Académique Documents
Professionnel Documents
Culture Documents
Material parameters
Wave Parameters
Material Parameters
Particle Displacement
Particle Velocity
Modulus of Elasticity
Density
Particle Displacement
Total length movement of one discrete particle.
Wave length
Frequency
Sound Pressure
Wave Velocity
Wave Length
Is the distance between two planes in which the particles
are in the same state of motion.
= velocity
frequency
Effect of
Diameter and
Frequency on
Beam Profile
Review Profile Formulas
Maximum Energy
Near Far
Field Field
x
Beam Cross-section
View on Total energy loss
X-X 90% energy loss
Max energy at
beam centre
K.l q
Sin q =
D
K = constant factor
50% edge = 0.56
90% edge = 1.08
EG: 1.22 x 1.5mm
Extreme edge = 1.22
10mm
D = crystal diameter
l = wavelength 1.83 = 0.183
=
10
Inverse sine 0.183 = 10.50
Review Sound Pressure Formulas
Relative measure of sound pressure in dB
= 20 log10 (h1/h2)
Calculate:
Wave length
Near Zone
Answer
Beam Spread
= V/F
=.12 cm
NZ = D2F/4V
=(1.2)2*5*106/4*.5890*106
=3.67 cm
Perpendicular Incidence of Sound
Waves
2
RE =
[ ] Z2-Z1
Z2+Z1
4Z2Z1
DE =
(Z2+Z1)2
Refraction
Sin 1 = Sin 2
V1 V2
Snells Law
No Refraction
< 1 st Critical Angle
At 1 st Critical Angle
> 1 st Critical Angle
At 2 nd Critical Angle
Refraction / Multiple Boundaries
OR
Sound Pressures After Refraction
Incident range
25.6 to 61
Refracted range
30 to 80
85 deg. longitudinal
Transverse
Longitudinal
Sintered ceramic
heated above curie temperature
polarized by a strong electric field
cooled below curie temperature
Change in thickness [ x]
x = d33 Ut
Piezoelectric Terms
Piezoelectric pressure constant [g33]
Sound Pressure [p]
Thickness [d]
Ur = g33dpx
Piezoelectric Terms
Mechanical Quality [Q]
Measure of Oscillation loss, the lower
the value the higher the rate of absorption the
less backing material is required.
Acoustic Impedance [Z]
Z = V
Lead Titanate
Lead Meta-niobate
transducer cable
water column
flexible
membrane
reflected pulse
transmitted pulse
Mechanical Displacement
c = velocity in material
Variable Focal Length Linear
Phased Array
Linear Phased Arrays
Steering Linear Phased Array
Steering Linear Phased Array
Steering and Focussing
Linear Scanning
Scanning Phased Arrays
Planar Phased Array
Annular Array
Phased Array
Scanning and Focusing Phased
Arrays
Focusing, Scanning Shear Wave
Phased Array
Phased Array Terminology
Other Methods of Transmitting
and Receiving Sound
Piezoelectric Indirect method, i.e. coupled
crystals
Thermal Transducers
Eddy Currents interact with the steady field to produce Lorentz forces
EMATs
Allow noncontact generation and reception of sound
Below the Curie point of the material linear is much more significant
Direct Excitation
Magnetostriction Transducers
Can be used to excite the part directly or indirectly
Magnetostrictive Transducer
(for indirect excitation)
Focused
Transducer
Laser Excited Transducers
Sound deflection methods
Physical displacement method
Advantages
High resolution
Allow work on hot surfaces
Insensitive to electrical interference
Laser
RFG Voltage
Delay
Transmitted Pulse
Echo Pattern
Repetition Frequency Generator
Sweep Voltage
CRT Brightness
Spurious Indications
Most instruments have the repetition rate switched with the range
2. Swept Gain
Amplification increases with distance
Distance Amplitude Correction
DAC CURVE
80
60
40
NOTE:
Reflectors of the same size
20
will produce echoes which
peak along that curve despite
different locations within the
F1=DRAW DAC, F2=DONE, F3=CLEAR
GATE1 ALARM
FILENAME.023 ID>100
test piece.
ASME FORMAT
T.V.G. or T.C.G.
Purpose:
Compensates for the changes in echo amplitude from equal
size reflectors at different distances due to attenuation and
beam spreading.
GAIN 47.0dB RANGE 0.200 in/div
REJ 0%
MIN DEPTH 0.990 1.000 in
100
80
TVG SETUP
60
40 TVG
NOTE:
20 Reflectors of the same size
will produce indications of
0 2 4 6 8 10 equal
GATE1 ALARM
screen height regardless of
FILENAME.023 ID>100
their distance in the material.
Instrument Technical Characteristics
Precision of Echo Amplitude
Calibrated Gain precision
Vertical linearity
Stability of transmitter voltage
Precision of Distance
Linearity of time base
Stability of PRR to sweep
Width of screen
Precision possible in reading the screen
Transducer sound field
damping
index points (angle beam)
Instrument Technical Characteristics
Sensitivity
Transmitter energy
Limiting sensitivity of amplifier (noise & bandwidth)
Shape of the sound field
Damping and coupling losses
Depth Resolution
Quality of transducer, frequency, damping, suppression
of reverberation
Rise time of transmitter
Amplifier Characteristics
Transit Time Methods
Wall thickness
Sound velocity
Physical strain
Time Measurement
Comparing it with a known
(Two parallel circuits, adjusting the known)
Integration method
(Measuring between 2 successive echoes, not the first)
Counting method
Measuring oscillation counts between reflections
Potential Errors
Time Measurement
Detour Error
Transmit/receive transducer, V-shaped path
Shadow Methods
Through transmission
Imaging Methods
Liquid Surface Relief Method
Ultrasonovision (RCA)
Amplitude
Time or Distance
B-SCAN Encoded Information
Encoded Modes document distance traveled and corresponding
depth information for all points along the B-SCAN.
Transducer Cable
GATE2
Test Sample
GATE PEAK ON ALPHA
START MEM OFF
#
< >
REF DELETE ABC DEF
PRINT
dB
ITEM
SELECT
GATE
WIDTH
PULSER
SEND 1 2 3
REJECT WAVE ALARM MEMORY GHI JKL MNO
DEPTH DISPLAY
FREEZE SAVE
GATE
LEVEL %AMP STATUS
4 5 6
VEL2 THICK PRS TUV WXY
ENCODER SETUP
ZERO
OFFSET
RANGE VEL1 ZOOM ANGLE 7 8 9
QZ SYMBOL
2nd F
OPTION
SELECT F1 F2 F3 ID 0 MEMO
EPOCH III
B-SCAN Display
The B-SCAN will continue to run if the encoder is moved until:
- The scan is stopped or a new scan in initiated
- The memory buffer becomes full (See EPOCH III Memory &
Datalogger)
GAIN 55.0dB RANGE 1.200 in
Encoder Directional < DT 6.16 in DELAY 0.800 in
Current thickness reading
Arrow and Distance MIN DEPTH 1.090 1.090 in at cursor is displayed
Traveled value 0.800
(also shown below)
A Flashing A indicates
B B alarm condition is
I
50
present
D
I
R
ID>
C Scan Image Format
Plan view of
defective area
3D Image Format
Scanning Methods
P Scan (Projected Image Scanning System)
Phased Array
Scanning Methods
Acoustic Holography
Two step process
1. Capturing and storing image in a single plane
2. Recreating the image in multi-plane space
Scanning Methods
Holography (Relief Method)
Phase Hologram
Reference
Scanning Methods
Convex
Reduced contact surface area (rectangular)
Increased divergence
Drop in sensitivity
Angle of refraction may increase (shear wave)
Convex Contact Surface
Convex Contact Surface
Freq Transducer Radius Drop in
Dia of Curviture Sensitivity
MHz Inches Inches dB
1 0.5 4 15
1 0.5 20 6
2 1 4 15
2 1 20 4
2 0.375 4 3
2 0.375 20 0
4 1 4 15
4 1 20 4
4 0.375 4 6
4 0.375 20 1
Convex Contact Surface
Considerations
Rough surfaces Higher viscosity
Premature drying
Ease of Removal
Damage to component (e.g. Corrosion)
Wet ability of surface
Cost
Toxicity
Cleanliness
Acoustic Impedance
Uniformity
Coupling
Coupling can occur on smooth surfaces, with force
Alternates
Water gap
Water delay lines
Immersion
Confirming Coupling
Back echo
Sliding resistance
Grass on the base line
Automatically controlled
Corrective gain, using a back echo
Second transducer (receiving)
Boundaries and Complex Paths
Boundaries Parallel to Sound Path
33
Boundaries Parallel to Sound
Path
4MHz, 10mm dia, flaw depth 840mm, small constant size reflector
Caused by a phase shift in the reflected longitudinal wave.
Small Fatigue Cracks From a
Parallel Surface
High Frequency
Considerations
Rough surfaces (coupling losses)
Course Grain Structure ((scattering and attenuation)
T/R transducers (improve near surface resolution)
Angle probes (angles maybe different because of
velocity difference)
Angle probes may improve defect detection
(corner reflectors)
Highly Damped transducers (reduce the scatter noise)
Applied Ultrasonics
Recommended Frequencies
Applied Ultrasonics
Conventional transducer
Usually shear wave, the thinner the members the higher the angle
Consider
Code requirements
Laminations in the plate
Possible orientations of the flaws
External geometry (e.g. backing bars)
Defect size and shape
CSA W59-1989
Applied Ultrasonics
If the layers being bonded are not of equal thickness the bond
can be monitored by watching the back echo
Mapping