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Microwave solid state devices have replaced electron beam devices for applications requiring low power due to their small size, light weight, high reliability, low cost, and ability to be incorporated into integrated circuits. Key solid state devices include crystal diodes for mixing and detection, Schottky diodes, PIN diodes for attenuation, modulation, switching and phase shifting, and varactors for frequency multiplication and parametric amplification. Gunn diodes are important as they exhibit negative resistance and can be used for oscillation and amplification at microwave frequencies based on the transfer of electrons between valleys in their semiconductor bandstructure.
Microwave solid state devices have replaced electron beam devices for applications requiring low power due to their small size, light weight, high reliability, low cost, and ability to be incorporated into integrated circuits. Key solid state devices include crystal diodes for mixing and detection, Schottky diodes, PIN diodes for attenuation, modulation, switching and phase shifting, and varactors for frequency multiplication and parametric amplification. Gunn diodes are important as they exhibit negative resistance and can be used for oscillation and amplification at microwave frequencies based on the transfer of electrons between valleys in their semiconductor bandstructure.
Microwave solid state devices have replaced electron beam devices for applications requiring low power due to their small size, light weight, high reliability, low cost, and ability to be incorporated into integrated circuits. Key solid state devices include crystal diodes for mixing and detection, Schottky diodes, PIN diodes for attenuation, modulation, switching and phase shifting, and varactors for frequency multiplication and parametric amplification. Gunn diodes are important as they exhibit negative resistance and can be used for oscillation and amplification at microwave frequencies based on the transfer of electrons between valleys in their semiconductor bandstructure.
• A wide range of microwave semiconductor devices have
been developed since 1960s for detection, mixing, frequency multiplication, phase shifting, attenuating, switching, limiting, amplification and oscillation. • In most of the low power applications, solid state devices have replaced electron beam devices becoz of the advantage of their small size ,light weight ,high reliability, low cost and capability of being incorporated into microwave integrated circuits. • Crystal diodes For mixing & detection • Schottky diodes
• Historically microwave generation and amplification
were accomplished by means of velocity modulation theory. • This is done by different microwave tubes like two cavity klystron and amplifier ,TWT etc. • However in the past two decades, microwave solid state devices-such as tunnel diodes, Gunn diodes ,transferred electron devices have been developed to perform these functions. Classification of solid-state devices
•Based on their electrical behaviour
Non-linear resistance type - ex: Varistor(variable resistor) Non-linear reactance type - ex: Varactors(variable reactor) Negative resistance type - ex: Tunnel diode, Gunn diode, IMPATT diode Controllable impedance type - ex: PIN diode TEDs(Transfer electron devices)
•Based on the negative resistance type,
Microwave solid state devices are classified into two major types: Transfer –electron devices (TEDs) Avalanche transit-time devices . TEDs
• Transferred electron Devices(TEDs) or Gunn diodes are one
of the most important microwave devices used as local oscillators and as power amplifiers. • TEDs operate with ‘hot’ electrons whose energy is very much greater than the thermal energy. • Unlike transistors ,the Gunn diodes are bulk effect devices. • The Gunn diode is fabricated from compound semiconductors such as gallium-arsenide(GaAs),Indium phosphide(InP) or cadmium Telluride(CdTe). • J.B.Gunn discovered microwave oscillation. Importance of negative resistance
• In a positive resistance , the current through the resistance and
voltage across it are in phase. • The voltage drop across it is positive and a power of I2R is dissipated in the resistor. • In a negative resistance , the current and voltage are out of phase by 180o. • The voltage drop across it is negative and a power of (-I2R) is generated by the power supply associated with the negative resistance. • In other words: Positive resistance absorb power Negative resistance generate power Gunn effect Gunn discovered periodic fluctuations of current passing through the N-type Gs As specimen when the applied voltage exceeded a certain critical value.(corresponding to an EF of 2-4 Kv/cm).This is called Gunn effect. RWH theory This Gunn effect can be explained on the basis of two valley theory of Ridley-Watkins-Hilsum(RWH theory) or the transferred electron mechanism. • These are semiconductors having a closely spaced energy valley in the conduction band. • When a dc voltage is applied across the material ,an electric field is established across it. • At low E field in the material ,most of the electrons will be located in the lower valley. • At higher E field ,most of the electrons will be transferred into the high energy upper valley where the effective electron mass is larger and hence electron mobility is lower than that in the lower valley. • Since the conductivity is directly proportional to the mobility, the conductivity and hence the current decreases with an increase in E field or voltage in an intermediate range , beyond a threshold value Vth as shown in fig.
• This is called the transferred electron
effect and the device is also called ‘Transfer Electron Device’ (TED) or Gunn diode. • Thus the material behaves as a negative resistance device over a range of applied voltages and can be used in microwave oscillators. • The basic structure of a Gunn diode is shown in fig.,which consists of n-type GaAs semiconductor with regions of high doping(n+).
• Although there is no junction,
this is called a diode w.r.t the positive end(anode) and negative end(cathode) of the dc voltage applied across the device. • If a voltage or an EF at low level is applied to the GaAs, initially the current will increase with a rise in the voltage. • When the diode voltage exceeds a certain threshold value, Vth. a high EF (3.2kv/m for GaAs) is produced across the active region and electrons are excited from their initial lower valley to the higher valley, where they become virtually immobile. • If the rate at which electrons are transferred is very high , the current will decrease with increase in voltage ,resulting in equivalent negative resistance effect. • Since GaAs is a poor conductor, considerable heat is generated in the diode. • The diode should be well bonded into a heat sink (Cu-stud).