Atmel DB10 failures at test

Problem:
Four lots of atmel were trapped at test to have DB10 failures (see below lot details and FA result).

TEST ILN FA result ILN Device WB machine Date / shift Device MOLD MC DATE/SHIFT

609GPL Broken wire 607E1874 AT3552R-BSKU soks374 2/25/06 A/shift AT3552R-BSKU SOAP003 02/25/06 C
609FLW Broken wire 607E2113 AT3552R-BS9U SOKS 505 2/23/06 C/shift AT3552R-BS9U SOAP003 02/24/06 C
608ENP Broken wire 607Z3425 AT3553B-BSKU bks8-63 2/23/06 A/shift AT3553B-BSKU SOAP003 02/24/06 B
609LDY Broken wire 607Z860801 AT3552R-BS9U soks 534 3/01/06 A/shift AT3552R-BS9U SOAP003 03/03/06 B

Defect bin mapping: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

A 1 1
B 1 1
C 1 1
609GPL D 1
E 1
F 46 1 1

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
A 1 1 1 1 1 1 1 1 1 1 1 1 1
B 1 1 1 1 1 1 1 2 1 1 1 1
C 1 1 1 1 1 1 1 1 1 1 1 1

609FLW
D
E
1
1
1
1
1
1
1
1
1
1
2
1
1
1
2
1
1
1
1
1
1
1
1
1
Remarks: Based on
F 1 45 1 1 2 1 2 1 1 1 1 1 2 1 2 the bin mapping done,
defect are localized on
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Site 25 - Column 8
(Pin#1 side) with
A
B
C respect to mold strip
608ENP orientation.
D
E
F

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
A 3
B 1 1 1 1
C 2 1

609LDY D
E
2 1 1

F 4 65 1

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 Atmel DB10 failures at test

Defect manifestation:
XRAY:

X-ray photo on affected units shows that defect are common on quadrant 3 of the dice.

SEM PHOTO:

SEM photo shows no direct wire disturbance encountered on the affected PINS.

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 Atmel DB10 failures at test

Product OCAP on SOAP003 (dedicated mold machine for atmel lots):

TEST ILN ILN WB machine Remarks
607E186301 soks 320 w/o same defect locality
607E2115 SOKS 69 with same defect locality
607E211204 SOKS 69 with same defect locality
609GPL 607E1874 soks374 Affected lot
607E137501 SOKS 307 w/o same defect locality
607E186201 SOKS 307 w/o same defect locality
607E138603 SOKS375 w/o same defect locality
607E186704 soks368 w/o same defect locality
607E185903 soks 329 w/o same defect locality
609FLW 607E2113 SOKS 505 Affected lot
607E0760 soks 379 w/o same defect locality
607E186103 SOKS 375 w/o same defect locality
607E208602 SOKS 388 w/o same defect locality
607E211002 s-201 with same defect locality
608ENP 607Z3425 bks8-63 Affected lot (not strip test)
607Z859402 s-506 w/o same defect locality
608E057401 SOKS 386 w/o same defect locality
608Z7057 SCKS 009 with same defect locality
608E1259 SOKS 319 w/o same defect locality
608E125801 soks 506 w/o same defect locality
609LDY 607Z860801 soks 534 Affected lot
608E125703 S388 w/o same defect locality
608Z705702 PDKX005 with same defect locality
608Z407903 S298 w/o same defect locality

Other lots were seen to have the same reject locality on column 8 with respect to mold strip orientation.

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 Atmel DB10 failures at test

WB process mapping

6 7

5 8

4 9

3 10

2 11

1 12
At bond site

At WB, there is a total of twelve sites per index. Units

are bonded one site at a time

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 Atmel DB10 failures at test

WB process mapping

After bonding
Bonding is done per index at a time, after bonding the twelve sites, leadframe is index
for the next twelve sites.

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 Atmel DB10 failures at test

WB process mapping

indexing

Units are bonded as per site per index per strip

and it is done one at a time. Bonding is

OUTPUT MAGAZINE
continues until all units on each leadframe is
completed.

Leadframe indexing direction

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 Atmel DB10 failures at test

WB process mapping

At the output magazine

After bonding all the units of each leadframe, it is indexed into the
output magazine.

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 Atmel DB10 failures at test

Observations:

Affected units with DB10 failures are seen localized at one site (column 8) per leadframe as per bin mapping.

Product OCAP done on SOAP003 (dedicated mold machine for atmel) shows that other lots processed have reject
occurrence with the same locality per site with respect to mold strip orientation.
Different WB machines were used in processing the affected lots and even the lots identified with the same
reject locality per strip..
No external anomalies was observed on the affected units.
X-ray results shows that defect are most likely seen on quadrant 3 of the die.

SEM Photo shows no direct force disturbance on the affected wires.

Based on the WB process mapping done, reject locality per leadframe is not most likely to happen at WB station
since bonding is done per site per index per leadframe. Bonding is done one unit at a time.

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 Atmel DB10 failures at test

Mold process mapping on location of the site #25

POTENTIAL ROOTCAUSE OF THE PROBLEM : ANALYSIS / SUMMARY:

• Based on the L/F P&P (Pick & Place) Assy mapping with actual strip
• There are two sections from which has high possibility of direct
detected with failure, see below L/F gripper location with respect to strip
mechanical contact with the unmolded units: 1) L/F Gripper /
column
Handler Section and 2) Pick and Place Onload Section
• Both sections have leadframe pick and place assembly

Lead Frame Pick and Place Assembly

1.9060”

Wire to Pad clearance 25 - 27 mils

Lead Frame
clearance
Pick & Place FRONT VIEW Leadframe/
Assy Gripper Unmolded strip Pad Stopper
Observation:
- Dimensional analysis of l/f clearance to the base of the pick and place is
too tight. (standard
____ mils max
looping height
____ max die thickness
+ 1 mil epoxy height
____ mils max Column Column Column Column Column
Die to Pad construction down set #2 Area #6 Area #13 Area # 20 Area # 28 Area

Probable Contributing Factor for the Direct Mechanical
Contact with unmolded units :
• Wire in contact with pick and place pad if maximum loop height is deviated
• Wire to Pad contact when lead frame in process is warp/deformed.
• Wire to pad stopper contact during lead frame inclination/misalignment
• All of which will have evident wire defect manifestation
• As per L/F P&P Assy mapping with respect to affected strip, the columns
with mechanical contact is far from the affected units hilited which is at
column #25
• No other mechanical tool comes close with the units from column #08
unless there is warped/leadframe present or misalignment / mislaoding
occurrence

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 Atmel DB10 failures at test

Mold process mapping on location of the site #25

ANALYSIS / SUMMARY: ANALYSIS / SUMMARY:

• Based on the dimension and illustration of L/F P&P (Pick & Place) Assy, • However, the Leadframe Roller Guide during onload appears to have
there is enough clearance from which the wire will not touch the pad ceiling contact with side #25 of the leadframe
of the L/F P&P (Pick & Place) Assy otherwise depressed wire will be
manifested

L/F Gripper Slot

L/F Roller Guide
L/F Gripper

• The L/F Gripper holds the leadframe from underneath the whole strip’s rail
(pls refer to Lead Frame Pick and Place Assembly illustration) with full
gripper support
• Simulation on the Leadframe Roller Guide is performed to determine the
• All L/F grippers have respective L/F gripper slots from which any mis- contribution of the site location and manifestation of the wire problem
alignment will not lift/transfer the unmolded strip to succeeding section
Site #25
• Any mechanical intervention shall result first to wiring anomaly with gross
reject manifestation
• No direct mechanical contact to unit as per strip mapping column #25 (pls
see reject verification mapping)

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 Atmel DB10 failures at test

Mold Simulation

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 Atmel DB10 failures at test

Mold Simulation

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 Atmel DB10 failures at test

Mold Improvement Action:

• Optimize the Leadframe Roller Guide downward movement to lessen the force applied on the leadframe eventually on the wire and ball of the units
RESP: GVALE / ESALO WHEN: WW10`06 STATUS: DONE

• Fan-out to other applicable automold machine the Leadframe Roller Guide optimized downward movement
RESP: GVALE / ESALO WHEN: WW11`06 STATUS: ON-GOING

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