STRESS RUPTURE AND ELEVATED

TEMPARATURE FATIGUE
SHAIK FHARAZ 18MD07
ELEVATED TEMPARATURE
As the temperature increases,
 The kinetic energy of the atoms increases and
moves faster, i,e diffusion-controlled process.
This affects mechanical properties of materials.
 Greater mobility of dislocations (climb).
 Increased amount of vacancies.
 Deformation at grain boundaries.
 Metallurgical changes, i,e phase transformation,
precipitation, oxidation, recrystallization.
CREEP
 When a metal is subjected to a constant tensile
load at an elevated temperature, there undergoes a
time-dependent increase in length of the specimen.
This phenomenon is known as creep.
 Different Materials will have different melting point
temperatures, so the creep is also different.
 Creep takes places only when,
STRESS RUPTURE

 Stress rupture is the sudden and complete failure of a

material under stress.
 During testing, the sample is held at a specific load level
and temperature for a pre-determined amount of time.
 In stress rupture testing, loads may be applied by tensile
bending, flexural, biaxial or hydrostatic methods.
CREEP TESTING:
The creep test is carried out by applying a constant load
to a tensile specimen maintained at a constant
temperature .
TESTING PROCEDURE
 In metals, creep failure occurs at the grain boundaries to
give an intergranular fracture.
 The creep test is conducted using a tensile specimen to
which a constant stress is applied, often by the simple
method of suspending weights from it.
 Surrounding the specimen is a thermostatically controlled
furnace, the temperature being controlled by a
thermocouple attached to the gauge length of the specimen
 The extension of the specimen is measured by a very
sensitive extensometer since the actual amount of
deformation before failure may be only two or three per
cent.
 The results of the test are then plotted on a graph of strain
versus time
The creep failure occurs in three distinct phases :
Stage-1
A rapid increase in length known as primary creep where the
creep rate decreases as the metal work hardens.
Stage-2
This is followed by a period of almost constant creep rate,
steady state or secondary creep and it is this period that forms
the bulk of the creep life of a component.
Stage-3
The third stage, tertiary creep, occurs when the creep life is
almost exhausted, voids have formed in the material and the
effective cross sectional area has been reduced.
Stress Rupture Testing
The rupture test in carried out in a similar manner to the
creep test but at a higher stress level until the specimen
fails and the time at failure is measured.
Rupture strength and failure time are plotted, normally
showing a straight line.
Changing of the slope indicates structural changes in
the material, i.e., transgranular, intergranular fracture,
oxidation, recrystallisation, grain growth, spheroidization,
precipitation.
DIFFERENCES
VARIABLES CREEP TEST RUPTURE TEST
LOAD Low High
CREEP RATE Minimum Maximum
TEST PERIOD 2000-10000 Hr 1000 Hr
TOTAL STRAIN 0.5% 50%
STRAIN GAUGE Good Simpler
STRUCTURAL CHANGES DURING CREEP
There are three principal deformation processes at
elevated temperature.
1) Deformation by slip
More slip systems operate at high temperature
Slip bands are coarser and widely spaced.
2) Sub-grain formation
Creep deformation produces in-homoginiety especially
around grain boundaries, allowing dislocations to arrange
themselves into a low-angle grain boundary.
Easy for metals with high stacking false energy.
 3) Grain boundary sliding
Produced by shear process and promoted by
increasing temperature/or decreasing strain rate.
Results in grain boundary folding or grain
boundary migration.
FRACTURE AT ELEVATED TEMPARATURE
Equicohesive Temperature:
 The equicohesive temperature is an antiquated term for
the temperature at which the cohesion (the strength) of
the grain boundaries in a crystal (usually a metal) becomes
equal to that of the crystalline interior(Grain Interiors).
 In practice, it is the temperature at which a transition from
an intergranular to transgranular(cleavage)-type fracture is
observed.
Transgranular Fracture:
Slip Planes are weaker than grain boundaries.
Intergranular Fracture:
Grain boundaries are weaker than slip planes.
 Below ECT small grain sized material is stronger due
to high density of grain boundaries to improve
strength.
 Above ECT large grain sized material is stronger due
to less tendency for grain boundary sliding.