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Processor Design
Stanford University
Winter Quarter 1998-1999
Instructor: Michael Flynn
Teaching Assistant: Steve Chou
Administrative Assistant: Susan Gere
Lecture 1 - Introduction
Pentium (tm)
Die Size (mm 2)
LOGIC 68040
80486
80386
16M
100 68020
80286 4M
68000 1M
8086 256K
DRAM
64K
10
1975 1980 1985 1990 1995 2000
Year
Michael Flynn EE382 Winter/99 Source: Intel Slide 14
Finer Lithography
10
Resolution
Overlay
1.0 CD Control
Resolution ( m)
1 0.8 Generation
0.5
0.35
0.25
0.1
0.01
'83 '86 '89 '92 '95 '98 '01
YEAR
Michael Flynn EE382 Winter/99 Source: Intel Slide 15
Limits on scaling
As device sizes get smaller there are difficulties
maintaining the rate of down sizing of feature sizes
It currently appears that around 50nm several factors
may limit scaling
— hot carrier effects
— time dependent dielectric breakdown
— gate tunneling current
— short channel effects and effect on VT
1000
100
10
1
1965 1970 1975 1980 1985 1990 1995 2000
1000
900
800
Performance
700
600
500
DEC Alpha 5/500
400
300
DEC Alpha 5/300
200
DEC Alpha 4/266
SUN-4/ MIPS MIPS IBM IBM POWER 100
100
260 M/120 M2000 RS6000 DEC AXP/500
HP 9000/750
0
1987 1988 1989 1990 1991 1992 1993 1994 1995 1996 1997
Year
Workstation Performance Improving 54% per year
Figure 1.20 from P&H
That’s almost 1% per week!
Michael Flynn EE382 Winter/99 Slide 20
PC Shipment Growth
L1 L1
Icache Dcache
Pipelines
CPU • • • CPU
Registers
Chipset Memory
I/O Bus(es)