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Digital Integrated

Circuits
Jan M. Rabaey

AAnantha
Design
Perspective
Chandrakasan
Borivoje Nikolic

The Inverter
July 30, 2002

Digital Integrated Circuits2nd

Inverter

The CMOS Inverter: A First Glance


V DD

V in

V out
CL

Digital Integrated Circuits2nd

Inverter

CMOS Inverter
N Well

VDD

VDD

PMOS

Contacts

PMOS
In

Out
In

NMOS

Out
Metal 1

Polysilicon

NMOS
GND

Digital Integrated Circuits2nd

Inverter

Two Inverters
Share power and ground
Abut cells
VDD

Digital Integrated Circuits2nd

Connect in Metal

Inverter

CMOS Inverter
First-Order DC Analysis
V DD

V DD
Rp
V out

V out

VOL = 0
VOH = VDD
VM = f(Rn, Rp)

Rn

V in 5 V DD
Digital Integrated Circuits2nd

V in 5 0
Inverter

CMOS Inverter: Transient Response


V DD

V DD

tpHL = f(Ron.CL)

Rp

= 0.69 RonCL
V out

V out

CL

CL
Rn

V in 5 0

V in 5 V DD

(a) Low-to-high

(b) High-to-low

Digital Integrated Circuits2nd

Inverter

Voltage Transfer
Characteristic

Digital Integrated Circuits2nd

Inverter

PMOS Load Lines


IDn

V in = V DD +VGSp
IDn = - IDp
V out = VDD +VDSp

V out
IDp

Vin=0

IDn

IDn

V in=1.5

VGSp=-1
VGSp=-2.5

Digital Integrated Circuits2nd

V DSp
Vin = V DD+VGSp
IDn = - IDp

Vin=0
Vin=1.5

VDSp

Vout

Vout = V DD+VDSp

Inverter

CMOS Inverter Load Characteristics


ID n

PMOS

Vin = 0

Vin = 2.5

Vin = 0.5

Vin = 2

Vin = 1

Vin = 1.5

Vin = 1.5
Vin = 2
Vin = 2.5

NMOS

Vin = 1
Vin = 1.5

Vin = 1

Vin = 0.5
Vin = 0
Vout

Digital Integrated Circuits2nd

Inverter

CMOS Inverter VTC


NMOS off
PMOS res

2.5

Vout

NMOS s at
PMOS res

1.5

NMOS sat
PMOS sat

0.5

NMOS res
PMOS sat

0 .5
Digital Integrated Circuits2nd

1 .5

NMOS res
PMOS off
2 .5

Vin
Inverter

Switching Threshold as a function


of Transistor Ratio
1.8
1.7
1.6
1.5

1.3

V (V)

1.4

1.2
1.1
1
0.9
0.8

10

Digital Integrated Circuits

2nd

W p /W

10
n

Inverter

Determining VIH and VIL


Vout
V OH

VM

V in
V OL

V IL

V IH

A simplified approach

Digital Integrated Circuits2nd

Inverter

Inverter Gain
0
-2
-4

gain

-6
-8

-10
-12
-14
-16
-18

0.5

Digital Integrated Circuits2nd

Vin (V)

1.5

2.5

Inverter

Gain as a function of VDD


2.5

0.2

0.15

Vout (V)

Vout (V)

1.5

0.1

1
0.05

0.5

0
0

Gain=-1
0.5

Vin (V)

1.5

Digital Integrated Circuits2nd

2.5

0
0

0.05

0.1
Vin (V)

0.15

0.2

Inverter

Simulated VTC
2.5

Vout (V)

1.5

0.5

Digital Integrated Circuits2nd

0.5

Vin (V)

1.5

2.5

Inverter

Impact of Process Variations


2.5

Good PMOS
Bad NMOS

Vout(V)

1.5

Nominal
1

Good NMOS
Bad PMOS

0.5

0
0

Digital Integrated Circuits2nd

0.5

Vin (V)

1.5

2.5

Inverter

Propagation Delay

Digital Integrated Circuits2nd

Inverter

CMOS Inverter Propagation Delay


Approach 1
VDD

tpHL = CL Vswing/2
Iav
Vout

Iav

CL

CL
kn VDD

Vin = V DD
Digital Integrated Circuits2nd

Inverter

CMOS Inverter Propagation Delay


Approach 2
VDD

tpHL = f(Ron.CL)
= 0.69 RonCL
Vout
CL
Ron

ln(0.5)

Vout
1

VDD

0.5
0.36

Vin = V DD
RonCL

Digital Integrated Circuits2nd

Inverter

CMOS Inverters
VDD
PMOS

1.2m
=2
In

Out
Metal1

Polysilicon

NMOS
GND

Digital Integrated Circuits2nd

Inverter

Transient Response
3
2.5

tp = 0.69 CL
(Reqn+Reqp)/2

Vout(V)

1.5
1

tpHL

tpLH

0.5
0
-0.5
0

0.5

Digital Integrated Circuits2nd

t (sec)

1.5

2.5

-10

x 10

Inverter

Design for Performance


Keep

capacitances small
Increase transistor sizes
watch out for self-loading!
Increase

Digital Integrated Circuits2nd

VDD (????)

Inverter

Delay as a function of VDD


5.5
5

tp(normalized)

4.5
4
3.5
3
2.5
2
1.5
1
0.8

1.2

Digital Integrated Circuits2nd

1.4

1.6

VDD(V)

1.8

2.2

2.4

Inverter

Device Sizing
-11

3.8

x 10

(for fixed load)

3.6
3.4

tp(sec)

3.2
3

2.8

Self-loading effect:
Intrinsic capacitances
dominate

2.6
2.4
2.2
2

Digital Integrated Circuits2nd

8
S

10

12

14

Inverter

NMOS/PMOS ratio
-11

x 10

tpHL

tpLH

tp(sec)

4.5

= Wp/Wn

tp
4

3.5

3
1

1.5

Digital Integrated Circuits2nd

2.5

3.5

4.5

Inverter

Impact of Rise Time on Delay


0.35

tpHL(nsec)

0.3

0.25

0.2

0.15

Digital Integrated Circuits2nd

0.2

0.4
0.6
trise (nsec)

0.8

Inverter

Inverter Sizing

Digital Integrated Circuits2nd

Inverter

Inverter Chain
In

Out
CL

If CL is given:
- How many stages are needed to minimize the delay?
- How to size the inverters?
May need some additional constraints.
Digital Integrated Circuits2nd

Inverter

Inverter Delay
Minimum length devices, L=0.25m
Assume that for WP = 2WN =2W
same pull-up and pull-down currents
approx. equal resistances RN = RP
approx. equal rise tpLH and fall tpHL delays
Analyze as an RC network
1
1
WP
WN

RP Runit
Runit
RN RW
Wunit
Wunit
Delay (D): tpHL = (ln 2) RNCL
Load for the next stage:
Digital Integrated Circuits2nd

2W

tpLH = (ln 2) RPCL

C gin

W
3
Cunit
Wunit

Inverter

Inverter with Load


Delay

RW

CL
RW

Load (CL)

tp = k RWCL
k is a constant, equal to 0.69
Assumptions: no load -> zero delay
Digital Integrated Circuits2nd

Wunit = 1

Inverter

Inverter with Load


CP = 2Cunit

Delay

2W
W

CN = Cunit

Cint

CL
Load

Delay = kRW(Cint + CL) = kRWCint + kRWCL = kRW Cint(1+ CL /Cint)


= Delay (Internal) + Delay (Load)
Digital Integrated Circuits2nd

Inverter

Delay Formula
Delay ~ RW Cint C L
t p kRW Cint 1 C L / Cint t p 0 1 f /
Cint = Cgin with 1
f = CL/Cgin - effective fanout
R = Runit/W ; Cint =WCunit
tp0 = 0.69RunitCunit
Digital Integrated Circuits2nd

Inverter

Apply to Inverter Chain


In

Out
1

CL

tp = tp1 + tp2 + + tpN

C gin , j 1

t pj ~ Runit Cunit 1

C
gin
,
j

N
N
C gin , j 1
, C gin , N 1 C L
t p t p, j t p0 1

C gin , j
j 1
i 1
Digital Integrated Circuits2nd

Inverter

Optimal Tapering for Given N


Delay equation has N - 1 unknowns, Cgin,2 Cgin,N
Minimize the delay, find N - 1 partial derivatives
Result: Cgin,j+1/Cgin,j = Cgin,j/Cgin,j-1
Size of each stage is the geometric mean of two neighbors
C gin , j C gin , j 1C gin , j 1
- each stage has the same effective fanout (Cout/Cin)
- each stage has the same delay
Digital Integrated Circuits2nd

Inverter

Optimum Delay and Number of


Stages
When
each stage is sized by f and has same eff. fanout f:
f

F C L / C gin ,1

Effective fanout of each stage:

f NF
Minimum path delay

t p Nt p 0 1 N F /
Digital Integrated Circuits2nd

Inverter

Example
In
C1

Out
1

f2

CL= 8 C1

CL/C1 has to be evenly distributed across N = 3 stages:

f 38 2

Digital Integrated Circuits2nd

Inverter

Optimum Number of Stages


For a given load, CL and given input capacitance Cin
Find optimal sizing f
ln F
N
C L F Cin f Cin with N
ln f

t p Nt p 0 F

1/ N

/ 1

t p 0 ln F


t p t p 0 ln F ln f 1

ln 2 f

For = 0, f = e, N = lnF
Digital Integrated Circuits2nd

ln f ln f
f
0

f exp1 f
Inverter

Optimum Effective Fanout f


Optimum f for given process defined by

f exp1 f

fopt = 3.6
for =1

Digital Integrated Circuits2nd

Inverter

Impact of Self-Loading on tp
No Self-Loading, =0

With Self-Loading =1

u/ln(u)

60.0

40.0

x=10,000
x=1000

20.0

x=100
x=10

0.0
1.0

3.0

Digital Integrated Circuits2nd

5.0

7.0

Inverter

Normalized delay function of F

t p Nt p 0 1 N F /

Digital Integrated Circuits2nd

Inverter

Buffer Design
1

16

2.8

Digital Integrated Circuits2nd

22.6

tp

64

64

65

64

18

64

15

64

2.8

15.3

Inverter

Power Dissipation

Digital Integrated Circuits2nd

Inverter

Where Does Power Go in CMOS?


Dynamic Power Consumption
Charging and Discharging Capacitors

Short Circuit Currents


Short Circuit Path between Supply Rails during Switching

Leakage
Leaking diodes and transistors

Digital Integrated Circuits2nd

Inverter

Dynamic Power Dissipation


Vdd

Vin

Vout
CL

Energy/transition = CL * Vdd2
Power = Energy/transition * f = CL * Vdd2 * f

Not a function of transistor sizes!


Need to reduce CL, Vdd, and f to reduce power.

Digital Integrated Circuits2nd

Inverter

Modification for Circuits with Reduced Swing


Vdd
Vdd
VddVt
CL

E 0 1 = CL Vdd V dd Vt

Can exploit reduced swing to lower power


(e.g., reduced bit-line swing in memory)
Digital Integrated Circuits2nd

Inverter

Adiabatic Charging
2

Digital Integrated Circuits2nd

Inverter

Adiabatic Charging

Digital Integrated Circuits2nd

Inverter

Node Transition Activity and Power


Consider switching a CMOS gate for N clock cycles
E

= C V 2 n N
N
L
dd

EN : the energy consumed for N clock cycles


n(N): the number of 0->1 transition in N clock cycles
EN
2
n N
P avg = lim fclk = lim C Vdd f clk
N N
N N
L

01

n N
lim
N N

P av g = 0 1 C Vdd 2 f clk
L

Digital Integrated Circuits2nd

Inverter

Transistor Sizing for Minimum


Energy
In

Out

Cg1

Goal:

Cext

Minimize Energy of whole circuit

Design parameters: f and VDD


tp tpref of circuit with f=1 and VDD =Vref

f
F


t p t p 0 1 1

f

VDD
t p0
VDD VTE
Digital Integrated Circuits2nd

Inverter

Transistor Sizing (2)

Performance Constraint (=1)

tp
t pref

F
2 f
f VDD Vref VTE

3 F
Vref VDD VTE

t p0
t p 0 ref

F
2 f
f

1
3 F

Energy for single Transition


2
E VDD
C g1 1 1 f F
2

VDD 2 2 f F
E

Eref Vref
4 F
Digital Integrated Circuits2nd

Inverter

Transistor Sizing (3)


VDD=f(f)

E/Eref=f(
f)

1.5

3.5

F=1

normalized energy

2
vdd (V)

2.5

1.5

20

0.5
0

0.5

10

Digital Integrated Circuits2nd

Inverter

Short Circuit Currents


Vdd

Vin

Vout
CL

IVDD (mA)

0.15

0.10

0.05

0.0

Digital Integrated Circuits2nd

1.0

2.0
3.0
Vin (V)

4.0

5.0

Inverter

How to keep Short-Circuit Currents Low?

Short circuit current goes to zero if tfall >> trise,


but cant do this for cascade logic, so ...
Digital Integrated Circuits2nd

Inverter

Minimizing Short-Circuit Power


8
7
6

Vdd =3.3

Pnorm

5
4

Vdd =2.5

3
2
1
0

Vdd =1.5
0

Digital Integrated Circuits2nd

tsin/tsout

Inverter

Leakage
Vdd

Vout

Drain Junction
Leakage
Sub-Threshold
Current

Sub-threshold current one of most compelling issues


Sub-Threshold
in low-energy
circuitCurrent
design!Dominant Factor
Digital Integrated Circuits2nd

Inverter

Reverse-Biased Diode Leakage


GATE

p+

p+

ReverseLeakageCurrent
+

V
dd

IDL=JSA
2
fora1.2mCMOStechnology
JS = 10-100 pA/m2
at 25 deg C for 0.25m CMOS
JS =15pA/m

JS doubles for every 9 deg C!

Jsdoublewithevery9oCincreaseintemperature

Digital Integrated Circuits2nd

Inverter

Subthreshold Leakage Component

Digital Integrated Circuits2nd

Inverter

Static Power Consumption


Vdd

Istat

Vin =5V

Vout

CL

Pstat = P(In=1).Vdd . Istat

Wasted energy

Dominates over dynamic consumption


Should be avoided in almost all cases,
Not a function of switching frequency
but could
help reducing energy in others (e.g. sense amps)
Digital Integrated Circuits2nd

Inverter

Principles for Power Reduction


Prime

choice: Reduce voltage!

Recent years have seen an acceleration in


supply voltage reduction
Design at very low voltages still open question
(0.6 0.9 V by 2010!)
Reduce

switching activity
Reduce physical capacitance
Device Sizing: for F=20
fopt(energy)=3.53, fopt(performance)=4.47

Digital Integrated Circuits2nd

Inverter

Impact of
Technology
Scaling
Digital Integrated Circuits2nd

Inverter

Goals of Technology Scaling


Make

things cheaper:

Want to sell more functions (transistors)


per chip for the same money
Build same products cheaper, sell the
same part for less money
Price of a transistor has to be reduced
But

also want to be faster, smaller,


lower power

Digital Integrated Circuits2nd

Inverter

Technology Scaling

Goals of scaling the dimensions by 30%:


Reduce gate delay by 30% (increase operating
frequency by 43%)
Double transistor density
Reduce energy per transition by 65% (50% power
savings @ 43% increase in frequency

Die size used to increase by 14% per


generation
Technology generation spans 2-3 years

Digital Integrated Circuits2nd

Inverter

Technology Generations

Digital Integrated Circuits2nd

Inverter

Technology Evolution (2000 data)

International Technology Roadmap for Semicondu


Year of
Introduction

1999

Technology node
[nm]

180

Supply [V]

2000

2001

2004

2008

2011

2014

130

90

60

40

30

0.6-0.9

0.5-0.6

0.3-0.6

9-10

10

3.5-2

7.1-2.5

11-3

14.9
-3.6

1.5-1.8 1.5-1.8 1.2-1.5 0.9-1.2

Wiring levels

6-7

6-7

Max frequency
[GHz],Local-Global

1.2

Max P power [W]

90

106

130

160

171

177

186

Bat. power [W]

1.4

1.7

2.0

2.4

2.1

2.3

2.5

1.6-1.4 2.1-1.6

Node years: 2007/65nm, 2010/45nm, 2013/33nm, 2016/23nm


Digital Integrated Circuits2nd

Inverter

Technology Evolution (1999)

Digital Integrated Circuits2nd

Inverter

ITRS Technology Roadmap


Acceleration Continues

Digital Integrated Circuits2nd

Inverter

Technology Scaling (1)


Minimum Feature Size (micron)

10

10

10

10

-1

-2

10
1960

1970

1980

1990

Year

2000

2010

Minimum Feature Size


Digital Integrated Circuits2nd

Inverter

Technology Scaling (2)

Number of components per chip


Digital Integrated Circuits2nd

Inverter

Technology Scaling (3)


tp decreases by 13%/year
50% every 5 years!

Propagation Delay
Digital Integrated Circuits2nd

Inverter

Technology Scaling (4)


1000

10
1
0.1
0.01
80

MPU
DSP
85

Year

(a) Power dissipation vs. year.

90

95

Power Density (mW/mm 2 )

Power Dissipation (W)

100

100

10

1
1

Scaling Factor
normalized by 4 m design rule
(b) Power density vs. scaling factor.
From Kuroda

Digital Integrated Circuits2nd

Inverter

10

Technology Scaling Models


Full Scaling (Constant Electrical Field)
ideal model dimensions and voltage scale
together by the same factor S

Fixed Voltage Scaling


most common model until recently
only dimensions scale, voltages remain constant

General Scaling
most realistic for todays situation
voltages and dimensions scale with different factors

Digital Integrated Circuits2nd

Inverter

Scaling Relationships for Long Channel Devices

Digital Integrated Circuits2nd

Inverter

Transistor Scaling
(velocity-saturated devices)

Digital Integrated Circuits2nd

Inverter

Processor Scaling

P.Gelsinger: Processors for the New Millenium, ISSCC 2001

Digital Integrated Circuits2nd

Inverter

Processor Power

P.Gelsinger: Processors for the New Millenium, ISSCC 2001

Digital Integrated Circuits2nd

Inverter

Processor Performance

P.Gelsinger: Processors for the New Millenium, ISSCC 2001

Digital Integrated Circuits2nd

Inverter

2010 Outlook

Performance 2X/16 months


1 TIP (terra instructions/s)
30 GHz clock

Size
No of transistors: 2 Billion
Die: 40*40 mm

Power
10kW!!
Leakage: 1/3 active Power
P.Gelsinger: Processors for the New Millenium, ISSCC 2001

Digital Integrated Circuits2nd

Inverter

Some interesting questions


What

will cause this model to break?


When will it break?
Will the model gradually slow down?
Power and power density
Leakage
Process Variation

Digital Integrated Circuits2nd

Inverter

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