“INSIGHT”

TEAM- ZHCET

TEAM MEMBERS

PRATEEK RAKESH SINGH prateekrakesh90@gmail.com 8791432018

SONAM AGARWAL snmagarwal16@gmail.com 9045430915
INTRODUCTION
A simple heat sink assembly consist
of 3 parts –
1-pcb
2-casing
3-cover
Pcb (printed circuit board ) contains
electronics and the function of casing
and the cover is to hold the pcb in
place.
Casing caries away the heat produce
by the pcb by the ic pad through
fabricated on it .
Problem
Due to non-accurate nature
of design (manufacturing
tolerances ) it is likely that
ic’s don’t remain in contact
with the ic pad and thus
leads to serious
consequences such as
overheating and failure .
 Flaws in given design
The main flaw in the given design of IC pads is
that this design is not compact.
Absence of any attaching material like nails may
be the reason due to which IC pads do not remain
intact.
Further, there are chances of error or non
accuracy in the dimensions of IC pads while
manufacturing.
 Modified design
In our design we have changed the square shaped IC pads to
circular. As in the manufacturing of a square we have to set four
dimensions. So the error in manufacturing will be four times.
However if we make the IC pads circular then we have to set only
the radius of the circle. Thus whatever error will be caused that
will only be due to the error in the radius.

To minimize the chances of misplace of IC pads we have

fabricated slots in our design and attached a nail at the bottom
so as to restrict the movement of IC pads in the horizontal
direction.

(cond.)
We have changed the design of
the square ic pad
 Slots are made to make the
upward and downward
motion of ic pad easy as we
were using spring at it’s back
and to make design more
compact
Initially our design of ic pad
was circular as shown in
picture .

Further we have make the edges of circular ic pad

and cut out rectangular small block so that they
cut the air when they will move upward and
downward and thus make the upward and
downward motion easy .
Spring at the back of ic’s pad
To make our design more
efficient we have attached an
hourglass spring to IC’s pad.

The use of hourglass springs

helps the IC pads to remain
intact with the IC’S on PCB .

How good the manufacturing be

there always remain defect and
we never have the accurate size
of ic pad so there is gap b/w the
ic and ic pad the and thus
reducing the heat transfer.
(Cond.)
 (cond.)

This manufacturing defect can be reduce by using spring .

This spring will push the ic pad if there a gap b/w ic and ic pad
occur . Thus the contact b/w ic and ic pad will maintain and
proper heat transfer will occur.

Further , We have used hourglass

spring instead of normal spring so
as to increase the contact surface
area which ensures maximum heat
transfer.
PURPOSE OF MAKING SLOTS

The purpose of making semi

circular slots in the design is
to make the upward and
downward motion of the ic
pad easy as it will easily cut
air .
 PURPOSE OF MAKING SLOTS(cond.)

R
TE D THE
BE INSER
AIL CAN
E D HERE N
T
I L IS INSER
AS NA

Hole to insert the nail can be made on the depth of each ic pad in the slots
made which will make structure more compact and pcb will remain intact
because of the nail . Nail will restrict the downward motion of the pcb the
reducing chance of gap contact b/w ic’s and ic pad
PORPOSE OF MAIKING THE RECTANGULAR BLOCK IM IC PAD

THE RECTANGULAR
BLOCK CUT OUT WILL CUT
THE AIR THUS THE
MOTION GIVEN TO IC PAD
BY COMPRESSION AND
EXTENSION OF SPRING
WILL BE EASY AND FAST
 COSTEFFECTIVE

WE HAVE JUST MODIFY THE DESIGN OF THE IC PAD

WITHOUT ADDIND ANY OTHER DEVICE THUS THE PRICE OF
OUR NEW DESIGN WILL NOT BE MUCH , AND WE HAVE
USED THE SIMPLE AND CHEP THINGH LIKE SPRING TO
REDUCE THE MANUFACTURING COST . THUS OUR
PURPOSED DESIGN IS COSTEFFECTIVE .
“THANK YOU”