved
creating an electrical path directly on an insulated surface.
It was a revolutionary idea because it could eliminate complex
wiring and provide consistent results.
Still, they didnt really catch on until after WWII, when Dr. Paul
Eisler in Austria began making the first real operational printed
circuit boards in 1943.

BASIC PCB CLASSIFICATION

PCBs may be classified in many different ways according to their

various attributes. One fundamental structure common to all of them is
that they must provide electrical conductor paths that interconnect
components to be mounted on them.
There are two basic ways to form these conductors:
Subtractive.In the subtractive process, the unwanted portion of the
copper foil on the base substrate is etched away, leaving the desired
conductor pattern in place.
Additive.In the additive process, formation of the conductor pattern is
accomplished by adding copper to a bare (no copper foil) substrate in
the pattern and places desired. This can be done by plating copper,
screening conductive paste, or laying down insulating wire onto the
substrate on the predetermined conductor paths.
The PCB classifications given in next slide take into consideration all
these factors, i.e., fabrication processes as well as substrate materials.

PCB CLASSIFICATION

Description of each column of

last slide

Column 1 shows the classification of PCBs by

nature of the substrate.
Column 2 shows the classification of PCBs by
way the conductor pattern is imaged.
Column 3 shows the classification of PCBs by
physical nature.
Column 4 shows the classification of PCBs by
method of conductor formation.
Column 5 shows the classification of PCBs by
number of conductor layers.
Column 6 shows the classification of PCBs...

the
the
their
the
the

Types of PCB

Single sided PCB.

Double sided PCB.

Multilayer PCB.

Rigid flex PCB.

Flexible PCB.

High frequency PCB.

Low frequency pcb

Single sided PCB Images.

compo
nent
Conducting wires or
traces.
Populated PCB or assembled single sided pcb

Single sided PCB without assembly or single

sided bare board

Few points about single sided

PCB

For single sided PCB, the components are on one side, conducting
wires are on other sides as shown in image of previous slide.
Single sided PCB is the most simple and basic PCB.

With the appearance of electronic transistor, single side PCB was

developed in the early 1950,which is mainly manufactured in
U.S.A.

In 1956 single sided PCB technology was made big progress with
the appearance of professional PCB manufacturer from Japan.

The raw material for manufacturing single sided PCB include

FR1,CEM1,CEM3,FR4.

Double sided PCB

Top side
Bottom side

Few points about double side

board

For double sided board components can be on both the sides(Top

& Bottom).conducting wires can be on both the sides.
Double sided board means the conductor patterns appear on both
sides of the board.
However if we use the conductor patterns on both sides, there
should be proper circuit to connect two sides.
The bridge between the circuits is called via.
Those vias are plated with metal, such as tin, copper, gold, etc.
Because the area of double sided PCB is two fold of the area of
single sided, and the conductor pattern can cross with each other,
so it suits to be used on more complex circuits.
Double sidedPcbboards are a common tool in both production
and prototype circuits. They allow a higher density in components
and make laying of tracks an easier process.

Few points about Double sided

Board continue...

Same as a regularcircuit board, Double sided boards are made with a

substrate of non conductive material, over which a layer of copper is
placed on top of it, and in the case of double sided boards, the copper is
also layered on the bottom side of the substrate.

As with any type of circuit board, there are advantages to the use of
one type over another.
Double sided boards, as I said earlier, allow a higher density of
component. This is because you have a whole extra layer where you
can add tracks to connect the components, freeing space on the
other to place the components closer together or add extra

connections for IC with high pin counts .

Another advantage of using double sided boards is the increased
heat dissipation that an extra layer of copper provides, this can be
achieved in the etching process, only removing enough copper to
create the tracks, leaving the extra copper instead of removing it
completely.

When to use double sided board

The decision to use double sided boards needs to be considered

very carefully, because of the added complexity in production and
handling of the finished board, as well as the costs associated can
make using a double sided board a sub optimal choice to use in an
electronic circuit project.
The biggest consideration is manufacturing costs, because most
manufacturers will charge extra setup fees for processing the
extra side, not only on etching and soldermask, but also on
component layouts added in the silkscreen process.
Other added expenses could derive from the design process itself,
since several additional design considerations must be taken into
account to ensure proper functioning of the finished product, such
as inductive losses and parasitic capacitance affecting the
performance of analog and high speed digital circuits.
If after these considerations using a double sided circuit board is
the right choice, then the advantages will really help your finished
circuit stand out and be more functional.

Multilayer PCB

Few points about Multilayer

PCB
In order to enlarge the area of conductor pattern, multilayer PCB uses more
single or double boards. It uses several piece of double sided boards, and a
dielectric layer is put between every layer of boards. The layers of one PCB
represent the layer of conductor patterns. The amount of the layers is always
even number. Technically we can make PCBs up to 100 layers.
For via, if we use it on double sided PCB, the whole boards will be drilled. While
on multilayer PCB, if you just want to connect some traces, via may will waste
trace space of some layers. Then we use buried vias and blind vias to solve
this problem, because they are only drilled through several layers.
a.Buried vias only connect inner PCBs, so we cant see them from the surface.
b.Blind vias connects several layers PCB with surface PCB.
In multilayer PCB, the whole board directly connects the ground line and power
(used for preventing affection of the transmission signals on the signal). So we
divide layers into signal, power, or ground. If the components on PCB need
different power supply, this kind of PCB would have more than two layers of
power and wire layers.

Rigid flex PCB

Few points about Rigid flex

pcb

Rigid Flex circuits gives the ability to design your circuitry to fit
the device, instead of building a device to fit the circuit board.

Rigid Flex circuits are designed for the rigors of aerospace,

medical and military applications, with dependable reliability.
Flex assemblies have the ability to be folded or creased and
positioned into the smallest areas makes miniaturization of
many devices possible, while offering a substantial weight
reduction

Flexible PCB

Each type of flex circuit offers different advantages. While some

types of flex circuits can offer lower production costs, others have
additional increased functionality.

Flex and Rigid-Flex circuits gives the ability to design your

circuitry to fit the device, instead of building a device to fit the
circuit board. They are designed for the rigors of aerospace,
medical and military applications, with dependable reliability.

Flex &Rigid Flex PCB

Benifits

Flex and Rigid-Flex circuits gives the ability to design your

circuitry to fit the device, instead of building a device to fit the
circuit board. They are designed for the rigors of aerospace,
medical and military applications, with dependable reliability.

Flex circuits offer multiple advantages for anyone considering

to use this technology in a future project or if youre trying to
decide on re-engineering your current design. Below you will
find some key benefits of using flex and rigid-flex circuit
technology.

Flexible circuit boards fit where no other solutions can.

Flex PCB Benifits

Flexible circuit boards are thin and light weight which enables a
substantial packaging size reduction.

They have the ability to be folded or creased and positioned into the
smallest areas makes miniaturization of many devices possible.

Space requirements can be minimized by applying the freedom of 3D

packaging geometry.

Utilizing a flex circuit solution into your design can offer a substantial
weight reduction benefit over using wires and wire harnesses.

Flexible circuits can be used to replace wiring reduces the errors

common in hand wired assemblies.

High Frequency PCB

Few points about High

Frequency PCB

The increasing complexity of electronic components and switches

continually requires faster signal flow rates, and thushigher
transmission frequencies. Because of short pulse rise times in
electronic components, it has also become necessary forhigh
frequency (HF) technologyto viewconductor widths as an
electronic component.

Depending on various parameters,HF signalsare reflected on

circuit board, meaning that the impedance(dynamic resistance)
varies with respect to the sending component. To prevent such
capacitive effects, allparametersmust be exactly specified, and
implemented with the highest level ofprocess control.

Critical for theimpedancesinhigh frequency circuit boardsare

principally the conductor trace geometry, the layer buildup, and the
dielectric constant (er) of the materials used.

Low Frequency PCB

Types of components used in PCB

In recent years, semiconductor packaging has evolved with an

increased demand for greater functionality, smaller size, and
added utility. A modern PCBA design hastwo main methods for
mounting components onto a PCB:Through-Hole
MountingandSurface Mounting.

Through hole Mounting

Explanation of Through Hole

PCB

Through-hole mounting is the process by which component leads are placed

into drilled holes on a bare PCB. The process was standard practice until the
rise of surface mount technology (SMT) in the 1980s, at which time it was
expected to completely phase out through-hole. Yet, despite a severe drop in
popularity over the years, through-hole technology has proven resilient in the
age of SMT, offering a number of advantages and niche applications: namely,
reliability.

Through-hole components are best used for high-reliability products that

require stronger connections between layers. Whereas SMT components
are secured only by solder on the surface of the board, through-hole
component leads run through the board, allowing the components to
withstand more environmental stress. This is why through-hole
technology is commonly used in military and aerospace products that
may experience extreme accelerations, collisions, or high temperatures.
Through-hole technology is also useful in test and prototyping
applications that sometimes require manual adjustments and
replacements.

Axial vs Radial Lead component

There are two types of through-hole components:AxialandRadiallead

components. Axial leads run through a component in a straight line
("axially"), with each end of the lead wire exiting the component on
either end. Both ends are then placed through two separate holes in the
board, allowing the component to fit closer, flatter fit. Radial lead
components, on the other hand, protrude from the board, as its leads
are located on one side of the component .

Both through-hole component types are "twin" lead components,

and both have their distinct advantages. While axial lead
components are used for their snugness to the board, radial
leads occupy less surface area, making them better for high
density boards. Generally, axial lead configuration may come in
the form of carbon resistors, electrolytic capacitors, fuses, and
light-emitting diodes (LEDs). Radial lead components are
available as ceramic disk capacitors.

Advantage & Disadvantage of

TH

Advantages:THM provides stronger mechanical bonds than SMT,

making through-hole ideal for components thatmight undergo
mechanical stress, such as connectors or transformers.Good for test
and prototyping.
Disadvantages:On the bare PCB side, THM requires the drilling holes,
which isexpensive and time consuming. THM also limits the available
routing area on any multilayer boards, because the drilled holes must pass
through all the PCBs layers. On the assembly side, component placement
rates for THM are a fraction of surface mount placement rates, making
THM prohibitively expensive. Further, THM requires the use of wave,
selective, or hand-soldering techniques, which are much less reliable and
repeatable than reflow ovens used for surface mount. Most of all, throughhole technology requires soldering on both sides of the board, as opposed
to surface-mounts, which only -- for the most part -- require attention to
one side of the board.

SMT

SMT the process by which components are mounted directly onto the
surface of the PCB. Known originally as planar mounting, the
method was developed in the 1960s and has grown increasingly
popular since the 1980s. Nowadays, virtually all electronic hardware
is manufactured using SMT. It has become essential to PCB design and
manufacturing, having improved the quality and performance of PCBs
overall, and has reduced the costs of processing and handling greatly .

The key differences between SMT and through-hole mounting

are
(a) SMT does not require holes to be drilled through a
PCB,
(b) SMT components are much smaller, and
(c) SMT components can be mounted on both side of the
board.

Glossary of PCB starts with

letter A
Active component1. A component which adds energy to the
signal it passes. 2. A device that requires an external source of
power to operate upon its input signal(s). 3. Any device that
switches or amplifies by the application of low-level signals.
Examplesof active devices which fit one or more of the above
definitions: transistors, rectifiers, diodes, amplifiers, oscillators,
mechanical relays and almost all IC's
Analog circuit A circuit in which the output varies as a
continuous function of the input, as contrasted with digital circuit.
Anode1. The positive element such as the plate of a vacuum
tube; the element to which the principal stream of electrons flows.
2. In a cathode-ray tube, the electrodes connected to a source of
positive potential. These anodes are used to concentrate and
accelerate the electron beam for focusing.

 Aperture1.

An indexed shape with a specified x and y dimension, or line-type

with a specified width, used as a basic element or object by a photoplotter in
plotting geometric patterns on film. The index of theapertureis its Position(a
number used in an aperture list to identify an aperture) or D code.
2. A small, thin, trapezoidal piece of plastic used to limit and shape a light source
for plotting light patterns on film, and mounted in a mechanical disk called an "
aperture wheel" which in turn is mounted on the lamp head of a vector
photoplotter. Anapertureis mostly opaque, but with a transparent portion that
controls the size and shape of the light pattern. A vector photoplotter plots images
from a CADdatabase on photographic film in a darkroom by drawing each line
with a continuous lamp shined through an annular-ringaperture, and creating
each shape (or pad) by flashingthe lamp through a specially sized and
shapedaperture.
3. A line of textual data in anaperturelist describing the index names (D code and
position), the shape, the usage (flash or draw) and the X and Y dimensions of
anaperture. Some aperture lists leave out certain of those types of data. For
example, laser photoplotters don't need to know whether an aperture is a flash or
draw, so a modern-day aperture list might leave that datum out.

 Aperture list1. An ASCII textdata file which describes the size and shape of the
apertures used by a photoplotter for any one photoplot. 2. A print-out of this file. 3. A
binary version of this file. [Also called "aperture table."]

Aperture wheelA component of a Vector photoplotter, it is a metal

disk having cut-outs with brackets and screw holes arranged near its rim
for attaching apertures. Its center hole is attached to a motorized
spindle on the lamp head of the photoplotter. When a D codedenoting a
particular position on the wheel is retreived from a Gerber Fileby the
photoplotter, the wheel is caused to rotate so that the aperture in that
position is placed between the lamp and the film.
In preparation for a photoplotting, the aperture wheel is set up by a
technician who reads a printed aperture list, selects the correct aperture
from a set of them stored in a box with compartments and, using a small
screw driver, installs the aperture onto the position on the wheel which is
called for on the list. This process is subject to human error and is one of
the disadvantages of vector photoplotters as compared with laser
photoplotter.

ArtworkArtwork for printed circuit design is photoplotted film (or merely

the Gerber files used to drive the photoplotter), NC Drill file and
documentation which are all used by a board house to manufacture a bare
printed circuit board.

Assembly1. The process of positioning and soldering components to a

PCB 2. Act or process of fitting together parts to make a whole. .
AWGAmerican Wire Gauge. A PCB Designer needs to know diameters of
wire gauges to properly size E-Pads.The American Wire Gauge, formerly
known as the Brown and Sharpe (B + S) Gauge, originated in the wire
drawing industry. The gauge is calculated so that the next largest diameter
always has a cross-sectional area that is 26% greater.
Assembly houseA manufacturing facility for attaching and soldering
components to a printed circuit.

Ball grid array(Abbrev. BGA). A flip- chiptype of package in which the

internal dieterminals form a grid-style array, and are in contact with solder
balls ( solder bumps), which carry the electrical connection to the outside of the
package. ThePCB footprintwill have round landing pads to which the solder
balls will be soldered when the package and PCB are heated in a reflow oven.
Advantages of theball grid arraypackage are
(1) that its size is compact and
(2) its leads do not get damaged in handling (unlike the formed "gull-wing"
leads of a QFP' ) and thus has a long shelf life.
Disadvantages of theBGAare 1) they, or their solder joints, are subject to
stress-related failure. For example, the intense vibration of rocket-powered
space vehicles can pop them right off the PCB, 2) they can not be handsoldered (they require a reflow oven), making first-article prototypes a bit more
expensive tostuff, 3) except for the outer rows, the solder joints can not be
visually inspected and 4) they are difficult to rework.

BaseThe electrode of a transistor which controls the movements of electrons

or holesby means of an electric field on it. It is the element which corresponds
to the control grid of an electron tube .

Boardprinted circuit board. Also, a CAD database which represents the layout
of a printed circuit.

BOM[pronounced "bomb"]Bill of Materials. A list of components to

be included on an assembly such as a printed circuit board. For a
PCB theBOMmust includereference designatorfor the components
used and descriptions which uniquely identify each component.
ABOMis used for ordering parts and, along with anassembly
drawing, directing which parts go where when the board isstuffed.

BodyThe portion of an electronic component exclusive of its pins or

leads.

Aided Design. A system where engineers create a design and

see the proposed product in front of them on a graphics screen or in the form
of a computer printout or plot. In electronics, the result would be a printed
circuit layout.
CADCAMSimply a concatenation of the two termsCADand CAM.
CAEComputer Assisted Engineering. In electronics work, CAE refers to
schematic software packages.
CAFConductive Anodic Filamentation (or Conductive Anodic Filament
growth) - An electrical short which occurs in PCBswhen a conductive filament
forms in the laminate dielectric material between two adjacent conductors
under an electrical bias.CAFis a potentially dangerous source of electrical
failure in the PCB. As PCB designs have increased in density, with hole-tohole spacings reduced to 25milsor less,CAFhas become an everyday
concern.
CAMComputer Aided Manufacturing.

CADComputer

CAM files CAM means Computer Aided Manufacturing. These

are the data files used directly in the manufacture of printed
wiring. . The types ofCAM filesare
1) Gerber file, which controls a photoplotter,
2) NC Drill file, which controls an NC Drill machine and
3) fab and assembly drawings in soft form (pen-plotter files).
CAM files represent the valuable final product of PCB design.
They are handed off to the board house which further refines and
manipulates CAM data in their processes, for example in stepand-repeat panelization. Some PCB design software companies
refer to all plotter or printer files asCAM files, although some of
the plots may be check plots which are not used in manufacture.
Cardanother name for a printed circuit board.

CaptureExtract information automatically through the use of

software, as opposed to hand-entering of data into a computer file.
Cathode1. In an electron tube the electrode through which a
primary source of electrons enters the interelectrode space.
2. General name for any negative electrode.
3. When a semiconductor diode is biased in the forward direction, that
terminal of the diode which is negative with respect to the other
terminal.
4. In electrolytic plating, the workpiece being plated.

CBGACeramic Ball Grid Array.

CEM-1ANEMAgrade of industrial laminate having a substrate of
woven glass surfaces over a cellulose paper core and a resin binder of
epoxy. It has good electrical and mechanical properties, somewhat
surpassed by those ofFR-4.

Chip-on-boardAbbreviated COB. In this technology iniegrated circuit,

small portions of silicon wafers, are glued andwire bondeddirectly to
printed circuit boards instead of first being packaged. The electronics for
many mass-produced toys areembededby this system, which can be
identified by the black glob of plastic sitting on the board. Underneath that
glob (technical term:glob top), is a chip with fine wires bonded to both it
and the landing pads on the board.

CladA copper object on a printed circuit board. Specifying certain text

items for a board to be "in clad" means that the text should be made of
copper, notsilkscreen
Collector1. An electrode in a transistor that collects electrons or holes.
2. In certain electron tubes, an electrode to which electrons or ions flow
after they have completed their function.

Component library A representation of components as decals,

stored in a computer data file which can be accessed by a PCB CAD
program.
ConnectionOne leg of anet. Also called a "pin pair" (PADS) and
"from-to" (Protel).
ConnectivityThe intelligence inherent in PCB CAD software which
maintains the correct connections between pins of components as
defined by the schematic.

ConnectorA plug or receptacle which can be easily joined to or

separated from its mate. Multiple-contact connectors join two or
more conductors with others in one mechanical assembly.

E-pad"Engineering-pad." A plated-through hole or surface mount

pad on a PCB placed on the board for the purpose of attaching a wire
by soldering. These are usually labeled with silkscreen.E-padsare
used to facilitate proto-typing, or simply because wires are used for
interconnections instead ofheadersorterminal block.
ECLEmitter Coupled Logic. A type ofunsaturatedperformed by
emitter-coupled transistors. Higher speeds may be achieved with ECL
than are obtainable with standard logic circuits.ECLis costly, power
hungry, and difficult to use, but it is four times faster thanTTL.
Electrical Object[Protel]A graphical object (in a PCB or
schematic database) to which an electrical connection can be made,
such as a component pin or a wire.
EmitterAn electrode on a transistor from which a flow of electrons
orholesenters the region between the electrodes.

EMCelectromagnetic compatibility. (1) The ability of electronic equipment

to operate without degradation in an intended electromagnetic environment
(2) The ability of equipment to operate in its electromagnetic environment
without creating interference with other devices.
. End-to-end designa version ofCADCAMCAEin which the software
packages used and their inputs and outputs are integrated with each other
and allow design to flow smoothly with no manual intervention necessary
(other than a few keystrokes or menu selections) to get from one step to the
other. Flow can occur in both directions. In the field of PCB design,end-to-end
designsometimes refers to only the electronic schematic/pcb layout
interface, but this is a narrow view of the potentialities of the concept. For
example, end-to-end systems can also implement electronic circuit
simulation, parts procurement and beyond.
ExcellonNC Drill file format. An ASCII format used in a file which drives an
NC Drillmachine. The earliest NC Drill machines were made by Excellon
Automation Company. The format is in broad use, although the company has
been sold.

FabShort for fabrication.

Fabrication drawingA drawing used to aid the construction of a
printed board. It shows all of the locations of the holes to be drilled,
their sizes and tolerances, dimensions of the board edges, and notes
on the materials and methods to be used. Called "fab drawing" for
short. It relates the board edge to at least on hole location as a
reference point so that the NC Drill file can be properly lined up.
FCFlexible Circuit, flexible circuitry, flexcircuit or flex circuit.
Fine line designPrinted circuit design permitting two (rarely
three) traces between adjacent DIPpins. It entails the use of a either
dry film solder mask or liquid photoimageable solder mask (LPI), both
of which are more accurate than wet solder mask.
Fine pitchRefers to chip packages with lead pitches below 0.050".
The largest pitch in this class of parts is 0.8mm, or about 0.031". Lead
pitches as small as 0.5mm (0.020") are used.

FingerA gold-plated terminal of a card-edge connector.

Flash1.v.To turn a vector photoplotterlamp on for a brief but
precise duration and then off, during which time the relative
positions of the lamp and film remain fixed. This exposes the film
with the image of a small object (the size and shape of which is
controlled by the transparent portion of an aperture). 2.n.A
small image on film created in such wise or as directed by a
command in a Gerber file.) The maximum size (x or y
dimension)for aflashvaries from one photoplotting shop to
another, but is commonly inch.
Flexible circuitryAn array of conductors bonded to a thin,
flexible dielectric. It has the unique property of being a threedimensional circuit that can be shaped in multiplanar
configurations, rigidized in specific areas, and molded to backer
boards for specific applications. As an interconnect, the main
advantages of flex over traditional cabling are greater reliability,
size and weight reduction, elimination of mechanical connectors,
elimination of wiring errors, increased impedance control and
signal quality, circuit simplification, greater operating temperature

Flip-chipA mounting approach in which thechipis inverted and connected

directly to the substrate rather than using the more common wire
bondingtechnique.Examplesof this kind of flip-chip mounting arebeam
leadandsolder bump.
First articleA sample part or assembly manufactured prior to the start of
production for the purpose of ensuring that the manufacturer is capable of
manufacturing a product which will meet the requirements.
Footprint1. The pattern and space on a board taken up by a component.

FPCFlexible Printed Circuit,

FR-1A low-grade version of FR-2.
FR-2A NEMAgrade of Flame-Retardant industrial laminate having a substrate
of paper and a resin binder of phenolic. It is suitable for printed circuit board
laminate and cheaper than the woven glass fabrics such as FR-4.

FR-4ANEMAgrade of Flame-Retardent industrial laminate

having a substrate of woven-glass fabric and resin binder of
epoxy.FR-4is the most common dielectric material used in
the construction of PCBs in the USA. Itsdielectric constantis
from 4.4 to 5.2 at below-microwave frequencies. As frequency
climbs over 1 GHz, the dielectric constant ofFR-4gradually
drops.

FR-6 Fire-Retardant glass-and-polyester substrate material

for electronic circuits. Inexpensive; popular for automobile
electronics. [Stammtisch Beau Fleuve Acronyms .

Gerber fileASCII data file used to control aphotoplotter.

Named after H. Joseph Gerber, founder of Gerber Scientific Co.,
who invented the originalvector photoplotter.
HeaderThe portion of a connector assembly which is mounted
on a printed circuit.
HoleIn a semiconductor, the term used to describe the absence
of an electron; has the same electrical properties as an electron
except that it carries a positive charge.
Integrated circuit1)miniaturized electronic circuit that has
been manufactured as achip(die). 2)A packaged chip.
IPCThe Institute for Interconnecting and Packaging Electronic
Circuits, the final American authority on how to design and
manufacture printed wiring. In 1999, IPC changed its name from
Institute of Interconnecting and Packaging Electronic Circuits to
IPC. The new name is accompanied with an identity statement,
Association Connecting Electronics Industries.

MELF (Metal Electrode Face Bonded):Consisting of two

terminals bonded to a cylindrical body, these SMD components
are less expensive than flat chips but require special handing
during assembly. Furthermore, one of their biggest disadvantages
is their tendency to roll off solder pads during assembly. Generally
speaking, they come in the form of diodes, resistors, and
capacitors.

SOT Transistors and Diodes:These are usually

rectangular and easy to place, thoughthey're a bit
outdated. The most common SOTs are SOT 23, SOT 89, SOT
143, and SOT 223. Its most common packaging is tape &
reel.

Small outline Integrated Circuit (SOIC) These are

good SMT alternatives totheduel in-line package (DIP), due
to their dramatically reduced size. In general, they take up
30 50% less space and 70% less thickness than an
average DIP.

Thin Small Outline Package (TSOP) TSOPs are low

profile packages with fine-pitch leads. TSOPs are typically
meant to accommodate large silicon chips in high density
packages (RAM or flash memory ICs), largely because of
their low volume/high pin count.

Plastic Leaded Chip Carrier (PLCC)- Connections are

made on all four edges of a square package with a
relatively high pin count. PLCCs can have roughly 18 100
leads (usually J-leads). Many of them can fit into IC sockets
and can be easily replaced in the field. PLCCs have long
been a popular option.

Lead-less Chip Carrier (LCC) Not to be confused with

PLCC, LCCs haveno leads. Rather, LCCs are soldered
directly onto PCBs by their (castellation) solder pads. These
are usually designed for Mil Spec because, with no leads to
damage, they're quite "rugged."LCCs are great for high
temperature and aerospace applications.

Quad Flat Pack (QFN) QFNs are high lead

count packages (44 304). Its leads are typically
gull wing. There are many kinds of QFNs, and
they are one of the most common surface-mount
ICs.

Pin Grid Array (PGA) PGAs are typically square or

rectangular, with pins arranged underneath the package.
They're design was highly influential on the now ubiquitous
BGA.

Flip Chip Flip chips are bare die packages, with small
bottom-side solder bumps that act as leads. They are
soldered directly onto the PCB.

Ball Grid Array (BGA) BGAs are perhaps one of the best
performing SMT packages in use today, due to their high
densities. The BGA is a descendent of the PGA, yet instead
of pins, it has solder balls that can be placed directly onto
the PCB. Because of their high density, BGAs are typically
used to house microprocessors.

Advantages:SMT allows for smaller PCB size, higher

component density, and more real estate to work with.
Because fewer drilling holes are required, SMT allows for lower
cost and faster production time. During assembly, SMT
components can be placed at rates of thousandseven tens of
thousandsof placements per hour, versus less than a
thousand for THM. Solder joint formation is much more reliable
and repeatable using programmed reflow ovens versus
through techniques. SMT has proven to be more stable and
better performingin shake and vibration conditions.

Disadvantages:SMT can be unreliable when used as the sole

attachment method for components subject to mechanical stress
(i.e. external devices that are frequently attached or detached).

Difference Between Through hole & surface

Mount

1. As SMC are small in size they take less space in comparison to through

hole.
2. Pin count of component is increased greatly in SMT as compared to old
through hole for example the micro process used today in computers PGA,
FPGA etc.
3. SMC is leadless component and can be directly mounted on board surface
while through hole components required drilling to mount the components.
4. The pads on the surface in SMT are not used for connection of layers on
the printed wiring boards.
5. Size of through hole component is large in comparison to SMC there
component density per unit area is more in through hole component result
in large size of Printed circuit board.

6. In SMT, components can be mounted on both side of PCB, this is not

possible in through hole. Therefore SMC has made application possible
which seems impossible with through hole.

Diference Between through hole and SMT

continued..

8. With the help of SMC higher performance circuit can be

made in small size which is prime requirement today.
9. Soldering of SMC is quite tough through manual
soldering. Hence machines are required therefore big
capital investment is required.
10. Designing, production, skills and technology required in
SMT is very advance as compared to through hole
technology.
11. Through hole technology is basically used in
prototyping.
12. Soldering and de-soldering of through hole component
is easy in comparison to SMT. Hence replacement of
component is easy.

Understanding PCB material and Specification

Understanding PCB Material & Specification

Continued..

When you give a PCB for fabrication, you need to specify

details on PCB materials, impedance controls, finish, copper
thickness and so on. Most of the details are so common
that they are always assumed. However still it is better to
know them.
Previous slide is a screenshot of quotation submitted by a
fabricator for a PCB design of size 9.870 X 9.830 cm
Let us understand each term one by one and things related
to them

Understanding PCB Material &

Specification Continued

1) 4 layers specifies NUMBER OF LAYERS - This means the number

of conducting layers. The layers may be either routing layer or
plane layer. The commonly used no. of layers are 1, 2, 4, 6, 8 and
other even numbered layers. Odd number layer boards may be
formed but they are not standard boards and doesnt offer any
savings. The PCB materials used for 3 or 4 layers would almost be
same.

Routing layers contains tracks while plane layer are

generally used to connect power or ground. Plane layers
have plane of copper from which connections are drawn up
or down wherever needed. Islands can be formed on plane
layers and each island may have different signal. Suppose
some sets of chips on one board use 3.3 V while other use 5
V then the power plane may be partitioned into two islands
of 3.3 V and 5 V.

Understanding PCB Material &

Specification Continued

2) FR4 specifies PCB MATERIAL TYPE FR4 is other name for

Glass reinforced epoxy laminated sheets. It is a commonly
used PCB material. The reasons for its ubiquity as a PCB
material are its high dielectric strength, high mechanical
strength, light weight, resistance to moisture and other
properties conducive for PCB manufacturing. FR in FR4 stands
for fire retardant, another feather in this PCB materials cap.

3) 1.6 mm thick specifies FINISHED BOARD THICKNESS

In multilayer PCB it is thickness after all layers have
been pressed together and all the processes completed.
1.6mm is default thickness for 4 layer board. Go for
higher thickness if you have heavy components on
board to get better strength. Keep an eye on thickness
even when you have high voltages on board.

Understanding PCB Material &

Specification Continued

4) 35 microns copper finish The thickness of copper put on board.

Another popular way to express is in grams or Oz. (Ounces per
square foot) of copper per unit area. X Oz would mean that X
Ounces were spread on the Board material and it was distributed
uniformly over an area of 1 square foot.Go for higher copper
thickness if the current density on board is greater than in average
digital circuits. In normal boards 35 microns is good. Up till a current
of 1A and copper thickness of 1 Oz, track width of 10 mils is safe.
5) No impedance Control When signal transition time is too small
or frequency is too high then tracks may behave as transmission
lines. If unchecked, such tracks may cause significant power loss.
For maximum power to be transferred to other end of track, length
and geometry of the track should be carefully laid taking care of
transmission line equations.
As a rule of thumb, if the board is of FR4 PCB material with copper
tracks and signal rise time is 1 nanosecond then 2 inches is a safe
distance. If the track length exceeds this and signal integrity is
important then consider the transmission line effects also. There are
lot of free programs and excel sheet available on net that calculate

Understanding PCB Material &

Specification Continued

6) No Via Filling Normally vias are not filled and you

clearly see other side of the board through them.
However, they can be filled for various reasons. One need
arises when vias are to be protected from solutions, dust
etc. Vias can also be filled with conducting materials to
increase the current carrying capacity of via. One more
reason is to level the board. Via filling is needed many a
times on boards with BGA (Ball Grid array) components. If
BGA pins make contact with one of the inner layer then
the via cant be placed just underneath the pin because
then the solder may flow in the hole and get connected to
some other layer. So Via filling is done so that solder
doesnt flow in the via and contacts are properly
connected.

Understanding PCB Material &

Specification Continued

7) No gold tabs At any place on the board when

something makes and breaks contact repeatedly then that
area wears out fast. Example is a rubber pushbutton which
has contacts printed on the board. An example is the kind
of buttons used in calculator. This wearing out also happens
when daughter card slot are provided on main board. The
contacts on this slot are rubbed when card is pushed in or
out. In such cases it is wise to put gold layer on the surface
which makes contact. This enhances life of the contact. A
separate step is added in the PCB fabrication process if
gold tabs are specified. Also remember gold is costly.

Understanding PCB Material &

Specification Continued

8) Green gloss (LPISM) soldermask - The first image that would

come to your mind when you think of PCB is a green colour
board with some shining metal contacts and some holes. The
green colour is because of this soldermask. Now why is
soldermask used?? Solder mask prevents spilling of liquid solder.
This spilling has become a serious problem in recent times. As
the pitch of the IC pins has decreased, due to this spilling the
pins get shorted. To feel the miracle of soldermask, try to solder
a board which doesnt have solder mask (mostly a homemade
PCB wont have) and the one which has solder mask. You will feel
a huge difference. This experience made me enjoy soldering
which I hated earlier.
LPISM stands for Liquid Photo imageable solder mask. It is a type
of soldermask. There are soldermasks available in other colours
as well. Prevalent among them are Red and blue.

Understanding PCB Material &

Specification Continued

10) Line Width / Spacing : 6/6 mils This means the minimum track
width would be 6 mils and minimum spading between tracks, tracks
and pads and all other spacings should be greater than or equal to 6
mils. In case you dont know mils, It is the prevalent unit of distance
used in PCB world. 1 mil = 1/1000th of an inch = .0254mm.
Take care of width and spacing when higher currents and voltages
are expected on board.

11) Electrical test, routed In multilayer PCB, It is not possible to do

visual inspection of all the tracks for their correctness. So this test is
done. Test probes are put at the end of tracks or on pads such that
signals on it can be accessible. A small voltage is applied on one
such probe. If that voltage is detected at the other end, it confirms
that the tracks are proper. This step may not be necessary in 1 or 2
layer board but if you dont want to compromise on quality, get this
test done.

Understanding PCB Material &

Specification Continued

12) PCB Material-Isola 370HR-High Tg : Isola is a famous

company for PCB materials and 370HR is one of their
products name. This is an FR4 PCB material. This PCB
material in addition to FR4 properties has additional
advantages like superior thermal performance which helps
in dissipating heat on board. The mechanical, chemical and
moisture resistance properties all equal or exceed the
performance of traditional FR-4 materials. High Tg stands
for high glass transition temperature. This means that the
PCB made of this material can sustain high temperatures.
During HASL or soldering, PCBs have to sustain high
temperatures and thats where this parameter becomes
important.

Understanding PCB Material &

Specification Continued

13) No Blind/Buried Vias Blind Vias are those vias

which join one of the outer layers (TOP or BOTTOM)
with one of the inner layers. Since this via can be seen
from only one side, it is called a blind via (This may not
seem logical but just remember itJ). Buried vias are
vias which connect one of the inner layers to another
inner layer. This vias cannot be seen from any of the
outer layer and hence is called buried vias. (Aha!! This
is logical) Via filling as we studied above is used many
a times when blind/buried vias are used. It helps level
the surface just above via so that pads/tracks can be
placed over the vias without the solder penetrating in.