ARUN SHARMA

BS (Metallurgical Engg., MS (Material Sciences,

B. Law., M.S,Technology Management(80%Complete)
Experience in process, quality engineering,
technology management, process
integration, technology transfer, including
startups and expansions. Significant
achievement in process improvements.
Thrives on multidisciplinary problem
solving.
 Experiences:
Nepal Bureau of Mines (1969-73)
Ore beneficiation, feasibility of iron ore, foundry
installation- start up , experiments.
Allied Precious Metals ( 1974-77)
Electro-winning , chemical refining of gold
99.99%, smelting of aluminium, copper bullion,
re-sale low grade metal scraps, electronic scraps
 Texas instruments:
Process Control Engineer- Advanced
Assembly, In-coming material control, wafer
fabrications ( bi-polar TTL, STL, C- Mos, Bi-C
Mos devices.)
Dollar Impacts:
Poor grade chemicals- millions
Part rejects- millions/billions
Weak, process controls costs impacts billions-
reputation, competitive edge, business losses
 TI- Process Engineer, Process
Development Engineer
Process engineering on STL, TTL, CMos devices
Duties/responsibilities- in coming silicon
inspection, quality, device processing includes
oxidation, diffusion, ion-implantation, photo-
lithography, metallization, metal interconnection
process optimization, resistance, capacitance
calculations, device optimizations, transistor
speed, VT , gain, diodes, resistor process fine
tuning, improvements and developments.
 TI-Process Development, Product
Engineer (1982-84)
VHSIC process developments- discrete
processes optimization- silicon quality,
lithography, oxidation-isolation, capacitor
Process Integration all process steps co-
ordination, optimizations
Special focus on advanced process
developments (sub 1.25 micron devices)
Interfaces- design, process, in-coming
controls, customer rejects.
 Engineering Manager- Sperry/Unisys
1984-86
Engineering management on CMOS, Bi-CMos
technology-process development- oxidation,
gate development, isolation technology,
metallization including electromigration,
technology comparisons, engineering-hiring,
management, strategic presentation to
technical staff, executives including Director,
President and Vice President, Consultants.
 Digital Equipment Corp. Principal
Engineer ( 1988-1990)
CMOS Process development-
photolithography, oxidation, process
integration.
Defined and implemented process controls in
manufacturing and development lines.
Applications- R & D and manufacturing lines
Applied Magnetics- Principal Scientist (
1990-1994)
Process development photo processes,
optimizations , characterization, integrations
for thin film head applications.

Consulting Engineer on a start up (1994-95),

Read Rite, California, Old Commodore,
Norristown, Pennsylvania
 Sub-Micron Technology, Thailand,
Consultant and Team Leader(1995-97)

Plant start up- equipment selection, site

preparation
Engineering Training- defined, implemented
Process Engineering definition
Technology transfer, design, process interfaces
Process , equipment and metrology tool
selection, qualification
Motorola , Staff Engineer (1997-98)
Process qualification, optimization ( designed
experiments and analyzed), tool selections.
Quality / Process Control- implementation
TQM, ISO-9000 Certifications GM, Ford
other consumer requirements
 Arun Sharma- at present
Engineering, Business Consultant
Teacher
Writer
Volunteering
Philanthropy
 Material Sciences
Incoming material selections- impacts billions
Physical Metallurgy- same chemical
composition will have different mechanical,
optical, magnetic, piezo-electrical properties
eg. stress, strain, conductivities- heat or
electrical properties
Corrosion control (or lack of it) cost billions
Electro-migration failure cost astronomical
Apollo failure for example
 Material Science (contd.)
Stress corrosion costs billions
Fatigue failures can be astronomical- mechanical,
airline failure for ex.
Improper selection of materials will cost millions,
billions
Electrical , heat conductor improper selection will
cost millions, billions. Example RC delay constant
will impact speed up/slow down computers.
( Lack of) Heat dissipation impacts reliability
failures.
 Statistical Process & Quality Control
Toyotas win over GM, Ford cost billions to US
including business loss, market share.
Japanese take over consumer electronics- cost
billions
Americas loss of manufacturing with China
alone over 130 B per annum (astronomical
trade deficit.)
 HOW to ? And WHAT to do?
Total Quality Management
Statistical process and Quality Controls
Robust manufacturing, improve productivity
Improve quality and reliability
Implement ISO standard
DO WHAT YOU SAY
GIVE WHAT YOU PROMISE
3 Is-IMAGINE, INNOVATE, IMPROVE
 Material Sciences
Silicon starting material single crystal quality,
orientation is critical to device performances
Grain boundary(ies) have different properties
than the grain.
Size and number of grains influences material
properties
Material defects affects properties- leaky
transistors and diodes or resistors,
conductivity, RC constant for ex.
 Material Science
For aircrafts the light material (Al) is alloyed,
hardened with powder metallurgical
techniques to make it tougher than steel.
Electro-migration failures causes astronomical
damages in billions of dollars.
Fatigues failures, mechanical wear causes
failures specific to moving parts, engines,
aircrafts. ( probabilistic failures)
 Materials Science
Identical chemical composition may have
different material properties.
Stainless steel may NOT always be the best
material of choice. Not compatible with
chlorine.
Sustainability considerations will require
newer lighter materials with similar strengths.
World of material have numerous special
applications.
 Proposals- thoughts for future
SPC, SQC Course design exposure to quality
management- philosophy, theories, practical
hands- on training on computer.
A course in device processing/manufacturing
3Is- Imagination, Innovation, Implementation
Volunteer to career counseling in the fast
changing world
MATERIALS (need)- understanding, improving
is never obselete!