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Welcome
Bienvenue
Vacuum Insulated
Glazing - Winsmart
Ernesto Claure Ramirez
Transporte; 28.00%
Industria; 33.00%
Edificios ; 39.00%
Current EU legislation:
-Facade elements ≈0.3-0.4 W/m2 K
-Glazing ≈1.2-1.7W/m2K
State-of-the-Art technologies:
-Facade elements ≈0.15 W/m2 K
-Glazing ≈0.7W/m2K
Building Energy Materials and Components 4
Current solutions on the market
Building a sustainable future
U Value [W/m2K]
Single pane 4.7
Conductivity
Double pane (air) 2.7 [mW/mK]
Air: 9.3
Argon: 6.2
Krypton: 3.3
Double pane 1.1 (0.8)
(Ar (Kr)+ low e
coating)
Triple pane
0.7
(Kr+ low e
coating)
Theoretical Ug≈0.3-0.5W/m2K
(P = 10-3-10-4 mbar)
Spacers
Pilkinton SpaciaTM
U=1.1 W/m2K Solder
Pump-out glass
hole seal
Bends when fully pumped.
ΔT>35oC .
Not working at full capacity.
FLEXIBILITY
Source: pilkinton.com
Half VIGs
300oC
Coin
Gear system
operated by a
Bronze
DC motor.
piston
Highest Al content
(failure at dilaton-solder)
Lowest Al content
(failure at glass-solder) Slag (oxides)
Molten tin
800V
But the current is to
300 oC high, so the voltage
will reach that
quantity in about
one minute.
P=V*i
Pulling
High voltage wheel.
Injector
cart.
Metallic ribbon
(dilaton -48) on
top of glass pane
4. Problems.
a) Inhomogeneous Solder Frame.
b) Soft Soldering.
c) Anodic Bonding.
Sucked areas
Overflow
Tin nedeed
Tin nedeed
[g] [g] Tin inTin
thein path [g] [g]
the path
AA 30.7330.73 33.75
34.04
BB 26.9726.97 27.86
21.58
CC 30.7330.73 32.53
48.94
DD 26.9726.97 29.45
30.59
6.5 mm
15 potentially leak-tight
upscaled samples
38perfectly
samples injected
for peel ones
test,
and 7 for leak test, which i
will present you in he
experiments.
As you see the plots for soft soldering results, in a complete sample.
Were there are not bubbles anymore, the strength will be higher.
Nevertheless, we do not know why and that will publish in any other
presentation
5. Experiments
a) Leak Test.
b) Peel Test.
Cracking (solder-dilaton
and solder-glass)
50
45
40
30
25
20
15
10
0
50 100 150 200 250
Al content (ppm)
Interesting to see that the failure is predominantly at glass interface:
1. Many deffects over large areas induce scatterring and low
strength. 2. Or we never get rid of the oxides completely.
The higher the aluminum (150-250 ppm) the glass will fail more
easy. So maybe they have more bubbles with that composition.
15 samples were complete, which 8 was for peel test, and 7 for the
leak test.
The forces of the samples with 112.5 ppm were upside 15 N (about
one half of the sample)
The soft soldering area was really low (2-3 millimeters). To scrape
the metal before of making the sample did not work. The
atmosphere do not have enough oxygen, to have slag in the
Dilaton.
The bubbles in the anodic bonding makes the forces to be low. The
size of the bubbles was between 10-300 microns but that is not
correctly true, and they have to be investigated.
1. Injection
Flatness. (Rods in a continous production line after floating the
glass).
Injection (better control of the surface tension and viscosity under
inert atmosphere, plus well calibrated equipment flow).
2. Soldering
Oxidation in leaky chamber. (Oxygen pressure control in different
spots, leak tight sealing, better control of gas flow). That will help to
optimize further the solder composition (increase the most the
aluminum content). Pumping before flushing can make the organics
fade away.
2. Soft Soldering
No laserwelding needed if there could be machining.
3. Bubbles AB quality:
Solubility studies should be made to avoid this situation.
Handeling and degassing of tin before injection (show how
metallurgists could it)
Cleaning facilities should be there (H 2O2)
Wim Malfait
Workshop guys.
All the guys that have helped me (The hole team of my labor)
Wilson.
Under the conditions we had, there was probably a thick NiO layer
and in top of it spinel (FeONiO). Line solves this, and solves it for
whatever oxide there is.
Explain the aluminum content penalty, when you do the triple interface.
Show evidence about aluminum: The more aluminum the thicker de alumina layer formed
through the termite reaction. The less aluminum the less of this layer is formed and the more
the NiO stays. The oxide should be basically NiO because of the color and because of the
predominant formation of FeSn2. The NiO probably allows for better difussion of the solder.
Show segregation in every bubble point, which could lead to all the scattered regions
(because of aluminum?)