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Pipes
With Applications to Electronics
Cooling
-- Widah Saied
Introduction
Things to be discussed:
Basic components
Advantages
Ideal thermodynamic cycle
Applications
Types
Heat transfer limitations
Resistance network
Wick design
Choosing the working fluid
Container design
Heat pipes in electronics cooling
Current research in electronics cooling
Basic Components
Adiabatic section
evaporator
wick
condense
r
http://www.lightstreamphotonics.com/images/tech_orangecontainer_small.png
Advantages of Heat Pipes
Very high thermal conductivity. Less
temperature difference needed to transport
heat than traditional materials (thermal
conductivity up to 90 times greater than
copper for the same size) resulting, in
(Faghiri, 1995)
(Faghiri, 1995)
Heat Pipe Applications
Electronics cooling- small high performance components
cause high heat fluxes and high heat dissipation demands.
Used to cool transistors and high density semiconductors.
(Faghiri,1995)
Types of Heat Pipes
Micro heat pipes- small heat pipes that are noncircular and use angled
corners as liquid arteries. Characterized by the equation: rc /r 1 where rc
h
(Peterson,1994)
Types of Heat Pipes
Variable conductance- allows variable heat fluxes into the evaporator
while evaporator temperature remains constant by pushing a non-
condensable gas into the condenser when heat fluxes are low and
moving the gas out of the condenser when heat fluxes are high, thereby,
increasing condenser surface area. They come in various forms like
excess-liquid or gas-loaded form. The gas-loaded form is shown below.
Used in electronics cooling. (Faghiri,1995)
Types of Heat Pipes
Capillary pumped loop heat pipe- for systems where the heat fluxes are
very high or where the heat from the heat source needs to be moved far
away. In the loop heat pipe, the vapor travels around in a loop where it
condenses and returns to the evaporator. Used in electronics cooling.
(Faghiri, 1995)
Main Heat Transfer Limitations
Capillary limit- occurs when the capillary pressure is
too low to provide enough liquid to the evaporator
from the condenser. Leads to dryout in the
evaporator. Dryout prevents the thermodynamic
cycle from continuing and the heat pipe no longer
functions properly.
Sonic limit- occurs when the vapor velocity reaches sonic speed
at the evaporator and any increase in pressure difference will not
speed up the flow; like choked flow in converging-diverging
nozzle. Usually occurs during startup of heat pipe.
(Peterson,1994)
Heat Transfer Limitations
Actual performance curves, capillary limit and boiling limit, are the limiting
factors.
http://www.electronics-cooling.com/Resources/EC_Articles/SEP96/sep96_02.htm
Capillary Limit
For a heat pipe to function properly, the capillary pressure must
be greater or equal to the sum of the pressure drops due to
inertial, viscous, and hydrostatic forces, as well as, pressure
gradients.
(Peterson, 1994)
Capillary Limit
(Peterson, 1994)
Boiling Limit
The Boiling limit is due to excessive radial heat flux; all the other
limits are due to axial heat flux.
The maximum heat flux beyond which bubble growth will occur
resulting in dryout is given by:
(Peterson, 1994)
Boiling Limit
Keff given by the table below:
(Peterson, 1994)
Heat Pipe Resistance
In certain applications the temperature difference between the evaporator and the
condenser needs to be known, such as in electronics cooling. This may be done
using a thermal circuit.
Other resistances exist but most are small relative to the above
resistances.
(Peterson, 1994)
The Wick and its Design
Main Purpose- provides structure and force that
transports the condensate liquid back to the
evaporator. Also, ensures working fluid is evenly
distributed over evaporator surface.
(Peterson, 1994)
Capillary Pressure
The driving force that transports the condensed
working liquid through the wick to the evaporator
is provided by capillary pressure. Working fluids
that are employed in heat pipes have concave
facing menisci (wetting liquids) as opposed to
convex facing menisci (non wetting liquids).
Wetting angle
Water Mercury
Wetting Non wetting liquid
liquid
http://cwx.prenhall.com/petrucci/medialib/media_portfolio/text_images/FG13_04.JPG
Capillary Pressure
The shape of a fluids meniscus is dependent on the fluids
surface tension and the solid-fluid adhesion force. If the adhesion
force is greater than the surface tension, the liquid near the solid
will be forced up and the surface tension of the liquid will keep the
surface intact causing the entire liquid to move up.
http://hyperphysics.phy-astr.gsu.edu/hbase/hframe.html
1 1
Pcap
R R
2 cos
Pcap
r
For max capillary pressure theta must be zero
2
Pcap ,max
r
(Peterson,1994)
Capillary Pressure
Wetting fluids have a cos value that will be positive.
This results in a positive capillary pressure that creates
a pushing force on the liquid in the wick near the
condenser; this forces the liquid to move to the
evaporator.
(Peterson,1994)
Wick Design
Two main types of wicks: homogeneous and
composite.
http://www.electronics-cooling.com/Resources/EC_Articles/SEP96/sep96_02.htm
(Peterson,1994).
Choosing the Working Fluid
Heat pipes work on a cycle of vaporization and condensation of
the working fluid, which results in the heat pipes high thermal
conductivity. When choosing a working fluid for a heat pipe, the
fluid must be able to operate within the heat pipes operating
temperature range. For instance, if the operating temperatures
are too high, the fluid may not be able to condense. However, if
the operating temperatures are too low the fluid will not be able to
evaporate. Watch the saturation temperature for your desired
fluid at the desired heat pipe internal pressure.
http://www.cheresources.com/htpipes.shtml
Choosing the Working Fluid
(Peterson, 1994).
Choosing the Working Fluid
Chi(1976) developed a parameter of gauging
the effectiveness of a working fluid called the
liquid transport factor:
l
Nl
l
Where is the latent heat of vaporization and is the surface
tension. Subscript l refers to the liquid
(peterson,1994)
Container Design
Stresses:
Since the heat pipe is like a pressure vessel
it must satisfy ASME pressure vessel codes.
Typical materials:
Aluminum
Stainless steel
Copper
Composite materials
High temperature heat pipes may use
refractory materials or linings to prevent
corrosion.
(Peterson, 1994)
Heat pipe Compatibility
When designing a heat pipe, the working fluid, wick, and container must
function properly when operating together. For example, the working fluid
may not be wettable with the wick; or the fluid and container may
undergo a chemical reaction with each other.
(Peterson, 1994)
Heat pipe Compatibility
Working fluid/
material
compatibility.
(Faghiri, 1995)
Heat Sink/Source Interface
The contact resistance between the
evaporator and the heat source and between
the condenser and the heat sink is relatively
large and should be minimized.
(Peterson, 1994)
Heat Pipes in Electronics Cooling
(Peterson, 1994)
Heat Pipes in Electronics Cooling
(Peterson, 1994)
Heat Pipes in Electronics Cooling
(Peterson, 1994)
Heat Pipes in Electronics Cooling
(Peterson, 1994)
Heat Pipes in Electronics Cooling
(Peterson, 1994)
Heat Pipes in Electronics Cooling
When the electrical power is high and
the heat rejection requirements large
and nucleate pool boiling occurs,
another method of cooling a heat source
may be employed.
Nucleate pool boiling causes a large
temperature drop. To reduce the drop,
you can make the device a part of the
wick structure to ensure that fresh liquid
is always in contact with the heat
source. Further providing cooling to the
transistor.
In the image to the right the heat source (a
transistor chip) is in contact with the working liquid
and the working liquid is being evaporated away,
cooling the transistor.
(Peterson, 1994)
Heat Pipes in Electronics Cooling
Summary:
Heat pipes enable devices with higher
density heat dissipation requirements and
greater reliability.
Low cost
Proven alternative to conventional methods
of electronics cooling.
(Peterson, 1994)
Current Research in Electronics Cooling
Main Results:
In configuration 1, tilt angle effected the
amount of heat dissipated
In configuration 2, tilt angle had no effect
on amount dissipated.
Important because laptops experience
operation in many orientations.
Current Research in Electronics Cooling
Mesh number is defined as the number of openings per linear inch. (About,2006)
Current Research in Electronics Cooling
T j Ta 1
ja
Qc Rtotal
Where Qc is the heat dissipated through the heat sink
Current Research in Electronics Cooling
Current Research in Electronics Cooling
Other discoveries:
Within the CPUs operating temperature
limit, the heat capacity of a micro heat pipe
is restricted by the heat sinks ability to
transfer heat through convection
Heat transfer not restricted by the capillary
limit.
Current Research in Electronics Cooling
The maximum heat transfer limit provided by the heat pipe, for the most part,
is not reached due to deficiencies in the heat sinks ability to transfer
heat through convection.
Current Research in Electronics Cooling