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VPS Technology and Applications

Contents
Introduction
 4P Soldering Model Concept  Lead-Free Soldering Challenge

VPS technology
 Basics  VPS-Convection process comparison  Equipments facilities

Applications Conclusions Acknowledgment References

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VPS Technology and Applications

Introduction:
4P Soldering Model Concept

Electronic components

Thermal profile Soldering Process

Solder joints

Solder Paste Pad

NiAu, OSP, AgIm, HAL, Sn-Im

4P Soldering Model = 4 terms involve

PASTE-PAD-PIN-PROCESS
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Definition: Pin-Pad-Paste-Process = 4P Soldering Model variables = Key Process Input Variables (KPIV); Pad-Paste-Pin-Process Correlations Space = KPIV proposed solutions synergistically interactions and correlations space; Solder Joints Reliability Results Space = reliability function space as univoque application of KPIV solutions.

Define Reliability function R:

R=Ri(P1i,P2i,P3i,P4i) Where, P1 = P1i(gi , fi , mi ) P2 = P2i(gi, fi , si ) P3 = P3i(gi , fxi , mi ) P4 = P4i(Ti , ti ) [1] [2] [3] [4] [5]

DFM process Definition => DFM solution space => space of the possible design solutions Di being conditioned by Marketing, Business line, Manufacturing, Test, Distribution and After sale requirements.

VPS Technology and Applications

Introduction:
Lead-Free Soldering Challenge

Lead-Free Solder Material

Low Temperaturi
(<180C)
Composition Sn- 58Bi Sn- 52In Melting Point 138 118

Medium Temperature
(180-200C)
Composition Sn- 9Zn Sn- 8Zn- 3Bi Sn- 20Bi10In Melting Point 198.5 189-199

High Temperature
(200-230C)
Composition Sn- 3.5Ag Sn- 2Ag Melting Point 221 221-226

Very High Temperature

(>230C)
Composition Sn- 5Sb Sn- 80Au Sn- 25Ag10Sb Melting Point 232-240 280

Sn- 50In

118-125

143-193

Sn- 0.7Cu Sn- 3.5Ag3Bi Sn- 7.5Bi2Ag Sn- 3Ag0.5Cu Sn- 3.8Ag0.7Cu Sn- 2Ag0.8Cu- 0.5Sb

227

233

206-213

207-212

217

217

216-222

Lead-Free Soldering Process

Lead/Lead-Free Thermal profile

SAC process window is smaller in comparison with that from lead solder pastes
Max Comp Temp (260oC)

SAC

Liquidus (217+221)oC

SnPb

Liquidus (183oC)

SAC Operating Window SnPb Operating Window

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Large dispersion for temperatures at PCB surface with consequences over solder joints microstructure

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VPS Technology and Applications

Consequences:
 Increased temperature  Poor wetting  More voiding  More oxidation  Worse cosmetics  Smaller process window  Large temperature dispersion at PCB level with important modifications of the solder joints microstructure and in consequence over quality and reliability
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VPS Technology and Applications

VPS technology:
Basics

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Overview:
Condensation (Vapour Phase) and Convection

The heat transfer rates are much higher in condensation (Vapour Phase) than in convection.

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Overview:
Basic Vapour Phase
Vapour phase: A boiling fluid is creating a vapour blanket. The temperature is physically limited by the boiling point of the fluid. The electronic units are moved into the vapour, which is condensing at the (colder) electronic units. Convection: Heating elements in combination with blower motors are creating various hot air zones (forced convection). The electronic units are moved through the zones on a conveyor.
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Heating elements with different temperatures Conveyor

Air at 175C Air at 175C 300C 300C

Standby

Air 50-80C

Water Cooled Housing

Circular Water Cooling Vapour 230-240C

Condensing Fluid

Process fluid 230-240C

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Cold Board Enters Vapour Phase System

Air 50-80C

Water Cooled Housing

Circular Water Cooling

Vapour 230-240C Process fluid 230-240C

Condensing Fluid

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Board at Soldering Temperature

Air 50-80C

Water Cooled Housing

Circular Water Cooling

Vapour 230-240C Process fluid 230-240C

Condensing Fluid

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Vapour Phase thermal profiling

4. 3. 5.

2.

1.

Soft Vapour Phase movement

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VPS Technology and Applications

VPS technology:
VPS-Convection process comparison

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Thermal problems

Cold or unsoldered solder joints

Temperatures exceeding 230C drastically increase the risk of thermal damages of the board and the electronic components

Limited temperature induction increases the risk of insufficient heat transfer especially on hidden solder joints (Shadowing effect)

Popcorning

Cold Solder Joint (BGA ball)

Thermally overheated BGA ball

Cold Solder Joint (L-leaded package)

Temperature

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Wetting problems

Reduced wetting properties of lead-free solders usually require a protective gas atmosphere during the soldering process

Non Wetting of BGA ball

Bad Wetting of rectangular component

Non Wetting of L-leaded package

Bad Wetting of L-leaded package

N2 coverage

Higher process cost due to protective gas

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Increased overall machine length

To avoid solder cracks by enabling a smooth temperature ramp up the overall soldering track is further increased
Increased energy cost

Higher temperatures, larger machines, along with increased requirement for protective gas increases the already high energy requirements even higher
Increased Rework

Solder Crack in L-leaded package

Solder Crack in J-leaded package

Convection Power consumption Max Power consumption

Depending on system

Vapour Phase 0,8 - 5,5kWh 1,8 - 10,4kWh

11 - 20kWh
Depending on system

High temperatures increase the risk of severe damage to the board. Solder and wetting problems, popcorning and others increase the production cost.

>>20kWh

T >> 250C

Hot Air Rework Process of BGA

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VPS Technology and Applications

VPS technology:
Equipments facilities

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The VPS equipment and facilities

The VPS equipment IBL company: SLC309

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Vacuum applications in VPS- IBL equipment

Vacuum zone

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VPS Technology and Applications

Applications

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VPS Technology and Applications

PCB with Different Core Materials

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Pin-In-Paste
(a.k.a. Alternative Assembly and Reflow Technology, AART, and reflow soldering of through-Hole, ROT)

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Pin-In-Paste

The filling degree (Fd) of a standard PIP-joint can be calculated as follows: Fd = P/V where P= metal volume in applied paste; V= volume to fill (hole - post) P = {(Y * X* T) + [(D/2)2 * p] * Z}*m where m= metal volume in paste, normally about 50% = 0,5) Z = paste filling in hole, dimension from board surface and into the hole
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Pin-In-Paste Results

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Thermal resistance test vehicles

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High thermal resistance

Lower thermal resistance

Thermovizion analyzes

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CONCLUSIONS
 Electrical & thermal parameters depend by all P actors of the 4P Soldering Model;  The Process influence significant the solder joints reliability;  VPS soldering process contribute to the component thermal stress reduction (30C maximum difference);  VPS offer lower peak temperature & lowest T;  Vapour Phase soldering is an ideal solution for: Increased Quality Economical Production Energy Saving
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Acknowledgment
The authors are very grateful to the leading staff of IBL-Lttechnik GmbH for continuous support and collaboration to fulfill experiments used in the presented paper. Many thanks from the authors to: -Cookson Electronics which offered the solder pastes for experiments, -FELA Leiterplattentechnik GmbH, the company that supplied the glass and metal core PCBs for experiments.

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References
[1] R. Strauss, SMT Soldering Handbook, Butterworth-Heinemann Linacre House, Oxford, 1998, ISBN 0 7506 35894, pp. 179-189 [2] P. Svasta, I. Plotog, T. Cucu, A. Vasile, A. Marin, 4 P Soldering Model for Solder Joints Quality Assessment, ISSE 2009,The 32nd International Spring Seminar on Electronics Technology, 13-17 May, Brno, Czech Republic proceedings ISBN 978-80-214-3874-3. [3] I. Plotog, P. M. Svasta, N. D. Codreanu, T. C. Cucu, C. Turcu, G. Varzaru, VPS Solution for Lead-Free Soldering in EMS Industries, ESTC 2008: Vol. 1, 2, Proceedings Pages: 121-124, London 2008 [4] I. Plotog, P. M. Svasta, N. D. Codreanu, T. C. Cucu, G. Varzaru Investigations on Assembling of Electronic Packages onto Glass Substrates using Lead-free Technology, 31st International Spring Seminar on Electronics Technology, ISSE 2008, Budapest, Hungary, May, 2008, Conference proceedings, pp. 415-419. [5] H. Leicht, A Thumm, Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering, IBL-Lttechnik GmbH, www.ibl-loettechnik.de, Germany [6] FELAM Thermoline, Technical Documentation, FELA Leiterplattentechnik, 2007.

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