Ge CT Hispeed Serie NP Theory of Operation Manual

Technical
Publications
2202124
Revision 17
CT HiSpeed Series
Theory of Operation
Copyrighte 1998 2003 by General Electric Company
Operating Documentation
CT HISPEED SERIES
GE MEDICAL SYSTEMS THEORY OF OPERATION
REV 0 2202124
D THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.

WARNING D IF A CUSTOMERS SERVICE PROVIDER REQUIRES A LANGUAGE OTHER
THAN ENGLISH, IT IS THE CUSTOMERS RESPONSIBILITY TO PROVIDE
TRANSLATION SERVICES.
D DO NOT ATTEMPT TO SERVICE THE EQUIPMENT UNLESS THIS SERVICE
MANUAL HAS BEEN CONSULTED AND IS UNDERSTOOD.
D FAILURE TO HEED THIS WARNING MAY RESULT IN INJURY TO THE SERVICE
PROVIDER, OPERATOR OR PATIENT FROM ELECTRIC SHOCK,
MECHANICAL OR OTHER HAZARDS.
D CE MANUEL DE MAINTENANCE NEST DISPONIBLE QUEN ANGLAIS.

AVERTISSEMENT D SI LE TECHNICIEN DU CLIENT A BESOIN DE CE MANUEL DANS UNE AUTRE
LANGUE QUE LANGLAIS, CEST AU CLIENT QUIL INCOMBE DE LE FAIRE
TRADUIRE.
D NE PAS TENTER DINTERVENTION SUR LES QUIPEMENTS TANT QUE LE
MANUEL SERVICE NA PAS T CONSULT ET COMPRIS.
D LE NON-RESPECT DE CET AVERTISSEMENT PEUT ENTRANER CHEZ LE
TECHNICIEN, LOPRATEUR OU LE PATIENT DES BLESSURES DUES DES
DANGERS LECTRIQUES, MCANIQUES OU AUTRES.
D DIESES KUNDENDIENSTHANDBUCH EXISTIERT NUR IN

ENGLISCHER SPRACHE.
WARNUNG
D FALLS EIN FREMDER KUNDENDIENST EINE ANDERE SPRACHE BENTIGT,
IST ES AUFGABE DES KUNDEN FR EINE ENTSPRECHENDE BERSETZUNG
ZU SORGEN.
D VERSUCHEN SIE NICHT, DAS GERT ZU REPARIEREN, BEVOR DIESES
KUNDENDIENSTHANDBUCH NICHT ZU RATE GEZOGEN UND VERSTANDEN
WURDE.
D WIRD DIESE WARNUNG NICHT BEACHTET, SO KANN ES ZU VERLETZUNGEN
DES KUNDENDIENSTTECHNIKERS, DES BEDIENERS ODER DES PATIENTEN
DURCH ELEKTRISCHE SCHLGE, MECHANISCHE ODER SONSTIGE
GEFAHREN KOMMEN.
D ESTE MANUAL DE SERVICIO SLO EXISTE EN INGLS.

AVISO D SI ALGN PROVEEDOR DE SERVICIOS AJENO A GEMS SOLICITA UN IDIOMA
QUE NO SEA EL INGLS, ES RESPONSABILIDAD DEL CLIENTE OFRECER UN
SERVICIO DE TRADUCCIN.
D NO SE DEBER DAR SERVICIO TCNICO AL EQUIPO, SIN HABER
CONSULTADO Y COMPRENDIDO ESTE MANUAL DE SERVICIO.
D LA NO OBSERVANCIA DEL PRESENTE AVISO PUEDE DAR LUGAR A QUE EL
PROVEEDOR DE SERVICIOS, EL OPERADOR O EL PACIENTE SUFRAN
LESIONES PROVOCADAS POR CAUSAS ELCTRICAS, MECNICAS O DE
OTRA NATURALEZA.
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D ESTE MANUAL DE ASSISTNCIA TCNICA S SE ENCONTRA

DISPONVEL EM INGLS.
ATENO
D SE QUALQUER OUTRO SERVIO DE ASSISTNCIA TCNICA, QUE NO A
GEMS, SOLICITAR ESTES MANUAIS NOUTRO IDIOMA, DA
RESPONSABILIDADE DO CLIENTE FORNECER OS SERVIOS DE TRADUO.
D NO TENTE REPARAR O EQUIPAMENTO SEM TER CONSULTADO E
COMPREENDIDO ESTE MANUAL DE ASSISTNCIA TCNICA.
D O NO CUMPRIMENTO DESTE AVISO PODE POR EM PERIGO A SEGURANA
DO TCNICO, OPERADOR OU PACIENTE DEVIDO A CHOQUES ELTRICOS,
MECNICOS OU OUTROS.
D IL PRESENTE MANUALE DI MANUTENZIONE DISPONIBILE

SOLTANTO IN INGLESE.
AVVERTENZA
D SE UN ADDETTO ALLA MANUTENZIONE ESTERNO ALLA GEMS RICHIEDE IL
MANUALE IN UNA LINGUA DIVERSA, IL CLIENTE TENUTO A PROVVEDERE
DIRETTAMENTE ALLA TRADUZIONE.
D SI PROCEDA ALLA MANUTENZIONE DELLAPPARECCHIATURA SOLO DOPO
AVER CONSULTATO IL PRESENTE MANUALE ED AVERNE COMPRESO IL
CONTENUTO.
D NON TENERE CONTO DELLA PRESENTE AVVERTENZA POTREBBE FAR
COMPIERE OPERAZIONI DA CUI DERIVINO LESIONI ALLADDETTO ALLA
MANUTENZIONE, ALLUTILIZZATORE ED AL PAZIENTE PER
FOLGORAZIONE ELETTRICA, PER URTI MECCANICI OD ALTRI RISCHI.
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IMPORTANT! . . . X-RAY PROTECTION

X-ray equipment if not properly used may cause injury. Accordingly, the instructions herein contained should
be thoroughly read and understood by everyone who will use the equipment before you attempt to place this
equipment in operation. The General Electric Company, Medical Systems Group, will be glad to assist and
cooperate in placing this equipment in use.
Although this apparatus incorporates a high degree of protection against x-radiation other than the useful beam, no
practical design of equipment can provide complete protection. Nor can any practical design compel the operator to
take adequate precautions to prevent the possibility of any persons carelessly exposing themselves or others to
radiation.
It is important that everyone having anything to do with x-radiation be properly trained and fully acquainted with the
recommendations of the National Council on Radiation Protection and Measurements as published in NCRP Reports
available from NCRP Publications, 7910 Woodmont Avenue, Room 1016, Bethesda, Maryland 20814, and of the
International Commission on Radiation Protection, and take adequate steps to protect against injury.
The equipment is sold with the understanding that the General Electric Company, Medical Systems Group, its agents,
and representatives have no responsibility for injury or damage which may result from improper use of the equipment.
Various protective material and devices are available. It is urged that such materials or devices be used.

All electrical installations that are preliminary to positioning of the equipment at the site prepared for the equipment shall be
performed by licensed electrical contractors. In addition, electrical feeds into the Power Distribution Unit shall be performed
by licensed electrical contractors. Other connections between pieces of electrical equipment, calibrations, and testing shall
be performed by qualified GE Medical personnel. The products involved (and the accompanying electrical installations) are
highly sophisticated, and special engineering competence is required.
In performing all electrical work on these products, GE will use its own specially trained field engineers. All of GEs electrical
work on these products will comply with the requirements of the applicable electrical codes.
The purchaser of GE equipment shall only utilize qualified personnel (i.e., GEs field engineers, personnel of third-party
service companies with equivalent training, or licensed electricians) to perform electrical servicing on the equipment.
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DAMAGE IN TRANSPORTATION
All packages should be closely examined at time of delivery. If damage is apparent, have notation damage in
shipment written on all copies of the freight or express bill before delivery is accepted or signed for by a General
Electric representative or a hospital receiving agent. Whether noted or concealed, damage MUST be reported to the
carrier immediately upon discovery, or in any event, within 14 days after receipt, and the contents and containers held
for inspection by the carrier. A transportation company will not pay a claim for damage if an inspection is not requested
within this 14 day period.
Call Traffic and Transportation, Milwaukee, WI (414) 8273449 / 8*2853449 immediately after damage is found. At
this time be ready to supply name of carrier, delivery date, consignee name, freight or express bill number, item
damaged and extent of damage.
Complete instructions regarding claim procedure are found in Section S of the Policy & Procedure Bulletins.
OMISSIONS & ERRORS
GE personnel, please use the GEMS CQA Process to report all omissions, errors, and defects in this documentation.
Customers, please contact your GE Sales or Service representatives.
CAUTION
Do not use the following devices near this equipment. Use of these devices near this equipment could cause
this equipment to malfunction.
Devices not to be used near this equipment:
Devices which intrinsically transmit radio waves such as; cellular phone, radio transceiver, mobile radio transmitter,
radiocontrolled toy, etc.
Keep power to these devices turned off when near this equipment.
Medical staff in charge of this equipment is required to instruct technicians, patients an

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LIST OF EFFECTIVE PAGES
Tab Section Page REV 3 (Table/Gantry) i 13
Title page 17 General Description 11 to 13 13

Title page rear blank
SubAssembly Description 21 to 216 13
(Warning and other impor- a to d 0
4 (DAS/Detector) i 9
tant information)
General Description 11 0
(Revision Information) A to B 17
Detector 21 to 210 13
1 (System) i 16
Data Acquisition System (DAS) 31 to 316 13
General Description 11 to 16 17
5 (Xray Generator) i 12
Power Distribution 21 to 218 15
Scan Operation 31 to 310 16 General Description I 11 to 13 12
i 9 General Description II 21 to 27 12
2 (Operator Console)
General Description 11 to 18 17 Typical Signals 31 12
Host Processor 21 to 24 17 Appendix

Connector Boards 31 to 36 10 Symbols and Classification A1 to A4 0
Other OC Components 41 to 44 10 Blank/Rear cover
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REVISION HISTORY
REV Date Primary Reason for Change
17 9/11/03 System Updated: NP Linux (Sec. 1)
Operator Console Updated: NP Linux (Sec. 1, Sec.2)
16 4/15/02 System Updated: Warm up information (Sec. 3).
Operator Console
Table/Gantry
DAS/Detector
Xray Generator
15 10/04/01 System Added the new type PDU (PDU2) information (Sec. 2).
14 3/08/01 System Added the KVMA stations info for twin systems (Sec. 1).
Added: New type warmup scan, Asymmetric Scan, Twin cine scan, Auto mA (Sec, 3).
13 12/08/00 Table/Gantry Minor corrections: Sec. 1, 2.
DAS/Detector Minor corrections: Sec. 2, 3.
12 10/25/00 System Removed System Options (Sec. 1).

Minor corrections: Sec. 3.
Operator Console Minor corrections: Sec. 1.
Table/Gantry Minor corrections: Sec. 1, 2.
DAS/Detector Minor corrections: Sec. 2, 3.
Xray Generator Minor corrections: Sec. 1, 2, 3.
11 9/05/00 DAS/Detector Modified the illustration of Detector Module for Twin (Sec. 2).
10 7/5/00 System Adopted the new revision control for Sec. 1, 2, 3.
Operator Console Adopted the new revision control for Sec. 1, 2, 3, 4.
Table/Gantry Adopted the new revision control for Sec. 1, 2.
DAS/Detector Adopted the new revision control for Sec. 2, 3.
Xray Generator Adopted the new revision control for Sec. 1, 2.
9 5/19/00 Added Twin system related information.
8 4/20/00 NP++ mA.
7 2/25/00 200VPDU note.
6 12/17/99 Added a Jedi (for NP++) block diagram.
5 10/19/99 Added information about NP++ (HiSpeed ZX/i).
4 2/26/99 Hard disk capacity.
3 11/27/98 OC Vide signal specifications, other.
2 8/31/98 Revised Table/Gantry, DAS/Detector tabs.
1 7/10/98 Updated System option description; Added 200VPDU, Scan Operation, NAA1 block diagram,
ST1800 description; Generally updated DAS and XG.
0 3/27/98 Initial release.
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SYSTEM
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1-2 HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN . . . . . . . . . . . . . . . . . 12
1-3 SYSTEM OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1-4 SYSTEM SPECIFICATIONS AND DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
SECTION 2 POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

2-1 POWER DISTRIBUTION UNIT (FOR PDU1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2-1-1 Power On/Off Timing Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2-3 SAFETY LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
SECTION 3 SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3-1 WARMUP SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3-2 AXIAL SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3-2-1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3-2-2 Scan Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3-2-3 Asymmetric Scan (for Twin Systems only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3-2-4 Twin Cine Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3-2-5 Auto mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3-3 SCOUT SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
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SECTION 1 GENERAL DESCRIPTION
1-1 INTRODUCTION
The features of this CT (Computed Tomography) system, one of the HiSpeed series CT scanners, include the follow-
ing:
Workstation type information processing system,
Solidstate xray intensity detector,
Continuous rotation type gantry with slip rings and high frequency coupling.
This CT system is comprised of the following main components (called subsystems):
D Operator Console (called OC)
D Scanning Gantry (called gantry)

This subsystem further includes the following subsystems:
DAS/Detector
Xray Generator (called XG)
D Patient Table (called table)
D Power Distribution Unit (called PDU)
The system may include some of the following customer option equipments:
D Advantage Windows Image Workstation
D Image Camera
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1-2 HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN
System Notation (NP, NP+, ...)

According to system models or customer options installed on the system, a number of system specifications or func-
tions available may differ from system to system; such are:
D Selectable scan times, MA values, FOV dimensions
D Remote Tilt function
D Number of arrays of DAS/detector units, i.e., single or twin DAS/detector subsystem
D ...
However, the HiSpeed series scanners are principally grouped into four, for which the following notations are given
respectively:
NP, NP+, NP++ and Twin
In this Theory of Operation manual, these notations NP, NP+, NP++, and Twin are used to describe differences
among these four groups and to make descriptions of this manual read simpler.
(However, Twin is further grouped into two, that is, NP+ Twin and NP++ Twin. In general outline,
NP+ Twin systems are NP/NP+ systems with a twin DAS/detector, and NP++ Twin systems are NP++ systems
with a twin DAS/detector. These notations also will be used when required.)
Table 11 describes the constitution of the major hardware of NP, NP+, NP++, and Twin.
Table 11 Hardware Constitution
Subsystem/Component NP NP+ NP++ NP+ Twin NP++ Twin

OC O2 or Linux PC
Gantry Mechanics Position- Halogen Laser
ing Light Lamps
Mechanics others common
Electrics Firmware only is different.
Table IMS Standard or Option Standard Standard or Standard
(Intermediate Support) Option
Others common
DAS common twin DAS
Detector common twin detector
Xray Generator common (Jedi) NP++ Jedi Jedi NP++ Jedi
Xray Tube common (D3142T tube) D3152T D3142T D3152T
tube tube tube
PDU common
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1-3 SYSTEM OVERVIEW

Illustration 11 shows the system block diagram.
The operator console (OC) controls the entire system, according to the operators operations. The OC sends instruc-
tions to the processor of the TGP board, which then controls the gantry and table subsystems according to the instruc-
tions.
The TGP board processor also passes the OC instructions to the processor of the OGP board which is equipped on
the gantry rotative frame. The OGP board controls the DAS subsystem, the collimator aperture, or positioning lights
according to the passed instructions.
The OGP board processor also passes the instructions from the TGP board to the processor of the xray generator
subsystem. The XG processor controls the xray generator according to the instructions (originally from the OC).
Reversely, the OC receives status information from the TGP board or other processors (via the TGP board).
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Illustration 11 System Block Diagram
Power Unit Auxiliary Unit

CAN Bus (Control Bus) Gantry
Interface Board Rotative Block
Xray Generator =
KV Control Filament Board Low Voltage Rotor Board
Power Unit + Auxiliary Unit
Board + Power Supply +
Inverter Inverter
AC/DC
Converter DC Bus
Temperature
High Voltage Controller
High Voltage High Voltage Xray Tube
EMC Inverter Tank
Board Detector
RF DTRF
Board DAS
Transmitter Optical
Fiber
OGP Board Step Motor

Collimator
Coaxial
Cable Encoder
Slip Rings RF Receiver Slip Rings
Optical
Fiber SUB Board Cover Switches
TGP Board
Cover
Boards Pump/Valve for
Gantry Tilt
Tilt Pot.
Servo Servo Motor
Amp.
Encoder Gantry
Stationary Block
OPERATOR AC 115 V AC 115 V AC 200 V

CONSOLE
CDROM AC 380 480 V Power Distribution Unit (PDU)
PCI Bus
Recon
5 MOD Engine Potentiometers for Hori-
Table zontal, Height, (IMS)
Host Connector
Processor Table Board Speaker Board
Touch Sensors
Foot SW
Raw Data
Disk Latch Switches
System
Disk Cradle Encoder
DBPCI Position
Power Supply Step Motor Feedback Cradle
(DC 24 V) Driver
Step Motor
Servo Amp. Servo Motor

Pump/Valve for Feedback
Table Elevation
Keyboard For systems equipped with Intermediate
Intermediate Support (IMS) Support (IMS)
DASIFN TABLE only
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1-4 SYSTEM SPECIFICATIONS AND DATA

The following tables describe system specifications and data.
Table 12 Scan Time
Scan Time [sec]

Standard with 1.0 sec Scan with 0.8 sec Scan Standard
(NP, NP+) Option Option, NP+ Twin (NP++, NP++ Twin)
0.5 (Half scan) 0.46 (Half scan)
0.7 (Half scan) 0.8 0.7
1.0 (Half scan) 1.0 1.0 1.0
1.5 1.5 1.5 1.5
2.0 2.0 2.0 2.0
3.0 3.0 3.0 3.0
Table 13 Scan/Recon/Cal FOV
FOV for NP [cm] FOV for NP+, NP++, and Twin [cm]
(or, for NP with 50 cm FOV Option)
Scan/Recon FOV Cal FOV Scan/Recon FOV Cal FOV
PHead (18) Small (25) PHead (18) Small (25)
Head (25) Small (25) Head (25) Small (25)
Body (45.5) Large (50) Body (50) Large (50)
Table 14 Image Spatial Resolution Related
No. of Actual Scan Views No. of Detector Active Channels Recon Matrix
Full Scan Half Scan NP NP+, NP++ Twin
972 635 717 793 793 X 2 512 X 512
For 50 cm or 45.5 cm scan FOV The same type detector is used
both for NP and NP+ & NP++; the
difference between the numbers of
active channels is realized by soft-
ware.
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1-4 SYSTEM SPECIFICATIONS AND DATA (continued)
Table 15 KVMA Stations
KV MA
Standard for NP, NP+, (with 200 mA Option) (with 300 mA Option) Standard for NP++,
NP+ Twin NP++ Twin
80 60 150 60 200 60 300 60 400
120 10 150 10 200 10 300 10 440
140 10 150 10 200 10 250 10 380
Note 1: MA: in 10 mA increments. For Twin systems with V/R 5.5 or later system software, it is in 5 mA incre-
ments.
Note 2: NP++ systems use the 6.3 MHU cooling algorithm. However, one system model which is grouped into
the NP++ Twin systems and called HiSpeed NX/i Plus uses 5.3 MHU cooling algorithm. And the maximum MA
available for HiSpeed NX/i Plus is 350 mA (at 120 kV).
The system automatically selects Large Focus or Small Focus according to a slice thickness selection as described
in Table 16.
Table 16 Combination of Slice Thickness and Focus Size (for Customer)
Slice Thickness [mm] Focus Size

except for Twin Twin
1i mode (1 image/rotation) 2i mode (2 images/rota-
tion), or helical mode
1, 2 1*, 2 0.5*, 1 Small
3, 5, 7, 10 4, 6, 10 2, 3, 5, 7 Large
Note *: available with 1mm or 0.5 mm Option.
Table 17 Other Specifications
Exposure Start Angle (Axial Scan)

Head & Posteriafossa Studies:
90/270 deg.
Other Studies:
0/180 deg.
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SECTION 2 POWER DISTRIBUTION
Note
PDU stands for Power Distribution Unit. There largely exist two types of PDUs: either one of the two
is used for CT HiSpeed Series systems. In this section, abbreviations PDU1 and PDU2 are used to
distinguish one from the other, as follows:
PDU2: Its part No. is any of 2298850 (400 V, 42 kW), 2298851 (400 V, 53 kW), 2298853 (200 V, 42
kW), or 2298854 (200 V, 53 kW).
PDU1: Its part No. is 220xxxx or 224xxxx.
2-1 POWER DISTRIBUTION UNIT (FOR PDU1)

Note
For PDU2, see Section 32, Power Distribution Unit (for PDU2).
The power distribution unit (PDU) provides powers to all the subsystems.
Two types of PDUs are available: 400VPDU and 200VPDU. Either one of two types is used according to the mains
voltage (main power from the power distribution box of sites). (200VPDUs are used in Japan only.)
See Illustration 21 (400VPDU) or 22 (200VPDU). These illustrations describe the following:
D All the powers except XG Power are output from the system transformer on the PDU.
(200VPDUs generate XG Power by a stepup transformer.)
D XG Power powers the xray generator (XG) equipped on the gantry rotational block. Powers for xray
tube high voltage, xray tube anode rotation, XG control circuit boards, etc. are derived from this power.
However, the fan and pump for the xray tube are powered by SR115.
D SR115 powers all the components equipped on the gantry rotational block except the xray generator.
D TG115 powers all the components equipped on the gantry stationary block except the axial motor. The
gantry tilt pump also is operated by this power. TG115 also powers the table subsystem.
D TG200 powers the axial motor which rotates the gantry rotational block.
D OC115 supplies power to the operator console.
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2-1 POWER DISTRIBUTION UNIT (FOR PDU1) (continued)
Illustration 21 Power Distribution to Subsystems (400VPDU)
Mains Slip Rings

XG Power (AC 380 480 V)
Xray
AC 380 Generator
SR115 (AC 115 V)
480 V Sys- BRK1 Rotational Block
tem
Trans- TG115 (AC 115 V) (Stationary
SW1
former Block)
TG200 (AC 200 V)
OC115 (AC 115 V)
400VPDU BRK2
Axial
Motor
Gantry
Table
CB1 Noise To internal

Filter components
CRT
CB2 External
components
Operator Console
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Illustration 22 Power Distribution to Subsystems (200VPDU)
Mains Stepup Slip Rings

Trans- XG Power (AC 400/416 V)
former Xray
AC 200 V Generator
Sys- SR115 (AC 115 V)
BRK1 Rotational Block
tem
Trans- TG115 (AC 115 V) (Stationary
SW1
former Block)
TG200 (AC 200 V)
OC115 (AC 115 V)
200VPDU BRK2
Axial
Motor
Gantry
Table

Filter components
CRT
CB2 External
components
Operator Console
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Illustration 23 (400VPDU) or 24 (200VPDU) shows the simplified circuit diagram of the PDU.
As shown;
D (400VPDU):
The voltage of mains power should be within a range of 380 V 480 V. The system transformer provides
terminals for 380 V, 400 V, ... , 480 V to connect power to the nearest voltage terminal.
D (200VPDU):
The system transformer provides terminals for 200 V to connect power to the nearest voltage terminal.
D The SR115 output is not controlled by any relay contacts; the power is always present in the CT system
unless circuit breakers CB2 or CB5 are turned off.
D The RMT CNT board contains relays which turn on/off K5, K6, K7, or K19 according to signals from the
operator console and gantry.
D The relay K1 is turned on some delay time later after K21 is turned on.
The resisters connected to the relay K21 suppress rush currents.
Earlier PDU models have the following circuits between Mains and XG Power, instead of the circuits
shown in Illustration 23 or 24. (The relay K20 is turned on some delay time later after K1 is turned on.
The resisters connected to the relay K20 suppress rush currents.)
Mains K1 K20 XG Power
CB1
CB2
However, the further earlier PDU models do not have K20 and connected resisters.
D Circuit breakers CB1, CB2, ... , CB6 can turn OFF powers, as written below:
CB1: XG Power
CB2: TG200, TG115, SR115, OC115
CB3: TG200
CB4: TG115
CB5: SR115
CB6: OC115
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Illustration 23 Inside of PDU (400VPDU)
Mains (3 Phase,
380 480 V) K1 XG Power
CB1 K21 F10
System
CB2 Transformer
480
CB3 K2 TG200
200
460
440 CB4 K3 TG115
415 115
400
380 CB5 SR115
0
0
CB6 K4 OC115
CB1 CB6: Circuit Breakers
PON
FAN AL
K19 K1
From
OC EOFFO RMT CNT K7 K4
Board
RSTEM K6 K3 K2
SAFEO
K5 K21
SAFEG
From RSTEMG (The above means: for example,
Gantry When K6 is turned on, then K3
EOFFG and K2 are turned on.)
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Illustration 24 Inside of PDU (200VPDU)
Mains (3 Phase,
200 V) K1 XG Power
Stepup
Transformer
CB1 K21 F10
System
CB2 Transformer
200
CB3 K2 TG200
200
CB4 K3 TG115
115
CB5 SR115
0
0
CB6 K4 OC115
CB1 CB6: Circuit Breakers
PON
FAN AL
K19 K1
From
OC EOFFO RMT CNT K7 K4
Board
RSTEM K6 K3 K2
SAFEO
K5 K21
SAFEG
From RSTEMG (The above means: for example,
Gantry When K6 is turned on, then K3
EOFFG and K2 are turned on.)
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2-1-1 Power On/Off Timing Chart

The power on/off controls of XG Power, TG200, TG115, etc. shown in Illustration 21 or 23 (or, 22 or 24, for
200VPDU) are shown in Illustration 25.
In the illustration;
EOFF turns close or open when either EOFFO or EOFFG turns close or open.
That Safety Loop turns close or open means the system safety loop is closed or opened, including both SAFEO
and SAFEG turns close or open. (See the Safety Loop description on page 218)
Reset Emergency turns close or open when either RSTEM or RSTEMG turns close or open.
Illustration 25 describes the following:
D Timing B:
Only when Safety Loop turns close, XG Power turns ON.
D Timing E:
When EOFF turns open, XG Power, TG200, and TG115 turn OFF; however, OC115 remains ON.
If pins 1 and 2 of JP1 are shorted on the RMT CNT board and the TGP board is at revision 4 or later (has
a cradle emergency deceleration function), TG200 and TG115 turn OFF 0.4 sec 0.5 sec later after
EOFF turns open; during this period, the cradle is decelerated to a halt.
D Timing I:
When Reset Emergency turns open, TG200 and TG115 are brought to ON.
D Timing J:
When FAN AL turns open, XG Power, TG200, TG115 and also OC115 all turn OFF.
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Illustration 25 Power Distribution Sequence
A B C D E F G H I J K L M N
close
P ON open
close
EOFF open
close
Safety
Loop open
close
Reset
Emergency
open
close
FAN AL open
ON
OC115 OFF
ON
XG Power OFF
ON
SR115 OFF
ON
TG200 OFF
ON
TG115 OFF
Pins 2 and 3 of JP1 are shorted on the RMT CNT board.
ON
TG200 OFF
ON
TG115 OFF
Pins 1 and 2 of JP1 are shorted on the RMT CNT board; and the TGP board is
at revision 4 or later (has a cradle emergency deceleration function).
Note
Safety Loop is always closed in normal conditions after the system is switched ON or reset; this
means that XG Power is always supplied to the gantry in normal conditions.
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2-2 POWER DISTRIBUTION UNIT (FOR PDU2)

Note
For PDU1, see Section 2-1, Power Distribution Unit (for PDU1).
The power distribution unit (PDU) provides powers to all the subsystems.
Two types of PDUs are available: 400VPDU and 200VPDU. Either one of two types is used according to the mains
voltage (main power from the power distribution box of sites). (200VPDUs are used in Japan only.)
See Illustration 2-6 (400VPDU) or 2-7 (200VPDU). These illustrations describe the following:
All the powers except XG Power are output from the system transformer on the PDU.
(200VPDUs generate XG Power by a step-up transformer.)
XG Power powers the x-ray generator (XG) equipped on the gantry rotational block. Powers for x-ray
tube high voltage, x-ray tube anode rotation, XG control circuit boards, etc. are derived from this power.
However, the fan and pump for the x-ray tube are powered by SR115.
SR115 powers all the components equipped on the gantry rotational block except the x-ray generator.
TG115 powers all the components equipped on the gantry stationary block except the axial motor. The
gantry tilt pump also is operated by this power. TG115 also powers the table subsystem.
TG200 powers the axial motor which rotates the gantry rotational block.
OC115 supplies power to the operator console.
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2-2 POWER DISTRIBUTION UNIT (FOR PDU2) (CONTINUED)
Illustration 2-6 Power Distribution to Subsystems (400VPDU)
Mains Slip Rings

XG Power (AC 380 ~ 480 V)
X-ray
AC 380 Generator
SR115 (AC 115 V/120 V)
- 480 V Sys BRK1 Rotational Block
tem
Trans TG115 (AC 115 V) (Stationary
former SW1
Block)
TG200 (AC 200 V)
OC115 (AC 115 V)
400VPDU
BRK2
Axial
Motor
Gantry
Table

Filter components
CRT
CB2 External
components
Operator Console
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Illustration 2-7 Power Distribution to Subsystems (200VPDU)
Mains Step-up Slip Rings

Trans XG Power (AC 400 V)
former X-ray
AC 200 V Generator
Sys SR115 (AC 115 V/ 120 V)
BRK1 Rotational Block
tem
Trans TG115 (AC 115 V) (Stationary
former SW1
Block)
TG200 (AC 200 V)
OC115 (AC 115 V)
200VPDU BRK2
Axial
Motor
Gantry
Table

Filter components
CRT
CB2 External
components
Operator Console
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Illustration 2-8 (400VPDU) or 2-9 (200VPDU) shows the simplified circuit diagram of the PDU.
As shown;
(400VPDU):
The voltage of mains power should be within a range of 380 V 480 V. The system transformer provides
terminals for 380 V, 400 V, ... , 480 V to connect power to the nearest voltage terminal.
(200VPDU):
The system transformer provides a terminal for 200 V to connect the mains power.
The SR115 output is not controlled by any relay contacts; the power is always present in the CT system
unless circuit breakers CB2 or CB5 are turned off.
The relay K1 is turned on some delay time later after K11 is turned on.
The resisters connected to the relay K11 suppress rush currents.
Circuit breakers CB1, CB2, ... , CB6 can turn OFF powers, as written below:
- CB1: XG Power
- CB2: TG200, TG115, SR115, OC115
- CB3: TG200
- CB4: TG115
- CB5: SR115
- CB6: OC115
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Illustration 2-8 Inside of PDU (400VPDU)
Mains (3 Phase,
380 ~ 480 V) K1 XG Power
CB1 K11 F1
System
CB2 Transformer
480
200 CB3 K2 TG200
460 120
440 CB5 SR115
415 115
400
380 CB4 K2 TG115
0
0
CB6 K3 OC115
CB1 ~ CB6: Circuit Breakers
P-ON
FAN AL
K19 K1
From
OC E-OFF-O RMT CNT K7 K3
Board
RST-EM K6 K2
SAFE-O
K5 K11
SAFE-G
From (The above means: for example,
RST-EMG When K6 is turned on, then K2
Gantry
are turned on.)
E-OFF-G
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Illustration 2-9 Inside of PDU (200VPDU)
Mains (3 Phase,
200 V) K1 XG Power
Step-up
Transformer
CB1 K11 F1
System
CB2 Transformer
200
200 CB3 K2 TG200
120
CB5 SR115
115
CB4 K2 TG115
0
0
CB6 K3 OC115
CB1 ~ CB6: Circuit Breakers
P-ON
FAN AL
K19 K1
From
OC E-OFF-O RMT CNT K7 K3
Board
RST-EM K6 K2
SAFE-O
K5 K11
SAFE-G
From (The above means: for example,
RST-EMG When K6 is turned on, then K2
Gantry
are turned on.)
E-OFF-G
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2-2-1 Power On/Off Timing Chart

The power on/off controls of XG Power, TG200, TG115, etc. shown in Illustration 2-6 or 2-8 (or, 2-7 or 2-9, for
200VPDU) are shown in Illustration 2-10.
In the illustration;
E-OFF turns close or open when either E-OFF-O or E-OFF-G turns close or open.
That Safety Loop turns close or open means the system safety loop is closed or opened, including both SAFE-
O and SAFE-G turns close or open. (See the Safety Loop (2-3) description)
Reset Emergency turns close or open when either RST-EM or RST-EMG turns close or open.
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Illustration 2-10 Power On/Off Timing Chart
INPUT Control
PON SW
E-OFF
Safety-Loop
RESET Emer
FAN ALA
OUTPUT Control
OC115(K3)
XG400(K1)
Resistor(k11)
Pins 1 and 2 of JP1 are shorted on the RMT board

Timer1(Smart Gantry)
TG115(K2)
TG200(K2)
Timing2(general)
TG115(K2)
TG200(K2)
Note
Safety Loop is always closed in normal conditions after the system is switched ON or reset; this
means that XG Power is always supplied to the gantry in normal conditions.
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2-3 SAFETY LOOP

Illustration 211 shows a diagram of the system safety loop.
As shown, components on the gantry rotational block are not involved in the safety loop.
Illustration 211 Safety Loop
TGP
Switch on the Board
Gantry Rear Base
SAFEG
Gantry
RMT CNT PDU

Board Operator Console
Host
Processor
REAR CN1
Board PCI Bus
SAFEO DBPCI
Board
K5
Relays K1 XG Power
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2-3 SAFETY LOOP (continued)
Open of Safety Loop

The safety loop can be opened by any of the following:
D Switch equipped on the gantry rear base.
D Control by the TGP board:

The TGP board opens the safety loop in any of the following cases:
When the TGP board receives from the OGP board a safety loop open demand due to an overtime
of xray exposure.
When the TGP board detects abnormal communication with the OGP board or the operator con-
sole (host processor) during xray exposure.
D Control by the host processor (i.e., system software):

The host processor opens the safety loop in any of the following cases:
When the host processor receives a safety loop open demand from the TGP board.
When the host processor detects an overtime of xray exposure.
When the host processor detects an extra scan (other than scans which the host processor
instructed the TGP board to perform) performed.
D Signals such are EOFF, FAN AL, etc.
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SECTION 3 SCAN OPERATION
3-1 WARMUP SCAN
for Systems with earlier than V/R 5.5 System Software

The system requires the Warmup scans to warmup the xray tube prior to starting the first scan after poweron,
or when more than two hours have elapsed since the last scan.
The warmup scans also have to be performed before performing phantom calibration which updates the calibration
files (CAL files), if more than three hours have elapsed since the last scan.
The following scans are performed during the warmup scan sequence.
Table 31 Warmup Scans (earlier than V/R 5.5)
Purpose No. of Scans

for xray tube warming (Until the anode temperature
reaches 48%.)
for calibration 3
The first series of scans warmup the xray tube.
During the last three scans the system collects data to analyze it, and update CAL files:
The system stores the data and checks whether the data falls within the specified range. If the data is out of range,
the system reports a WARMUP ERROR. If the data is within range, the system compares the data with the previous
warmup data and calculates correction factors for CAL files, and updates them.
Illustration 31 shows the warmup scan sequence.
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3-1 WARMUP SCAN (continued)
Illustration 31 Warmup Sequence
Start
Tube warmup
scans
Error Message
Error & Yes

Error code Any error?
No Raw Data Disk
Scans &

Data collection

Raw data
files
Data check
Error Message
Warmup No Within
Error range?
CAL
Yes files
Calculates
correction
factors System Disk
CAL files
correction
End
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for Systems with V/R 5.5 or later System Software

The system requires the Warmup scans to warmup the xray tube prior to starting the first scan after poweron,
or when more than two hours have elapsed since the last scan.
The warmup scans also have to be performed before performing phantom calibration which updates the calibration
files (CAL files), if more than three hours have elapsed since the last scan.
The operator selects either the Tube Warmup or Daily Calibration warmup scans, as listed in Table 32.
Table 32 Warmup Scans (V/R 5.5 or later)
Type Purpose No. of Scans No. of Scans No. of Scans

(For Twin Detector (For Single Detector (For Single Detector
System) System for V/R System for V/R 6.03 or
6.006.02) later)
Tube for xray tube (Until the tube case tem- (Until the tube case tem- (Until the Anode temper-
Warmup warming perature reaches 13%.) perature reaches 13%.) ature reaches 48%.)
Daily Cal- for xray tube (Until the tube case tem- (Until the tube case tem- (Until the Anode tempera-
ibration warming perature reaches 30%.) perature reaches 30%.) ture reaches 48%.)
for calibration 11 (Max.) 1
and xray align- Including 8 scans (calibration) 10mm scan only
ment + 3 scans (Xray alignment)
Using 10 mm scan data, warmup error is analyzed.
Calibration scans contain
10mm, 7mm, 5mm, 3mm, 2mm,
1mm, 0.5mm, and Asymmetric
scans. (0.5mm and Asymmetric
are optional.)
Using 7 mm scan data, warm
up error is analyzed.
for system diag- 6 4

nostics (IQ Per- 1 scan for Offset Mean and SD 1 scan for Offset Mean and SD
formance Mea- 3 scans for Ratio 3 scans for Ratio
surement Scan) 1 scan for A/B ratio
1 scan for Zaxis collimator
step operation
The Tube Warmup type scans or the first series of scans of Daily Calibration warmup the xray tube.
This means that Tube Warmup only warms the xray tube.
During the scans for calibration (eight scans) the system collects data to analyze it, and update CAL files:
The system stores the data and checks whether the data falls within the specified range. If the data is out of range,
the system reports a WARMUP ERROR. If the data is within range, the system compares the data with the previous
warmup data and calculates correction factors for CAL files, and updates them.
During the scans for xray alignment (three scans), the system collects data to analyze the xray alignment.
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IQ Performance Measurement Scan

During the IQ Performance Measurement scans the system collects data to analyze it, and displays the result in the
Status column.
Analyzed data: Offset mean, Offset SD, Stability of air calibration, mAdependent DAS linearity variation, Scan time
dependent DAS linearity variation, A/B ratio.
For details, refer to the Home descriptions, in Section Service Tool, System tab, of the Diagnostics manual.
Warmup Error Analysis

The analysis for detecting warmup error is performed using 7 mm scan data (for Twin) or 10 mm scan data (for
Single):
Analysis Items Descriptions Specifications

Ref Count Reference count after offset file correction 3000 ~ 60000
SD/MEAN SD/Mean value after offset file and refer- 0 ~ 0.03
ence corrections
Ratio Mean after offset file and reference 0.95 ~ 1.05
correction / Mean at last daily calibration
HPF (Ratio) HPF of Ratio 0.01 ~ 0.01
Aperture Check Ratio between [Channel data at the 1/4 0.5 ~ 1.5
intervals from 1st view] and [Mean value
of all views]
When you analyze a warmup calibration file, convert the related vector file into the Mean file, then use the Generic
System Analyzer of the Service tool.
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3-2 AXIAL SCAN
3-2-1 General
Prior to the actual xray exposure, the system collects 256 views of offset data generated from the DAS. The offset
data is used to correct actual xray data.
The system performs a full 360 deg. scan (clockwise direction only) during 0.7 (for NP++, NP++ Twin only), 0.8, 1.0,
1.5, 2.0, or 3.0 sec. These are called scan speeds or scan times, and not all of the them are available to all the systems;
the available scan speeds or times vary according to system models or options installed on the systems.
During a scan, the system collects 972 views of data. A view period differs according to the scan speed. The following
table shows this relation:
Scan Speed (sec) View Period (sec/view)

0.7 (NP++, NP++ Twin only) 720
0.8 823
1.0 1029
1.5 1543
2.0 2058
3.0 3086
The view period is synchronized with the azimuth encoder pulse.
Axial scans are initiated from either 0 deg. or 180 deg. azimuth angle except for helical scans; during helical scans,
scans can be initiated from any azimuth angle.
The system knows gantry azimuth position by azimuth encoder pulse counts and the Gantry Pulse which indicates
that the gantry azimuth is at this moment at 0 deg., i.e., home position).
3-2-2 Scan Sequence

Illustration 32 shows the axial scan sequence.
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3-2 AXIAL SCAN (continued)
Illustration 32 Axial Scan Sequence
Parameters (Yes)
change?
Scan parameters setting (KV, MA, Slice Thickness, Scan Time, Slice Interval)
(No)
Cradle positioning (Patient is moved into the gantry scan plane)
Rotor start (The rotor is accelerated to operation speed)
Gantry acceleration (Gantry is accelerated to the constant scan speed)
Offset data collection (256 views of offset DAS data are collected )
High Voltage ON (Start xray exposure)
Das enable (DAS is enabled to collect data)
Data collection (972 views of actual DAS data are collected;

view period is synchronized with gantry azimuth position)
High Voltage OFF
Gantry deceleration
(Yes)
Next scan?
(No)
End
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3-2-3 Asymmetric Scan (for Twin Systems only)
Asymmetric Mode
In scanning, you can choose either symmetric or asymmetric slices from the twindetector.
There are three choices in the Asymmetric Mode.
D [ OFF ] mode : (Symmetric is OFF) acquires slices with the same thickness (symmetric).
D [ 10:1 ] ([ 10:2 ], [ 6:1 ]) mode : acquires slices with different thickness (asymmetric).
[ 10:1] : provides 10 mm and 1 mm slices.
Illustration 33 shows how asymmetric slices are obtained.
In Asymmetric Mode, the slice, whose thickness is shown at the Axial Thickness field, asymmetrically straddles the
center of the twindetector. This slice is called fused, whereas the other thinner slice is derived from one detector.
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Illustration 33 Asymmetric Slice
Asymmetric slices of [10:1]

Collimator
Radiation area
Center between
detectors A and B
1mm slice
9mm
Detector A Detector B
10mm slice

Collimator
Radiation area
Center between
detectors A and B
2mm slice
8mm
10mm slice

Collimator
Radiation area
Center between
detectors A and B
1mm slice
5mm
6mm slice
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3-2-4 Twin Cine Scan

In Cine scan, continuous multiple 360degree data acquisition is achieved without table travel or at the same location.
In Twin Cine scan, images are displayed in the 1i mode during prospective recon; on the other hand, in retrospective
recon, images from Detector A and images from Detector B can be displayed alternately (2i mode).
The 1i mode display is also possible in retrospective recon.
3-2-5 Auto mA
The Auto mA feature enables the system to reduce mA and patient dose with negligible effect on image quality. The
system varies mA according to patient shape and a predetermined algorithm for scan location.
The Auto mA feature requires one Scout scan, either AP or LAT in the illustration below, to obtain necessary informa-
tion on Xray attenuation. (The last scout scan data is used for the Auto mA scan.)
The system automatically increases mA at the scan locations where Xray attenuation is relatively high and de-
creases mA at the scan locations where Xray attenuation is relatively low. In the example below, the mA is set low
at the start scan location (lung area), then the mA will increase at the location of liver area, and then it will decline at
the location of abdomen area.
Illustration 34 Auto mA
0degree Scout (AP)
Tube
Patient 90degree Scout (LAT)

Tube
Start End
mA
0 Scan location
Start End
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3-3 SCOUT SCAN

Prior to the actual xray exposure, the system collects 64 views of offset data generated from the DAS. The offset
data is used to correct actual xray data.
The system advances the cradle and collects data from 793 (or 717 for NP) active channels. The cradle speed is
75 mm/sec, and data collection timing is synchronized with the cradle encoder pulse.
Illustration 35 shows the scout scan sequence.
Illustration 35 Scout Scan Sequence
Scan parameters setting (KV, MA, Scan Range)
Cradle positioning (Cradle is moved to the Start + 20 mm position)
Rotor start (The rotor is accelerated to operation speed)
Offset data collection (64 views of offset DAS data are collected )
Cradle acceleration (Cradle is accelerated to the constant scan speed)
High Voltage ON (Start xray exposure)
Das enable (DAS is enabled to collect data)
Data collection (Actual DAS data are collected;

view period is synchronized with cradle position)
High Voltage OFF
Cradle Stop Start

Cradle position
move start Cradle stop
High DAS
Voltage enable
ON
Data collection
Cradle
acceleration
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SYSTEM
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1-2 HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN . . . . . . . . . . . . . . . . . 12
1-3 SYSTEM OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1-4 SYSTEM SPECIFICATIONS AND DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
SECTION 2 POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

2-3 SAFETY LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
SECTION 3 SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3-1 WARMUP SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3-2 AXIAL SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3-2-1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3-2-2 Scan Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3-2-3 Asymmetric Scan (for Twin Systems only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3-2-4 Twin Cine Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3-2-5 Auto mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3-3 SCOUT SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 310
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1-1 OVERVIEW
The information processing system (operator console) is based on the PCI (Peripheral Component Interconnect) bus
architecture.
The host processor of the operator console is a Unix workstation, which is on the market.
(Workstation: The physical hardware that contains the CPU and graphics boards, a system disk, and a power supply.
You connect it to a monitor, keyboard, and mouse to configure a working system.)
The model type of this workstation is called O2.
Illustration 11 or 12 shows a block diagram of the operator console of this CT system.
O2 System Software (For O2 ONLY)

O2 System Software is the standard IRIX operating system software for the O2 and Silicon Graphics tools that come
on the system disk and on the CDROM that you use in the event of a system crash.
(IRIX: Silicon Graphicss version of the UNIX operating system)
PCI Bus
PCI stands for Peripheral Component Interconnect a bus specification. The PCI bus is a highperformance local
bus used to connect peripherals to memory and a microprocessor. A wide range of vendors make devices that plug
into the PCI bus.
The PCI bus can be operated at its intended highperformance by using DMA transfers.
To perform DMA transfers with the PCI bus, a DMA controller should be equipped on the connected peripheral.
Address Map
For a PCI bus based computer system, memory address mapping and I/O address mapping of PCI devices are deter-
mined during Configuration Cycle which the host processor generates when the system is powered on. Each of the
PCI devices requests its required address space size from the host processor during the cycle.
The PCI devices also (such are DBPCI, NPRIF, others) within this operator console are relocatable in the PCI address
space. This means that address mappings of the PCI devices are not fixed. The physical addresses assigned by
the host processor can be known by reading a set value on a base address register within configuration registers of
each PCI device. (With a VME bus, base addresses are determined by dip switches.)
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Illustration 11 Operator Console Block Diagram (NP, NP+, NP++)
HIS/RIS
Ethernet Host Processor

Analog Bit3 PCI
RGB Bit3 PCI Backplane
Ultra/Wide SCSI Host Card Controller
21 Color (Internal) Card NPRS
Monitor System
PS/2 PCI Bus
Disk
Mouse System Disk
(Option)
NPRM
Scan Panel Ultra/Wide SCSI
PS/2 (External)
CDROM NPRIF
103 Keyboard RS232C 5 MOD
Keyboard 5 MOD (Option)
AHA2940UW
PDU RS232C
Laser Ultra/Wide SCSI
Laser Camera
Camera Interface Bit3 Backplane Card
Raw Data
(DASM)
Disk
ST1800 (Serial Raw Data
RS232C Port Extension Box) Disk(Option)
Scan Room
DBPCI
TGP
Gantry Mic NAA1 OC Speaker
Table Speaker
Includes Rear CN1 Board, Rear CN2 Board, VSPL Board,
and IST Board (for SmartView)
DAS
DASIFN
Heart Gate NPRIF: Recon Engine Interface
Trigger
NPRM: Recon Engine Master
Optical
Fiber NPRS: Recon Engine Slave
DBPCI: DAS Buffer
DASIFN: DAS Interface
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Illustration 12 Operator Console Block Diagram (Twin)
O2
NPRIF: Recon Engine Interface

NPRM: Recon Engine Master LINUX PC
NPRS: Recon Engine Slave
DBPCI: DAS Buffer
DASIFN: DAS Interface
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1-2 MAIN COMPONENT DESCRIPTION
Host Processor
The host computer performs all of the following operations:
User interface
Image processings/display (all processings except recon)
Communication
Database control
Raw data/image data flow control
Image storage
Scan/recon control
System Disk (within the Host Processor)

The host processor includes a hard disk drive which is used as the system disk. This system disk mainly stores the
followings:
System and application software
Images
Calibration files
System parameters
D Capacity: 4 GB or 9 GB
In the case of a 4 GB disk,

Image Storage: 4000 images (take up 2 GB (1 image/0.5 MB))
(The remained 2 GB storage is used for System software/swapping space + Application software)
For NP++ and Twin systems, 9 GB disk drives are used.
NPR (NP/NP+ Recon Engine)

This is a unit for performing highspeed recon operations.
This unit consists of the following three kinds of circuit boards:
D NPRIF (NPR Interface):

Performs interfaces between the PCI bus and the NPRM.
D NPRM (NPR Master):

Includes one master DSP (Digital Signal Processor), main memory called Global Memory 0, others.
D NPRS (NPR Slave):

Includes two slave DSPs which perform arithmetic operations under the NPRM control.
The NPRS is a piggyback board equipped on the NPRM, and up to eight NPRS boards can be equipped on the NPRM
(i.e., up to 16 slave DSPs can be equipped).
The NPRIF only is connected to a PCI slot. The NPRIF and NPRM are connected by cables.
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1-2 MAIN COMPONENT DESCRIPTION (continued)
DBPCI (DAS Buffer for PCI Bus)

This is a circuit board, serving as a ring buffer whose capacity is 4 MB. This buffer temporarily stores DAS data.
This board also includes control registers for the OC keyboard, safety loop, others.
DASIFN (DAS Interface for NP/NP+/NP++)

DASIFN2 (for Twin)
This is a circuit board which converts raw data sent from the gantry in optical serial signals into electric parallel signals.
During conversion, this board performs transfer error corrections.
This board also includes one channel for receiving Heart Gate Trigger inputs.
PCI Expansion Unit

Consists of PCI Host Card, PCI Backplane Controller Card, PCI Backplane Card.
Increases the number of slots which are connected to the PCI bus of the host processor.
Circuit boards for scan/recon are connected to these slots (NPRIF, DBPCI, AHA2940UW).
REAR CN1
This is a circuit board which mainly has two functions: Signal filtering and Audio control.
This board is connected to OC external components such are keyboard, TGP board on the gantry, or Power Distribu-
tion Unit (PDU), and is also connected to OC internal components such are DBPCI board, NAA1 board, or others.
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1-2 MAIN COMPONENT DESCRIPTION (continued)
Raw Data Disk (Ultra/Wide SCSI)

This is a highspeed hard disk drive for storing raw data.
D Capacity: 2 GB
Raw Data Storage: 450 raw data files

(70% of the disk space is used for raw data storage; 30 % of it is not used, because of low read/write rate)
For NP++, the capacity is 4 GB.

For Twin, the capacity is 9 GB, and two drives of this are used.
Archive Equipment (MOD)

MOD is used for archiving images/raw data.
MOD is also used during system software installation to temporarily store data.
D Capacity: 2.3 GB, Density: 4x (Hitachi/Sony MOD)
Images: DICOM format

Raw data: YMS format as Unix files (Includes Cal files, others)
CDROM Drive
Used for system software loading.
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1-3 OPERATIONAL DESCRIPTION
Scan Data Main Flow

Illustration 13 or 14 shows:
Raw data acquired during scans is first buffered by DBPCI;

The raw data is then stored to a hard disk drive which is a highspeed type and exclusively used for raw data storage;
The raw data is then transferred to the NPR where recon processing is performed;
The reconstructed images are then read by the host processor which converts the image data to video signal, as well
as stores the image data to the system disk, which also stores system software.
As shown, raw data and image data are mainly transferred over the PCI bus.
Illustration 13 Scan Data Main Flow (NP, NP+, NP++)
Scan
Raw Data
CRT Display PCI Bus
Video Signal DBPCI
Host Processor Raw Data
Raw Data Disk
System Disk Raw Data
Image Data NPR
Recon
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1-3 OPERATIONAL DESCRIPTION (continued)
Illustration 14 Scan Data Main Flow (Twin)
Scan
Raw Data
CRT Display PCI Bus
Ach Bch
Video Signal DBPCI DBPCI
Host Processor Raw Data
Raw Data Disk Raw Data Disk
System Disk Raw Data
Image Data NPR
Recon
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SECTION 2 HOST PROCESSOR
2-1 OVERVIEW
The two types of host processor exist in the field: IRIX workstationO2 or Linux PC
The host processor is the central unit within the operator console, performing various operations such are described
below:
D Controls data transfer between data storage units and memory devices located on NPR, etc.
D Controls the entire scan sequence; it sends necessary instructions to relevant processors and devices,
and receives status information from those processors and devices.
D Controls the NPR (NP Recon Engine).
D Performs graphics operations.
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2-1 OVERVIEW (continued)

Table 21 and 22 show main specifications of the host processor.
Table 21 Host Processor Specifications (O2)
Component Specification
Central Processor Model MIPS R5000SC or Rm5200
Operating Frequency 200 MHz or 300 MHz (Rm5200)
Cache Memory 32 kB data/32 kB instruction primary cache
1 MB secondary cache
Main Memory Capacity (standard) 64 MB (32 MB DIMM X 2) or128 MB (64 MB DIMM X 2)
Type Synchronous DRAM, 100 MHz, 4 banks, 288bit wide
Upgrade up to 256 MB with 16 Mbit SDRAM
up to 1 GB with 64 Mbit SDRAM
Hard Disk Drive Capacity 4 GB (5400 rpm) or 9 GB (7200 rpm)
(System Disk)
CDROM Type 12 X
Graphics Resolution 1280 x 1024 pixels
75.03 Hz Frame Rate
1024 x 768, 800 x 600, 640 x 480 also supported
Frame Buffer Formats 32 + 32 bit FB (32 + 32 double buffered)
32 bit FB (16 + 16 double buffered)
16 bit FB (8 + 8 double buffered)
8 bit overlay
Video Signal Horizontal Statistics
Horizontal Front Porch : 118.52 nsec ; 16 pixels
Horizontal Back Porch : 1.84 sec ; 248 pixels
Horizontal Sync : 1.07 sec ; 144 pixels
Horizontal Active : 9.48 sec ; 1280 pixels
Horizontal Line Rate : 79.98 KLines/sec
First Field Statistics

Vertical Front Porch : 12.50 sec ; 1.00 lines
Vertical Back Porch : 475.14 sec ; 38.00 lines
Vertical Sync : 37.51 sec ; 3.00 lines
Vertical Active : 12.80 msec ; 1024.00 lines
Vertical Sync Pulse : 38.58 sec ; 3.09 lines
Pixel Clock : 135.00 MHz
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Table 21 Host Processor Specifications (O2) (continued)
Builtin I/O PC (PS/2) compatible keyboard and mouse
(Input/Output) 2 x Ultra Fast/Wide SCSI singleended, 1 internal, 1 external
(40 MB/sec each)
2 x Serial 460 kbps (DB9)
1284 Parallel (C miniature)
10BaseT/100BaseTX Ethernet standard (RJ45)
Audio Analog stereo input/output
Expansion Slot One halflength, 64bit PCI slot (10 W)
Operating System IRIX 6.5 with XFS or later
Table 22 Host Processor Specifications (Linux PC)
CPU Model Dual Xeon
Operating Frequency 2.0GHz
Main Memory Capacity (standard) 2.0 GB (512MB x 4)
Hard Disk Drive Capacity 60 GB
(System Disk)
CDR/W Type 40 X
PCI Slot 4
Ethernet 10/100BaseT x 1
Serial 8 (5 used)
PS2 2 (Keyboard, Mouse)
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2-2 BUILTIN I/O (INPUT/OUTPUT) DESCRIPTION

The host processor has input/output ports for the following:
Display
Analog RGB signals are output from this port.
Keyboard/Mouse
A PS/2 keyboard and a mouse are connected these ports, respectively.
Ethernet
A diagnostic console, an independent console, or an HIS/RIS is connected to this port.
DICOM compatible; the operator console can send (push) images to those devices using DICOM protocols at a 10
Mbits/sec maximum (the transfer speed varies according to receiver models, the size of transfer data, protocols, etc.).
Ultra/Wide SCSI (Internal This port is provided within the host processor) (for O2 ONLY)
The O2 host processor includes a hard disk drive. This drive is used as the system disk, and is connected to this
port. The disk is also used for storing images.
Ultra/Wide SCSI (External) (for O2 ONLY)

Since this port is a wide SCSI, the data bus of this port is 16bit wide. However, within this OC, devices which handle
eightbit data such are CDROM drive, MOD drive, or Camera Interface are connected to this port in daisy chain.
Serial Port (RS232C)

Provides two serial ports; one is used for communication with the TGP board, and the other is used for communication
with scan keys (on the keyboard).
Audio
Provides audio input/output ports. The host processor can record audio signals from a microphone or other sources,
and can play recorded audio data. This function is used for Autovoice.
PCI Bus Slot

The host processor is equipped with one PCI slot.
In order to expand the PCI bus, a PCI Host Card is connected to this slot. The PCI Host Card is a component of
the PCI Expansion Unit.
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SECTION 3 CONNECTOR BOARDS
3-1 CONNECTOR BOARDS

All the signal cables connected between the operator console (OC) and subsystems/components outside the OC run
through these connector boards.
The connector boards mainly include filters for each signal line to improve the EMC (ElectroMagnetic Compatibility)
performance of the OC. The REAR CN1 board also includes an audio mixer, relay for the safety loop, and others.
3-2 REAR CN1 BOARD

Illustration 31 shows a block diagram of the REAR CN1 board.
The REAR CN1 board is connected to a slot of the connector box of the OC, and as shown in Illustration 31, the
board is connected to OC external components such are the keyboard, TGP board on the gantry, or the Power Dis-
tribution Unit (PDU), and is connected to OC internal components such are DBPCI board, NAA1 board, or others.
The board functionally consists of the following two blocks:
D Filter Block
D Audio Mixer Block
3-2-1 Filter Block

As shown in Illustration 31, this block includes the following interface circuits:
D Keyboard Interface:
Mainly interfaces between the keyboard (including the scan buttons) and the host processor.
D TGP Interface:
Mainly interfaces RS232/RS422 communications and Direct Lines between the TGP board located on the
gantry and the host processor or keyboard.
D PDU Interface:
Mainly interfaces Power On/Off, Emergency, Safety Loop, or other signals between the Power Distribution
Unit (PDU) and the keyboard or the FRONT PNL board of the OC.
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3-2 REAR CN1 BOARD (continued)
Illustration 31 REAR CN1 Block Diagram
REAR CN1
Scan RS232
Panel RS232
KB Reset Host
Emergency Stop/Rest Filter Block RS232
Keyboard Processor
Direct Line PS/2
PS/2
Fan Alarm Thermal
Guard PCI Bus
from/to Patient,
Auto Voice, Foot (via PCI
Gantry Power On Front Expansion
SW, Xray On
Shutdown Panel Unit)
Direct Line
TGP Reset KB Reset
TGP Board
Xray On Safety Loop
Shutdown
RS422 TGP Reset DBPCI DBPCI
NAA2 Board Board
Xray LED (only
from Patient Xray On for
Twin)
to Patient Alert On
CSA/WRA
Speaker on Table Talk On ACKA
Fan Alarm Address (4:0)
Data (7:0)
Emergency Stop/Rest
PDU Audio Mix-
Safety Loop er Block
Line OUT
Power On
Line IN
External from Patient CD Line OUT
Speaker CDROM Drive
(option)
Foot SW from Patient NAA1
Foot Switch
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3-2-2 Audio Mixer Block

The audio mixer block of the REAR CN1 board Includes registers for audio function, and also includes an audio amplifi-
er for headphones or external speakers (which are not the OC speaker which is driven by the NAA1 board).
See Illustration 32.

As shown, audio signals from several sources are mixed in this block.
D Audio Input Sources:
Microphone on the gantry (Intercom: From Patient)
Microphone on the OC keyboard (Intercom: To Patient)
Audio output on the host processor (Auto Voice play)
Audio output on the CDROM drive (BGM, or other)
Synthesized sounds on the REAR CN1 board (Xray On, Alert)

These are generated using a programmable timer which is controlled by software.
D Audio Output Destinations:
Speaker on the gantry
Speaker on the OC
Audio input on the host processor (for recording Auto Voice messages)
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Audio Input Switch

As shown in Illustration 32, analog switches are used to switch audio input sources, and are controlled by the Talk
On button on the keyboard or a foot switch connected to the keyboard.
D An intercom function is provided between the OC room and the gantry room. The Talk On button on the
keyboard switches communication direction, as described below:
While Talk On is pressed, communication of OC room gantry room is enabled; and both of
Auto Voice (both in the OC room and the gantry room) and sound from the CDROM drive (both
in the OC room and the gantry room) are disabled.
While Talk On is released, communication of gantry room OC room is enabled.
If a foot switch is provided, this also serves as the Talk On button.
D The Xray On sound and alert sounds in the OC room are always enabled, even when Talk On is pressed.
D Auto Voice messages can be recorded by using the microphone equipped on the keyboard while pressing
the Talk On button.
While Auto Voice is being played, communication of gantry room OC room can be disabled. This
prevents Auto Voice sound degradation on the OC side, because: Auto Voice is played both in the OC
room and the gantry room. If communication of gantry room OC room is enabled, the Auto Voice
messages are doubled on the OC side, which degrades the sounds.
Volume Control
The following two kinds of volume control are provided.
D The following can be adjusted with the manual volumes on the keyboard:
Volume of communication of OC room gantry room (through the keyboard microphone)
Recording level of Auto Voice messages (through the keyboard microphone)
Auto Voice volume in the gantry room
Volume of communication of gantry room OC room (through the gantry microphone)
D The electronic volumes are controlled by software, controlling the following:
Auto Voice volume in the OC room
Sound volume from the CDROM drive both in the gantry room and the OC room
Alert sounds in the OC room
Xray On sound in the OC room
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Illustration 32 Audio Mixer Block
Stereo Signal Analog Switch

from/to DBPCI Monaural Signal
Xray On/Off OP. Amp.
Alert On Xray
Sound
Address (4:0) Programmable Modu-
Timer lation
Data (7:0)
Frequency &
Alert pulse Alert Sound
width controller (one shot)
Electronic
Volume
Sound Volume to Electronic
Control Register volume control
from CD Drive
from Host Processor
Line OUT
from Gantry Mic
from OC Mic
to Patient Volume
from Patient Volume Lowpass

Filter
Auto Voice Volume
Scan Keyboard
Volumes to Host Processor to Gantry to OC Speaker
Line IN Speaker
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Audio Register Address Map

Illustration 33 shows an address map of audio control registers.
The addresses shown are mapped at an area within the DBPCI Input/Output address space of the host processor.
Registers mapped within the I/O register bases $50 $7F are located on the DBPCI board. These are controlled
by the host processor, and control signals only are sent from DBPCI to the REAR CN1 board.
Registers mapped within the I/O register bases $80 $FF are located on the REAR CN1 board. These registers and
the DBPCI board are connected via a dedicated bus.
Illustration 33 Audio Register Address Map
D7 D0
$b4
$b0 CD GA Volume Register
$ac CD OC Volume Register
$a8 AV OC Volume Register
$a4 Alert Volume Register
$a0 Xray Volume Register
PIT1 Register
$90
PIT0 Register
$80
AUX0 Note:
$60 Auto Voice Playback Register
CD: CDROM Drive
GA: Gantry
OC: Operator Console
AV: Auto Voice
$54 Alert Sound Register
PIT: Sound Pulse Width Control
$50 Xray On Sound Register
IO Register Base
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SECTION 4 OTHER OC COMPONENTS
4-1 KEYBOARD, MOUSE

The keyboard used for this operator console integrates the following components:
D 103 Keyboard, Mouse:
This 103 keyboard and the mouse have a PS/2 interface for connecting themselves to the host processor.
D Scan Keys, Microphone:
Keys used for scanning, and a microphone used for an intercom are incorporated into the keyboard.
These keys are connected to the host processor via RS232C.
The keyboard and the TGP board are connected by Direct Lines for the remote cradle and gantry tilt control.
4-2 CRT DISPLAY

D 21 color monitor
D The resolution used for the CRT Display is 1280 x 1024 matrix.
The refresh rate used is 75 Hz.
4-3 NAA1 (NP/NP+ AUDIO AMPLIFIER 1)

This is an amplifier board for the OC speaker. See the following block diagram.
Illustration 41 NAA1 Block Diagram

Power Amplifier
Preamplifier
+
+
CN2 OUT OUT CN1

From REAR CN1 To OC Speaker
Muting
Voltage Regulator
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4-4 PCI EXPANSION UNIT

The host processor only provides one PCI slot. This unit expands this one slot to seven slots available.
This unit consists of the following three boards (designed by Bit3):
PCI Host Card

PCI Backplane Controller Card
PCI Backplane Card
The main devices on these boards are PCIPCI Bridge chips, which expand the number of slots in stages.
Illustration 42 shows a block diagram of the PCI Expansion Unit.
Table 41 describes installed circuit boards at those slots which are made available by the PCI Expansion Unit.
Table 41 PCI Slot Board
Slot Board
Slot 1 NPRIF
Slot 2 DBPCI
Slot 3 DBPCI (for Twin only)
Slot 4 AHA2940UW
Slot 5 (space)
Slot 6 (space)
Slot 7 (space)
AHA2940UW Card
This is a SCSI card of Adaptec. To this card, up to two hard disk drives can be connected for onthefly (high speed)
raw data storage.
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4-4 PCI EXPANSION UNIT (continued)
Illustration 42 PCI Expansion Unit
PCI Host Card PCI Backplane

Controller Card PCI Backplane Card
PCI Bus
PCI PCI Cable PCI PCI
Bridge Chip Bridge Chip PCI Slot 1
PCI Slot 2
PCI Slot 3 PCI Bus

PCI Bus (Host)
PCI PCI
Bridge Chip PCI Slot 4
PCI Slot 5
PCI Slot 6
PCI Slot 7
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4-5 ST1800 (SERIAL PORT EXTENSION BOX)

The host processor only provides two serial ports. To increase the number of available serial ports, the ST1800 unit
is used.
See Illustration 11 for the connection of the ST1800 unit within the operator console.
The unit is connected to the ultra/wide SCSI port of the host processor, and provides four serial ports available.
The serial ports may be used for connection with an InSite modem, a trackball, etc.
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TABLE/GANTRY
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1-2 COMPONENTS INTERCONNECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1-3 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
SECTION 2 SUBASSEMBLY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

2-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2-2 STATIONARY GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2-2-1 TGP board Service Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2-2-2 TGP Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
2-3 ROTATING GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
2-4 SLIP RING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
2-4-1 MECHANISM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
2-5 TABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
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1-1 INTRODUCTION
The TGP (Table Gantry Processor) board is the main controller of the Table/Gantry subsystem. The TGP board re-
ceives command from the Operator Console and sends control commands to Table, Stationary Gantry and Rotational
Gantry including OGP (On Gantry Processor), DAS and Xray Generator. Although the DAS/Detector and Xray
Generator are in the Gantry, they are not explained in this subsystem.
The Table/Gantry consists of the following components:
D TGP board
D OGP board
D SUB board
D Table board
D Servo Amp/Servo Motor
D Gantry Display
D Gantry Switch
D Collimator
D Positioning Light
D Hydraulic System (Gantry Tilt and Table elevation)
D Touch Sensors
D Cradle drive system
D IMS (Intermediate Support)
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1-2 COMPONENTS INTERCONNECTION

The illustration 11 shows the components of the Table/Gantry.
Illustration 11 Table/Gantry
GANTRY GANTRY DISPLAY

SWITCH
PANEL
TILT POTENTIOMETER AXIAL MOTOR
TABLE HEIGHT TGP BOARD TILT HYDRAULIC

POTENTIOMETER SYSTEM
OGP BOARD APERTURE
IMS POTENTIOMETER
MOTOR
SUB BOARD
CRADLE POSITION CRADLE
POTENTIOMETER MOTOR
SERVO AMP/MOTOR
CRADLE ENCODER TABLE VALVE
STEPPING MOTOR DRIVER SOLENOID
AZIMUTH ENCODER TABLE HY-

TABLE BOARD
DRAULIC SYSTEM
FOOT SWITCHES SERVO AMP FOR IMS

LOOK GUIDE
CRADLE DRIVER
GANTRY PULSE IMS MOTOR
TABLE TOUCH SENSORS APERTURE SENSORS
GANTRY TOUCH SENSORS EMERGENCY SWITCHES
LATCH SWITCHES
FOR
TWIN ZAXIS LIMIT SENSORS
ONLY
DAS
ZAXIS MOTOR
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1-3 SPECIFICATIONS
The specifications of the Table/Gantry is as follows:
Gantry Rotation Speed

0.7 (NP++, NP++ Twin), 0.8, 1, 1.5, 2, 3 sec/rot.
Tilt Angle
30_ 0.5_
Tilt Speed
BWD 30_ ~ FWD 30_ : 60 6 sec
Table Height
400 ~ 950 mm
UP/Down Speed
From 400 mm to 950 mm height: 30 sec 5 sec +10 sec.
Cradle Speed
Slow 20 mm/sec
Fast 100 mm/sec
Scout 75 mm/sec
Home 100 mm/sec
IMS Speed
50 mm/sec
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SECTION 2 SUBASSEMBLY DESCRIPTION
2-1 OVERVIEW
The Table/Gantry consists of table and Gantry. The Gantry is divided into Stationary Gantry and Rotating Gantry. The
communication between stationary and rotating Gantry is made by slipring, a rotation mechanism that permits elec-
trical power and signals exchange.
The illustration 21 shows the Table/Gantry block diagram.
Illustration 21 Table/Gantry Block Diagram
GANTRY
STATIONARY GANTRY ROTATING GANTRY

PDU
POWER
GANTRY
OC DISPLAY
TGP BOARD
GANTRY COLLIMATOR
SWITCH
OGP BOARD
POSITIONING
GANTRY TILT LIGHT
SUB BOARD HYDRAULIC
SYSTEM
SLIP
RIN
SERVO G DAS XG
SERVO AMP MOTOR
TABLE
CRADLE Collimator
IN/OUT DAS line to
TABLE control Zaxis
BOAR IMS (*) is for the Twin
D ONLY.
TOUCH
SENSORS
TABLE ELEVATION
HYDRAULIC SYSTEM
(*) Standard or Option, depending on a system.
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2-2 STATIONARY GANTRY

The stationary Gantry is mainly controlled by the TGP (Table Gantry Processor) board. The Illustration 22 shows
the main components of the stationary Gantry.
The TGP board communicates with Operator Console and Table via cables and with the OGP board located in rotating
Gantry via cable and slip ring.
Illustration 22 Stationary Gantry main components
OGP
(SLIP RING) MICROPHONE
GANTRY SWITCH
115VAC
PS1 DISPLAY BOARD
TOUCH SENSOR
FCV
PS2
BOAR BREATH NAVI
D
PS 3 EMERGENCY SWITCH
OC
TGP BOARD MICROPHONE
GANTRY SWITCH
TABLE
XDISP BOARD
TOUCH SENSOR
RCV
BREATH NAVI
BOAR
D
EMERGENCY SWITCH
GANTRY TILT
PUMP & VALVE
TABLE ELEVATION
PUMP & VALVE SIDE COV-
SUB BOARD ER
SWITCHES
AXIAL
M
MOTOR
FRONT AND
REAR
COVER
SWITCHES
The functions of the parts of the stationary Gantry are as follows:
PS1 and PS2

Supply power to TGP board and SUB board. PS1 supplies +5V, +12V and 12V. PS2 supplies +24V.
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2-2 STATIONARY GANTRY (continued)
FCV (Front Cover) Board RCV (Rear Cover) Board

Contains connection circuitry to display board, touch sensors, breath navis and emergency switches.
See Illustration 23 and 24.
Illustration 23 FCV Block Diagram
FCV BD ASSY
CN1 CN2
TGP DISP
+24V,+5V,GND,SHIELD,XLED,PLLED,
A0,A1,B0,B1,B2,B3,SL0,SL1,SL2 GNTDISP
TGP BD
BD ASSY
ASSY
(CN8)
CN5
+24V,+5V,SHIELD,FLED,SLED LG
CUNTL0,CUNTL1, LG1 BD
CUNTL2,CUNTL3, 7seg DECODE La,Lb,Lc,Ld,Le,Lf,Lg,
ASSY
& DRIVE Ha,Hb,Hc,Hd,He,Hf,Hg
CUNTH0,CUNTH1, CIRCUIT
CUNTH2,CUNTH3 FLED
LG2 BD
ASSY
CN3
LSW
SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED
+5V +5VSW LSW BD
SWENBL* ASSY
K1
CN4
RSW EMERGENCY SW
INR,OUTR,FAST,IMSR,INLMR,EXLMR,RANGE, RSW BD
UPR,DNR,FWDR,BWDR,POSL,PRACTICE ASSY
EMERGENCY
EMERGENCY SW
CN6
TSW
TCH* TOUCH SW
TSNS,CONNECTOR TOUCH
DETECT
SW ASSY
CIRCUIT
CN8 CN7
MICOUT MIC
NAA2
MIC+,MIC,MICGND MIC
ASSY
ASSY
(CN2)
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Illustration 24 RCV Block Diagram
R CV BD ASSY
CN1 CN2
TGP +24V,+5V,GND,SHIELD,XLED,PLLED, DISP
A0,A1,B0,B1,B2,B3,SL0,SL1,SL2
CN8
TGP BD XDISP
ASSY +24V,XLED,PLLED XDISP
(CN9) BD ASSY
CN5
+24V,+5V,SHIELD,FLED,SLED LG
CUNTL0,CUNTL1, LG1 BD
CUNTL2,CUNTL3, 7seg DECODE La,Lb,Lc,Ld,Le,Lf,Lg,
ASSY
& DRIVE Ha,Hb,Hc,Hd,He,Hf,Hg
CUNTH0,CUNTH1, CIRCUIT
CUNTH2,CUNTH3 FLED
LG2 BD
ASSY
SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED CN3
RSW
+5VSW LSW BD
+5V TEMP+5V ASSY
SWENBL*
K2 K1 CN4
RENBL LSW
RSW BD
ASSY
POSL,INLMR,RANGE,PRACTICE (+5VSW)
INR,OUTR,FAST,EXLMR,UPR,DNR,FWDR,BWDR (TEMP+5V)
CN10
EOFF
SW
EMERGENCY
EMERGENCY SW
CN6
TSW
TCH* TOUCH SW
TSNS,CONNECTOR TOUCH
DETECT
SW ASSY
CIRCUIT
CN9 CN7
MICOUT MIC
NAA2
MIC+,MIC,MICGND MIC
ASSY
ASSY
(CN3)
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Display Board and XDISP board

Display board is the display located at middle upper side of the Gantry front cover.
XDISP board is the smaller display located at middle upper side of the Gantry rear cover.
Gantry Switches
Located at left and right of both front and at rear Gantry cover. These switches are used to tilt manage Gantry tilt,
table and cradle movement and positioning light.
Gantry Microphone
Located at upper portion of the entrance of the Gantry opening, at the front and the rear side.
Touch Sensor
Located at front and at rear upper side of the Gantry cover to protect patient during tilt. When touch sensor at the front
cover hit something during forward tilt, the tilt stops. When touch sensor at the rear cover hit something during back-
ward tilt, the tilt stops.
Breath Navi
Located at upper portion of the entrance of the Gantry opening, at the front and the rear side to notify patient to breath,
hold breath and show remaining scan time.
Emergency Switch
Located at left and right of both front and at rear Gantry cover.
SUB Board
The SUB board contains control circuitry for Gantry tilt, table elevation and servo amp for axial motor. Control these
functions according to the command received from TGP board. Contains also connection to Gantry cover switches.
See Illustration 25.
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Illustration 25 SUB Board Block Diagram
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TGP BOARD
There are three micro processors on the TGP Board. One controls the GANTRY Rotation, one controls the Table
and the other controls the arbitration of commands from the gantry processor, table processor, scan processor (lo-
cated on the OGP board) and the OC. See Illustration 26.
D Processor A for GANTRY CONTROL (GP)
D Processor B for TABLE CONTROL (TP)
D Processor C for MANAGEMENT (MP)
The Management processor communicates with the OC through serial links. The other processors (Gantry Processor
and Table Processor) communicate with the Management Processor, and can receive commands from the OC via
the Management Processor. The Gantry Processor and Table Processor also contain a serial communication port
which is not used for communication between OC or other Processors, but rather is used for Data correction from
the sensor switches.
The TGP Board issues commands to and receives status from the components it controls. The TGP oversees the
following functions:
D AXIAL Drive control
D TILT Drive control
D CRADLE IN/OUT Drive control
D IMS IN/OUT Drive control
D TABLE Elevation Drive control
D GANTRY Display control
D Breath Navi Display control
D GANTRY panel switch/Foot switch control
D Error Detection
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Illustration 26 TGP Block Diagram
TGP Bd
PDU Emergency
Rot Safe
PDU Safety Gantry
Loop Processor GPulse
(uPD78310) Rot Count C
12bit
SRAM DAC Azimuth M
Servo
Rotate AMP Enc
Flash Control
Memory
Dual
Test 0,1 Port RAM
Reset SW G Test
SW Slice Count C
Reset Status
Patarn LED DAS Slip
Trig Ring
Management
OC Comm Processor
OC (uPD78310) 9600bps Slip
unication Ring
SRAM SIO
OC OC Direct CT Lock
Line &Alarm Relay
Flash
Memory Control
OC
Breath
Flash Navi Breath
Memory Control Navi
Dual IMS
Port RAM Service IMS M
SW Servo
Control AMP Enc
M Test Flash
SW Add Cont
IMS Pot
Status
LED HIT Pot
Table TILT Pot

Processor 12bit
(uPD78310) ADC Cradle Pot
SRAM
Cradle
Cradle Motor
Flash Control M
Driver
Memory
Table Enc
T Test Control Up/Dwn
SW Relay P,V
Tilt
Status Control Tilt P,V
LED Relay
Display Gantry
Control Display
T/G SW Gantry
Port SW
Table
Flash SW
Add Cont
Fluoro
SW
Audio Mic
Amp
Spk
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2-2-1 TGP board Service Switches

There are five service switches at right upper side of the TGP board which are used to control the Gantry Rotation
manually.
Illustration 27 TGP Board Service Switches
SYS ABT SPD2 FAST CNT
HOME
SPD1
OFF
MID
SVE
MNL FIX SPD0 SLOW 90DEG
TGP BOARD
GANTRY LEFT SIDE
SYS : System Position. When the switch is in this position, the Gantry is controlled by the
SYS Operator Console.
OFF Disable the Gantry rotation. Servo Amplifier is disabled and Static brake activated.
OFF
MNL Manual Position. When the switch is in this position, the Gantry rotation is controlled
MNL
manually, by the other switches described below.
ABT : Arbitrary Mode. This switch is a spring loaded switch that enables Gantry rotation
ABT toward the direction selected by the rotation Direction switch (CNT/HOME/90DEG),
by the fixed speed of XXX seconds per revolution.
SVE
SVE : Servo Enable. Servo Amplifier is enabled and voltage command is 0 volts, that
FIX means there is no rotation at this position.
FIX : Rotates Gantry according to the selection of the Speed Selection switches
(SPD2/SPD1/SPD0 and FAST/MID/SLOW) and Direction switch (CNT/
HOME/90DEG).
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2-2-1 TGP board Service Switches (continued)

SPD2 FAST
SPD1
These two switches sets the rotation speed

and
MID
See table below
SPD0 SLOW
SPD2/SPD1/SPD0 SPD2 SPD2 SPD2 SPD1 SPD1 SPD1 SPD0 SPD0 SPD0
FAST/MID/SLOW FAST MID SLOW FAST MID SLOW FAST MID SLOW
SPEED (sec/rot) 0.7 0.8 1.0 1.5 2 3 5 10 15
CNT
CNT : Clockwise rotation
HOME
HOME : Home position (Xray tube at zero degree position)

90DEG 90DEG : 90 degree position (Xray tube at 90 degree position)
2-2-2 TGP Processors

The TGP board contains three processors:
Management Processor (MP)

The Management Processor oversees the functions of the Table/Gantry. It communicates with OC and according to
the message received from OC, sends corresponding commands to Gantry processor, Table processor and OGP
board.
The main functions of the Management processor are:
D Communication with OC serial link
D Communication with OGP serial link through slip ring
D IMS movement control
D Xray ON LED (on Gantry panel) control
D Positioning Light ON LED (on Gantry panel) control
D Look guide control
D Practice Switch (for look guide) control
D Tilt position, table height and cradle position adjustment. There is a ROM connected to management proc-
essor that contains adjustment data. The management processor reads this data, compares with the cur-
rent positions and make adjustment as needed.
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2-2-2 TGP Processors (continued)
Gantry Processor (GP)

The Gantry processor control the following functions:
D Positioning light switch
D Gantry rotation
Table Processor (TP)

The table processor control the following functions:
D Cradle In/Out
D Gantry Tilt
D Table Up/Down
D Gantry Display
D Gantry Switch
D Interlock
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2-3 ROTATING GANTRY

The Illustration 28 shows the main components of the rotating Gantry.
The functions of the parts of the stationary Gantry are as follows:
OGP Board
The OGP (On Gantry Processor) performs the following functions:
D Xray exposure on/off control
D DAS data transfer timing
D Collimator control
D Beam Tracking Control (For Twin System ONLY)
D Positioning light control
D Scan control
D The automatic shutoff of the Tube Fan/Pump Power Supply after 30 minutes when the OC has been
powered down.
Illustration 28 Rotating Gantry main components
PHOTO
SHADED PARTS IS FOR DAS SENSOR
TWIN SYSTEM ONLY.
MOTOR
MOTOR
GPLS DRIVER
MOTOR
MOTOR COLLIMATOR
DRIVER
TO TGP
(SLIP
RING) ENOCODER
OGP BOARD
POSITIONING
LIGHT (FOR
LASER)
PHOTOSENSOR
POSITIONING
LIGHT (FOR 115V
HALOGEN)
TRANS- RELAY
FORMER
SWITCHING SWITCHING
POWER POWER
SUPPLY 1 SUPPLY 2
TEMP
CONT
115VAC ASSY
TO DAS BUFFER
RF XMT DTRF DAS/DETECTOR
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2-3 ROTATING GANTRY (continued)
Switching Power Supply 1

Supply power to the OGP board, DTRF board, RF transmitter and positioning light.
Switching Power Supply 2

Supply power to the DAS and Temperature Control Box.
Collimator
Located at the exposure window of the Xray tube, controls the aperture of the Xray beam by moving the blades.
Single Detector: The aperture can be 1,2,3,5,7 or10 mm.
Twin Detector: The aperture can be (0.5x2,) 1x2, 2x2, 3x2, 5x2, 7x2 or10x2 mm.
The Twin System contains the collimator with Zaxis beam control mechanism.
Motor Driver
Generates five phase pulses to control the stepping motor of the collimator. Receives pulse command from OGP
board and convert it to other type of pulses.
Encoder
Sends the feedback pulse to the OGP to show the moved amount of the blades.
Photo Sensor
Detects when the collimator blades are in 1mm aperture
DAS
Data Acquisition System. Processes the data received from detector and send it to operator console. The detailed
explanations are in the DAS/Detector sections.
Temp Cont Assy

Device that controls the Detector temperature
DTRF (or DTRF2 for Twin)

Receives parallel data from DAS and convert them to serial data. The detailed explanations are in the DAS/Detector
sections.
RF XMT
Converts Serial signal from DTRF to RF signal.
GPLS
Notify TGP and OGP board when the Gantry is at zero degree tube position.
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2-4 SLIP RING

The SLIP RING transfers the following signals;
D DAS Data
D DAS Trigger
D TGP and OGP Communication message
2-4-1 MECHANISM
This Gantry slip ring system utilizes:
D ETC Slip Ring: Nine 480VAC power brushes (3 power lines x3 brushes)
HSDCD Slip Ring: Twentyseven 480VAC power brushes (3 power lines x9 brushes)
D ETC Slip Ring: Four 115VAC power brushed (2 power lines x2 brushes)
HSDCD Slip Ring: Ten 115VAC power brushed (2 power lines x5 brushes)
D ETC Slip Ring: Three ground brushes (1 ground line x3 brushes)

HSDCD Slip Ring: Six ground brushes (1 ground line x6 brushes)
D ETC Slip Ring: Twentyfour signal brushes (6 signal lines x 4 brushes)

HSDCD Slip Ring: Thirtysix signal brushes (6 signal lines x 6 brushes)
D RF transmitter / receiver modules
Every slip ring has a corresponding terminator located on the opposite side of the transmitter terminal. See illustra-
tion 29.
Illustration 29 Slip Ring Terminator
TERMINATE
RESISTOR
SIGNAL
SLIP RING
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2-5 TABLE
The Illustration 210 shows the main components of the table.
The description of the parts of the Table follows:
Table board
This is an interface board between TGP board and servo amp, stepping motor driver, and table CONN board.
TBL CONN board

This is an interface between Table board and potentiometers, touch sensors and latch switches.
This board has only connectors. For detail information, see schematic diagrams.
Illustration 210 Table
HEIGHT
POTENTIOMETER (*) Standard or Option, depending on a system.
PUMP
FROM
SUB
BOARD VALVE (*)
IMS
TABLE UP/DOWN (*) POTENTIOMETER
HYDRAULIC SERVO AMP M
SYSTEM
(*)SERVO
MOTOR
(IMS) E
(*) ENCODER
FROM
TGP
BOARD
TABLE TABLE
BOARD CONN
BOARD
LATCH SWITCHES
TOUCH SENSORS
FOOT SWITCHES
SPEAKER
E
STEP ENCODER
MOTOR
FROM (CRADLE)
GANTRY M
SW STEP MOTOR
NF2 P.S. DRIVER ENCODER
POTENTIOMETER
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2-5 TABLE (continued)
Foot Switches
Pedals that controls Table Up/Down. When the Table is raised or lowered using foot switches, there is no cradle com-
pensation.
Hydraulic System
Consists of pump, hose and cylinder. it is used for Table Up/Down.
Cradle
Portion of the Table that executes longitudinal movement. It is controlled by step motor and motor driver.
IMS (Intermediate Support)

Mechanism that aids the longitudinal movement in order to improve scannable range. It is controlled by Servo Amp
and Motor. Some systems equips this function as a standard.
Latch Switches
Positioned at both right and left sides of the Table, these switches release or latch the cradle. When both switches
are pressed, the cradle is latched. When one of the switches is depressed, the cradle is released. They are for safety
purpose.
Potentiometers
There are three potentiometers: IMS position potentiometer, height potentiometer and Encoder (tilt) potentiometer.
They are used for feedback purpose.
Touch Sensors
Located at under surface of the Table. They are for safety purpose.
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DAS/DETECTOR
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SECTION 2 DETECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2-2 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2-3 HILIGHT DETECTOR MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2-4 CHANNEL DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2-5 DAS/DETECTOR CONNECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2-6 QCAL CHANNELS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2-7 AFTER GROW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2-8 HEATER AND TEMPERATURE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
SECTION 3 DATA ACQUISITION SYSTEM (DAS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3-2 DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3-3 CIF BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 310
3-4 CAM BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311
3-5 DDP BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315
3-6 DTRF BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316
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1-1 OVERVIEW
DAS/Detector subsystem consists of Solid State Detector and Data Acquisition System (DAS) that are located on
the rotationary Gantry. Xray data acquired by the detector is converted to light, then to electrical signal in the detector
and then sent to DAS. The DAS digitizes, serializes and performs offset corrections on the signal and sends to the
Operator Console for image reconstruction.
The Xray exposure through the scanning object is detected by these modules, converted to light, then converted
to electrical signal and sent to to the DAS. The DAS digitizes and sends this data by RF slipring and fiber optics to
the Operator Console, where it is processed for image reconstruction.
Illustration 11 Xray Exposure and Data Flow Block Diagram
OBJECT
XRAY
DATA DATA
XRAY DETECTOR ACQUISITION DAS Data PROCESSING
TUBE SYSTEM UNIT
Illustration 12 Xray Exposure and DAS/Detector
XRAY TUBE
XRAY BEAM

DETECTOR
DAS
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SECTION 2 DETECTOR
2-1 OVERVIEW
The detector consists of housing, collimator and detector modules. The detector module is made of scintillator (Lumex
crystal), photodiode and connector. When the Xray exposure is performed, the Xray enters through the collimator
and hits the scintillator. The scintillator is made of a material that emits light when hit by Xray. The scintillator is in
contact with photodiode so that the light generated by Xray is converted into electrical current. The generated cur-
rent is sent to the DAS (Data Acquisition System) to be processed.
2-2 SPECIFICATIONS
Distance from Focus to ISO: 541 mm.
Distance from Focus to Detector surface: 949.075 mm.
Detector Channel Pitch: 1.15 mm.
Detector Channel angle: 0.06946 degree.
View Number:
S Offset: 256 views (for Twin and systems with V/R 4.0 or later), 64 views (other)
S Active: 972 views
Channel Distribution:
TWIN
NP NP+/NP++
A Slice B Slice
Active Channel 717 793 793 793
Reference Channel 20 20 20 20
QCAL Channel 3 3 3 3
GND Channel 12 0 0 0
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2-3 HILIGHT DETECTOR MODULE

The module consists of Scintillator cells, Collimator, Photo Diode, Reflex Films and Connector (illustration 21. The
Xray enters through the collimator (tungsten plates) and is absorbed by the Scintillator. The Scintillator is made of
Lumex Crystal, the material that emits light when absorbs Xray radiation. The Scintillator is optically coupled with
Photo Diode which converts light to electrical current. The Photo Diode is electrically connected to DAS through the
connector.
Illustration 21 DETECTOR MODULE FOR TWIN
COLLIMATOR (IN THE

DETECTOR HOUSING)
XRAY
HILIGHT MODULE LUMEX CRYSTAL
LIGHT
PHOTO DIODE
CHANNEL B
CHANNEL A
CONNECTOR (TO DAS)
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2-3 HILIGHT DETECTOR MODULE (continued)
Illustration 22 DETECTOR MODULE FOR SYSTEMS OTHER THAN TWIN
COLLIMATOR (IN THE

DETECTOR HOUSING)
XRAY
HILIGHT MODULE LUMEX CRYSTAL
LIGHT
PHOTO DIODE
CONNECTOR (TO DAS)
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2-4 CHANNEL DISTRIBUTION

The illustrations 23, 24 and 25 show the channel distribution of each system model.
Illustration 23 TWIN DETECTOR CHANNEL DISTRIBUTION
1 MODULE
1 MODULE
(16 Channels) 49 MODULES
(16 Channels)
A SLICE
1~3 4 ~ 13 3 CHANNELS 14 ~ 806 6 CHANNELS 807 ~ 816

(3 CH) (10 CH) (793 CH) (10 CH)
QCAL REF. ACTIVE REF.

(3 CH) (10 CH) (793 CH) (10 CH)
B SLICE
Illustration 24 NP+/NP++ DETECTOR CHANNEL DISTRIBUTION
1 MODULE
1 MODULE
(16 Channels) 49 MODULES
(16 Channels)

(3 CH) (10 CH) (793 CH) (10 CH)
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2-4 CHANNEL DISTRIBUTION (continued)
Illustration 25 NP DETECTOR CHANNEL DISTRIBUTION

DUMMY DUMMY

44 MODULES

1 MOD 1 MOD 1 MOD 1 MOD 1 MOD 1 MOD 1 MOD

1~3

4 ~ 13 14 ~ 16 17 ~ 19 13 CH
737~ 742 743~752

20 ~ 736
(3 CH) (10 CH) (3 CH) (3 CH) (6 CH)
(717 CH) (10 CH)

QCAL REF. GND GND ACTIVE GND REF.
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2-5 DAS/DETECTOR CONNECTOR

The detector module consists of 32 channels (A Slice and B Slice) for Twin and 16 channels for others. The illustrations
26 and 27 show the flexible PWB that connects detector modules to the DAS (CAM boards) and its pin configura-
tion.
Illustration 26 DAS/DETECTOR CONNECTOR FOR TWIN
48 PIN A B C D
CONNECTOR
1 2SG 2SG 2SG 2SG
D C B A
2 2SG 2SG 2SG 2SG
1
2 3 A1ch B1ch A16ch B16ch
3
5
7
6 A4ch B4ch A13ch B13ch
8
9
10
FLEXIBLE 11
PWB 8 A6ch B6ch A11ch B11ch
12
11 FG FG FG FG
12 FG FG FG FG
Note
SG: Signal Ground
FG: Frame Ground
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2-5 DAS/DETECTOR CONNECTOR (continued)
Illustration 27 DAS/DETECTOR CONNECTOR FOR SYSTEMS OTHER THAN TWIN
A B C D
1 SG SG SG SG
D C B A
2 SG SG SG SG
1
2 3 A8ch FG A9ch FG
48 PIN 3
CONNECTOR 4 4 A7ch FG A10ch FG
5
6 5 A6ch FG A11ch FG
7
6 A5ch FG A12ch FG
8
9
7 A4ch FG A13ch FG
10
11 8 A3ch FG A14ch FG
12
9 A2ch FG A15ch FG
10 A1ch FG A16ch FG
FLEXIBLE
PWB 11 FG FG FG FG
12 FG FG FG FG
24 PIN
CONNECTOR a b c d
d c b a 1 CH 7 CH 8 CH 9 CH10
1 2 CH 5 CH 6 CH11 CH12
2
3 3 CH 3 CH 4 CH13 CH14
4
5 4 CH 1 CH 2 CH15 CH16
6
5 FG FG SG SG
6 FG FG SG SG
Note
SG: Signal Ground
FG: Frame Ground
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2-6 QCAL CHANNELS

The Xray exposure can move along the Zaxis. It can be due to mechanical adjustment or to tube temperature (the
angle of the Xray output can vary according to the temperature). There is three channels in the left most positioned
detector module that is used for Zaxis data correction. In this module there is a wedge shaped lead block, called
ZWEDGE (illustration 28). The outputs of the three channels are tied together so that only one data is taken for
three channels. The corresponding intensity according to the position of the Xray exposure along the Zaxis is de-
tected (as can be seen at right side of the illustration 28), so that the system recognizes the current Xray position
(along the Zaxis). There is a remaining data for Zaxis data correction in the system. Therefore, the correction is
made according to the data acquired by the QCAL channels.
Illustration 28 QCAL CHANNELS FOR SYSTEMS OTHER THAN TWIN
ZWEDGE

XRAY INTENSITY

DETECTED AC-
XRAY
CORDING TO THE EXPOSURE

BEAM POSITION
Z ALONG THE ZAXIS
QCAL CHANNELS

X GROUND CHANNEL
Illustration 29 QCAL CHANNELS FOR TWIN
QCAL CHANNELS
XRAY INTENSITY

A Slice
A Slice
DETECTED AC-
XRAY
CORDING TO THE EXPOSURE
B Slice BEAM POSITION

B Slice
Z ALONG THE ZAXIS
X
QCAL CHANNELS
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2-7 AFTER GROW

The Lumex crystal scintillator has a property represented in the illustration 210. The scintillator continues emitting
light even after the Xray radiation is stopped. This phenomenon is called AFTER GROW. This remaining scintillation
provides incorrect data, but the system performs the error correction to eliminate this portion.
Illustration 210 AFTER GROW
XRAY ON
scintillation
XRAY OFF
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2-8 HEATER AND TEMPERATURE CONTROL

The detector comprises a heater unit. The heater keeps the detector temperature constant, what is needed for
detector accuracy. The heater is controlled by the Temperature Control Box which supplies power to the heater. The
detector also comprises a thermistor that feeds back the temperature information to the Temperature Control box.
Approximately three hours is needed after turning ON the power to the Temperature Control box to stabilize the
detector temperature. The temperature is controlled to 35 0.5 C. The illustration 211 shows its block diagram.
Illustration 211 TEMPERATURE CONTROL BLOCK DIAGRAM
Thermistor DETECTOR
Heater DC24V 60W
INPUT POW-
ER 24V DC
Driver for
Heater
PS
PS
(+12V > +5V)
(+24V > +12V)
(OP Amp CPU ROM

Comparator)
Switch LED indication
TEMPERATURE CONT BOX
210 DAS/DETECTOR
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SECTION 3 DATA ACQUISITION SYSTEM (DAS)
3-1 OVERVIEW
The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back
Board). Each box contains the set of boards as follows:
For TWIN
S RBB 18 CAM boards
S CBB 18 CAM boards
S LBB 18 CAM boards, 2 DDP boards, 1 CIF board
The Illustration 31 shows the DAS boxes.
Illustration 31 DAS (RBB, CBB, LBB)
LBB ASSY CBB ASSY RBB ASSY
CONTROL CONNECTOR
BOARDS (TO DETECTOR)
B Slice
DDP A Slice
DDP
CAM #36 #19
ASSY FLEXIBLE
CABLE
CAM Assy nomenclature:
Odd Number CAM ASSYs represent A Slice

Even Number CAM ASSYs represent B Slice
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For systems other than Twin

S RBB 9 CAM boards
S CBB 9 CAM boards
S LBB 9 CAM boards, 1 DDP board, 1 CIF board
The Illustration 32 shows the DAS boxes.
Illustration 32 DAS (RBB, CBB, LBB)
LBB ASSY CBB ASSY RBB ASSY
CONNECTOR
(TO DETECTOR)
CONTROL
BOARDS
CAM FLEXIBLE
ASSY
CABLE
The DAS channels number is as follows:
TWIN
NP NP+/NP++
A Slice B Slice
Active Channel 717 793 793 793
Reference Channel 10 + 10 10 + 10 10 + 10 10 + 10
QCAL Channel 3 3 3 3
Ground Channel 3+3+6 0 0 0
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The illustrations 34 and 33 show DAS block diagram for Twin and systems other than Twin, respectively.
The data coming from the detector is taken by the CAM boards, sequentially channel by channel, digitized, converted
to parallel, go through offset correction, then sent to the Operator Console. The CIF board is an interface with OGP
(On Gantry Processor) receiving control and timing signals, and generates the timing signals for data gathering. The
DDP board performs offset correction and generates the test pattern.
Illustration 33 DAS/Detector Structure for TWIN
DETECTOR
A Slice
B Slice
CAM
BOARDS
DC+12V Analog
DC12VAnalog #54 #53 #52 #51 #6 #5 #4 #3 #2 #1
POWER DC+5V CAM
SUPPLY (B Slice) (A Slice) (B Slice) (A Slice) (B Slice) (A Slice) (B Slice) (A Slice) (B Slice) (A Slice)
DC +5V
Digital
CIF
Board
Control
Control
from
OGP
Control
DDP Board
(B Slice)
16 Bit
Data to
DTRF2
DDP Board LBB ASSY

(A Slice)
16 Bit
ata to DTRF2
33 DAS/DETECTOR
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Illustration 34 DAS/Detector Structure for systems other than Twin

DETECTOR
DETECTOR
MODULES
CAM
Front End BOARDS
Circuit for 16
channels
DC +12V Analog
DC 12V Analog
DC +5V CAM
POWER
SUPPLY Gate Array Control
circuit for 2 Front End
DC
+5V
Digital Control
Control Signal
Signal from CIF BOARD
OGP
Control Signal
16 Bit DDP BOARD

Data to
DTR LBB
ASSY
34 DAS/DETECTOR
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Illustration 35 DAS Power Connection for Twin
CIF ASSY
B SLICE DDP ASSY
A SLICE DDP ASSY
CAM ASSY #54
CAM ASSY #53
CAM ASSY #52
CAM ASSY #51
CAM ASSY #50
CAM ASSY #49
CAM ASSY #48
CAM ASSY #47
CAM ASSY #46
CAM ASSY #45
CAM ASSY #44
CAM ASSY #43
CAM ASSY #42
CAM ASSY #41
CAM ASSY #40
CAM ASSY #39
CAM ASSY #38
CAM ASSY #37
CAM ASSY #36

CAM ASSY #35
CAM ASSY #34
CAM ASSY #33
CAM ASSY #32
CAM ASSY #31
CAM ASSY #30
CAM ASSY #29
CAM ASSY #28
CAM ASSY #27
CAM ASSY #26
CAM ASSY #25
CAM ASSY #24
CAM ASSY #23
CAM ASSY #22
CAM ASSY #21
CAM ASSY #20
CAM ASSY #19
CASE
CAM ASSY #18

CAM ASSY #17
CAM ASSY #16
CAM ASSY #15
CAM ASSY #14
CAM ASSY #13
CAM ASSY #12
CAM ASSY #11
CAM ASSY #10
CAM ASSY #9
CAM ASSY #8
CAM ASSY #7
CAM ASSY #6
CAM Assy nomenclature: CAM ASSY #5
CAM ASSY #4
Odd Number CAM ASSYs represent A Slice CAM ASSY #3
CAM ASSY #2
Even Number CAM ASSYs represent B Slice CAM ASSY #1
35 DAS/DETECTOR
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Illustration 36 DAS Power Connection for systems other than Twin
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Illustration 37 DAS Signal Connection for Twin
CIF ASSY
B SLICE DDP ASSY
A SLICE DDP ASSY
CAM ASSY #54
CAM ASSY #53 CN51
CAM ASSY #52
CAM ASSY #51 CN50
CAM ASSY #50
CAM ASSY #49 CN49
CAM ASSY #48
CAM ASSY #47 CN48
CAM ASSY #46
CAM ASSY #45 CN47
CAM ASSY #44
CAM ASSY #43
CAM ASSY #42
CAM ASSY #41
CAM ASSY #40
CAM ASSY #39
CAM ASSY #38
CAM ASSY #37
CAM ASSY #36

CAM ASSY #35
CAM ASSY #34
CAM ASSY #33
CAM ASSY #32
CAM ASSY #31
CAM ASSY #30
CAM ASSY #29
CAM ASSY #28
CAM ASSY #27
CAM ASSY #26
CAM ASSY #25
CAM ASSY #24
CAM ASSY #23
CAM ASSY #22
CAM ASSY #21
CAM ASSY #20
CAM ASSY #19
CAM ASSY #18

CAM ASSY #17
CAM ASSY #16
CAM ASSY #15
CAM ASSY #14
CAM ASSY #13
CAM ASSY #12
CAM ASSY #11
CAM ASSY #10 CAM Assy nomenclature:
CAM ASSY #9
CAM ASSY #8
CAM ASSY #7 CN4
Odd Number CAM ASSYs
CAM ASSY #6 represent A Slice
CAM ASSY #5 CN3
CAM ASSY #4
CAM ASSY #3 CN2
CAM ASSY #2 Even Number CAM ASSYs
CAM ASSY #1 CN1 represent B Slice
37 DAS/DETECTOR
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Illustration 38 DAS Signal Connection for systems other than Twin
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3-2 DATA FLOW

The illustration 39 shows the data flow. The Detector generates an electrical current proportional to Xray intensity.
The electrical current is converted to voltage signal in the CAM board. The voltage signal is amplified to an appropriate
level, converted to digital data (serial), then converted to parallel data, also in the CAM board. The offset correction
of the data is performed in the DDP board. The data is then sent to to DTRE board where it is converted back to serial,
conditioned and then sent to Operator Console through the RF Slip ring.
Illustration 39 DAS block diagram
DAS
CAM board
Signal
FPGA
Digital
Electrical Conditioner Digital Parallel
Analog Serial data
Current DATA A/D data Serial/Parallel
DETECTOR Conversion
Converter
CAM control
signal generator
Timing Control
CIF board
Timing Control
Digital DDP board
Parallel
data
Offset
Correction
SLIP RING
DTRF2 Board (for Twin)
or DTRF Board (other than Twin)
FEC Parallel/Serial
Encoder Conversion
39 DAS/DETECTOR
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3-3 CIF BOARD

The CIF board performs the following functions:
D OGP Interface: exchange signals with OGP to control and synchronize the data acquisition.
D Control signals: generates control and timing signals to the other boards in the DAS for data acquisition.
D Zaxis beam tracking (only for Twin): controls the Xray intensity between the CAMs A and B Slices.
OGP Interface
The DAS subsystem receives scan control signals from OGP board, by which the CIF board generates control signals
for data acquisition. The exchanged signals with OGP are shown in illustration 310 and the functions of the signals
is as follows:
DTRIG : DAS trigger This is the timing signal initiates for data acquisition.
AXIAL 16pulses/view
SCOUT 1pulse/view
DENBL : DAS enable indicates that the data is valid.
H : data valid
L : data invalid
SDCOM : Serial Communication data from OGP to CIF (including signals, ZERO DETECT and OVER RANGE).
DSCOM : Serial Communication data from CIF to OGP (including signals, ZERO DETECT and OVER RANGE).
GPLS2 : Home Position
H : home position
L : not in home position
AC/OF : Signal to indicate if the scan is active or offset.
XRON : Signal to indicate that Xray exposure is On.
RESET : Reset signal for microprocessor in the DAS.
310 DAS/DETECTOR
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3-3 CIF BOARD (Continued)
Illustration 310 CIF board block diagram for systems other than Twin
to CAM
CIF
24.8832 CLK AZCLK
MHz Generator CAM CLK
32.0000 CLK ADCLK

DTRIG MHz Generator
DENBL
AC/OF
SDCOM
DSCOM micro
CIF
RESET processor
OGP control
circuit
GPLS2
ADTR3
XRON
data select
circuit
ROM
ROM
ROM CAM data

SCAN MODE
DDP
311 DAS/DETECTOR
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3-3 CIF BOARD (Continued)
Illustration 311 CIF board block diagram for Twin
Motor Driver for

Zaxis control
to CAM
CIF
24.8832 CLK AZCLK
MHz Generator CAM CLK
32.0000 CLK ADCLK

DTRIG MHz Generator
DENBL
AC/OF
SDCOM
DSCOM micro
CIF
RESET processor
OGP control
circuit
GPLS2
ADTR3
XRON
data select
circuit
ROM
ROM
ROM CAM data

SCAN MODE
DDP
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3-4 CAM BOARD

The CAM board performs the following functions:
D Conversion of electrical current signals from the detector to voltage signals.
D Signal level conditioning
D Analog to Digital conversion
D Serial to parallel (digital data) conversion.
D Generation of the timing signals for data gathering
See Illustration 312. The signal from the detector with the level proportional to the Xray intensity is fed to the CAM
board. The signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed
to the Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data. The serial data is
then sent to the control logic and converted to parallel data.
The control logic also generates the timing for data gathering, so that 1 channel data is taken at a time. This part of
circuit works synchronized with other CAM boards so that the data in entire DAS is taken a determined sequence.
Illustration 312 CAM board block diagram
DETECTOR DAS
CAM ASSY
ANA- DIGITAL
Electrical LOG SERIAL
Current DATA DATA
A/D
Converter
32 CHANNELS
A/D
Converter
CONTROL
LOGIC (FPGA)
DIGITAL
PARALLEL
DATA
(TO DDP)
CONTROL
SIGNALS
(FROM
CIF)
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3-4 CAM BOARD (Continued)
Illustration 313 Control Logic (FPGA) block diagram
FPGA

MCLK

RST unit1 control
shift resistor
CCLK CAM control logic 1CLK
master signal for generator
CAM control
from CIFside CAM
7bit data unit2 control
shift resistor shift resistor
master signal for 2CLK 1CLK

CAM control
to next CAM

SAMPLE for A/D
7bit data
sample
ADTR1
generator
ADTR2

ADTR3

parallel data from A/D
output data to DDP data Sdata : serial data
9bit data selector serial / parallel SCLK
conversion Busy

Comparator
to FPNR
ranging data
x 64
ACT/ REF select x 16
x 4
x 1
FPNR
head Amp 2nd Amp. 3rd Amp. A/D serial data
x64
SCLK
x16 SAMPLE BUSY
x4
x1
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3-5 DDP BOARD

The DDP board performs two functions: Offset data correction and test patter generation.
Offset Correction
The digital data coming from CAM board contains offset portion due to electronic circuitry and offset scan. The
illustration 314 shows a simplified block diagram of the offset cancel circuit in the DDP board.
The multiplex blocks MUX1 select inputs ports A or B according to the data type. Port A or B is selected if the data
is or active respectively. These multiplexers shift data by 4 bits. Both offset and active data are 16 bits long.
When first offset data comes, the multiplexers MUX2 select port B so that 0 is added (by ALU Arithmetic Logic
Unit) to the offset data. The result of this operation is then latched to the block LATCH in illustration 314. From the
next offset data on, the multiplexers MUX2 select input A so that the latched former result is added to new offset data.
this operation is repeated 16 times, what leads to 20 bits data.Only 16 most significant bits are taken, which results
in the average of the sum. This data is taken as a subtraction factor for offset correction.
During normal scan operation, the average of the offset data is subtracted from the active data in the ALU. This data
is then sent to a ROM for the purpose of data alteration.
Illustration 314 Offset correction circuit
LATCH
DATA
FROM
SPC A A
function DATA TO
MUX1 MUX2 ALU
(CAM D15D12 B B
DTRF
FPGA
circuit)
D15D12 A A
MUX1 MUX2 ALU
D11D9 B B
D3D0 A A
MUX1 MUX2 ALU
B B
Test Pattern Generation

The Test Pattern is for test purpose (DAS data pattern test) that checks the link between DDP board to DAS IFN board
(Operator Console).
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3-6 DTRF BOARD

The DTRF (Data Transfer with Forward Error Correction) executes the following functions:
D Error correction code generation
D Parallel/Serial conversion
D View packing
D Electric to light signal conversion
Illustration 315 DTRF2 for Twin
FEC
A Slice
Encoder
TAXI Optical RF
From RF To
Transmitter Trans- Trans-
DAS Receiver fiber OC
(P/S conversion) mitter mitter
FEC optics
B Slice fiber
Encoder
optics
Illustration 316 DTRF for systems other than Twin
TAXI Optical RF
From FEC RF To
Transmitter Trans- Trans-
DAS Encoder Receiver fiber OC
(P/S conversion) mitter mitter
optics
fiber
optics
Error correction code is added for checking the transmitted data at DASIFN assy in the Operator Console to assure
data accuracy.
The optical transmitter converts the electric signal to light signal, which is sent to RF transmitter by cable optics. The
RF transmitter sends the signal to RF receiver on the stationary gantry, where the signal is again converted to light
signal and sent to Operator Console by fiber optics.
For details about data communication, error correction and other information, refer to DASIFN in the Operator
Console.
316 DAS/DETECTOR
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XRAY GENERATOR
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 GENERAL DESCRIPTION I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1-1 GLOSSARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1-2 JEDI HIGH LEVEL BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SECTION 2 GENERAL DESCRIPTION II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

2-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2-2 STANDARD FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2-3 APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2-4 ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2-4-1 A Kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2-4-2 Options Depending on the Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2-4-3 A Packaging Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SECTION 3 TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3-1 JEDI TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
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ii XRAY GENERATOR
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SECTION 1 GENERAL DESCRIPTION I
1-1 GLOSSARY
Glossary of terms used in this document:
Term Definition
ABC Automatic Brightness Control. Regulation loop which makes the
measured brightness equal to brightness demand
AEC Automatic Exposure Control. Exposure cut off technique which
uses the brightness signal to cut the exposure
CAN Controller Area Network. A network used for localized control.
CPU Control Processor Unit. Microprocessor and peripherals which run
the software/firmware
EPLD Erasable Programmable Logic Device.
EMC Electro Magnetic Compatibility. The EMC function prevents the
generator from polluting the power source.
FPGA Field Programmable Gate Array. It is programmed by the CPU core
after the reset and handles all the exposure control logic including
the system interface real-time lines.
HV Ripple High voltage variations due to inverter current pulses. Typically a
few percent.
State Machine Software or hardware function which handles the state of a system
and authorize to go to the next state upon reception of specific
events.
IGBT Insulated gate bipolar transistor. A type of power switch
Ilp HV power inverter parallel resonant current; current in the parallel
inductor
Ilr HV power inverter serial resonant current; current in the serial
inductor.
MOS Metal Oxide Semiconductor. A type of power switch
OGP On Gantry Processor. Unit which drives the generator in CT
systems
PDU Power Distribution Unit
RMS Root Mean Square
11 XRAY GENERATOR
1-2
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GE MEDICAL SYSTEMS
JEDI HIGH LEVEL BLOCK DIAGRAM
JEDI GENERATOR / NP, NP+ FUNCTIONAL ARCHITECTURE
Illustration 11
System Control Bus
System Interface
Jedi Generator / NP, NP+ Functional Architecture

Low Voltage
kV Control Heater heater supply Rotation
bus
Power
Supply
DC Bus
AC/DC
12
rotation phases
High Voltage High Voltage HV Cables

EMC Inverter Tank
Filter
THEORY OF OPERATION
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XRAY GENERATOR
X-Ray Tube 1
1 phase
3 phase power
tube cooling
input
input
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Illustration 12 Jedi Generator / NP++, NP++ Twin Functional Architecture

JEDI GENERATOR / Np++, NP++ TWIN FUNCTIONAL ARCHITECTURE
13 XRAY GENERATOR
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14 XRAY GENERATOR
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SECTION 2 GENERAL DESCRIPTION II
2-1 INTRODUCTION
Jedi is the engineering name for a family of compact high frequency XRay generators. This
generator family covers a wide range of applications from mobile equipment up to vascular systems:
D JEDI 1225 kW: Mobile applications
D JEDI 2448 kW: CT applications
D JEDI 3250 kW: RAD applications
D JEDI 506580 kW: RF applications
D JEDI 100 kW: VASCULAR applications
2-2 STANDARD FEATURES

Jedi is a family of 150 kV generators operating from 12 kW up to 100 kW for all the major radiological,
fluoroscopic and CT applications. The family handles 1 ms to continuous exposures with tube currents
ranging from 0mA up to 1000 mA.
The generators feature the very latest technology available:
D Constant potential independent of line voltage variations
D Power generation by a highfrequency converter (High voltage ripple: 40 kHz140 kHz)
D Distributed microprocessor controlled functions (CAN bus)
Other features include:
D Single phase, three phase or battery power source
D Very low kV and mA ripple, excellent accuracies and dose reproducibility
D Compatible with a wide range of tubes, high speed or low speed, can supply up to 3 different
tubes. Thermal load interactive integrator ensuring optimum use of the heat protection curve of the
xray tube
D Available in various packaging configurations: gantry, undertable, cabinet
D Serviceability: high reliability, fast installation (no generator calibration), application error codes
ensure fast troubleshooting
D Meets CE marking (and in particular EMC), IEC, UL, CSA, MHW regulations (if required)
D Optional pulsed fluoroscopy
21 XRAY GENERATOR
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2-3 APPLICATIONS
RAD Surgery RF Vascular/ CT

Cardiac
3 Points Mode x x x
2 Points Mode x x x
1 Point Mode x x x
0 Point Mode x x
AEC x x x
Tomography x x
AET x x
Continuous/Pulsed Fluorosco- x x x
py
Rad Exposures x
Cinema 30 fr/s x
Cinema 90 fr/s x
ABC x x
Variable mA Scans x
Low mA Fluoroscopy x
Legend:
AEC Automatic Exposure Control
AET Automatic Tomographic Exposure
ABC Automatic Brightness Control in fluoroscopy
22 XRAY GENERATOR
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2-4 ARCHITECTURE
Refer to Illustration 21: Jedi Generator / Functional Architecture
The Jedi family is composed of 3 elements:
2-4-1 A Kernel
D High voltage chain composed of kV control, HV power inverter and HV tank
D Anode rotation function
D Tube filaments heater function
D Control bus for communication between the functions
D DC bus for power distribution to each function
D Input voltage to DC conversion: AC/DC function
D Low voltage power supply
D Application software, running on the kV control board
These functions are the Jedi core. They are present in all versions of the generator.
A function can be unique for all products, or can have several different releases based on product
specification.
Examples:
The anode rotation function is available in 2 releases:
D low speed rotation for applications where the tube has a max rotation of 3000 rpm
D high speed/low speed rotation for applications where at least one of the tubes can use
800010000 rpm
The control bus is unique.
2-4-2 Options Depending on the Application

D A System Interface which can be:
CT interface
RAD interface (console interface, room interface, AEC management present or not)
ATLAS interface
D EMC function
D Grid function (RF, vascular)
D Bias function (RF, vascular)
D Tube management (2 tubes or 3 tubes option)
23 XRAY GENERATOR
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GE MEDICAL SYSTEMS
JEDI GENERATOR / FUNCTIONAL ARCHITECTURE
Illustration 21
System Control Bus
System
Interface
Jedi Generator / Functional Architecture

heater supply LowVoltage
kV Control Heater Rotation
bus Power
Supply
preload (1 phase)
DC Bus
24
AC/DC
inverter controls
HV measures
fil. drives Tube

Tube Selection
Management
+safeties+fans
rotation phases
+safeties+fans
rotation phases
High Voltage High Voltage HV Cables
EMC Inverter Tank
Filter
THEORY OF OPERATION
CT HISPEED SERIES
XRAY GENERATOR
Grid/Bias X-Ray Tube 1 X-Ray Tube 2 Chiller

1 phase or 1 phase tube
phase power cooling
input input
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2-4-3 A Packaging Architecture

The packaging architecture consists in a set of boxes which can be put together in several ways to
make Jedi fit either in a cabinet, or a console foot, or a table foot. The boxes can also be split in 2
units distant of several meters (example: CT gantry). Refer to Illustration 22.
The boxes normally consist of the following:
Auxiliaries Box
D Rotation function
D Heater function
D Low voltage power supply (which can also be in the AC/DC box)
This box is always present.
Power Box
D HV tank
D HV power inverter
D kV control
D System interface (for the less complex system interface)
AC/DC Box
D MC filter (optional)
D AC/DC function
D Low voltage power supply (which can also be in the auxiliaries box)
System Interface Box

D RAD interface
D AEC interface
This box is present in the RAD product.
25 XRAY GENERATOR
CT HISPEED SERIES
REV 12 2202124
HEMIT (High efficiency motor insulated transformer)

D HV HEMIT Tank (transformers in high voltage)
D DCDisch board (to discharge the recovered energy of the rotor and securities)
This box is present with non insulated stator tubes (Performix on NP++ and NP++ Twin, for example)
Optional Boxes
D Tube selection
D Grid/Bias control
26 XRAY GENERATOR
CT HISPEED SERIES
REV 12 2202124
Illustration 22 Jedi Generator / Packaging Architecture
Inverter Assembly

Dual Snub

LVPS Board

(for TIGER) AC/DC

Tube Board
Gate Command
HV Board
+
KV Measure HV Tank Rectifier

Block
CT
Inter- KV Control Board
face EMC Filter (Optional)
POWER BOX AC/DC BOX

LVPS RAD AEC

Board Interface Interface
(for NP and
Heater Board Emperor)
SYSTEM INTERFACE BOX

Rotation Board FOR THE RAD PRODUCT
Tube Grid/Bias
Selection Control
Rotation Rotation
Capacitor Capacitor
(optional)
AUXILIARIES BOX OPTIONAL BOXES
27 XRAY GENERATOR
CT HISPEED SERIES
blank 2202124
28 XRAY GENERATOR
CT HISPEED SERIES
REV 12 2202124
SECTION 3 TYPICAL SIGNALS
3-1 JEDI TYPICAL SIGNALS

The following table describes the main signals of the generator. For each of them, typical values are
presented for the main applications:
Values
Signal/Application
(36 kW max, Qj tube)
Anode Rotation:
Phase P current during high speed run 2 A peak / 144 Hz
Phase A current during high speed run 2 A peak / 144 Hz
Filament Drive:
Inverter current in standby 2.5 A 3.3 A peak / 35 kHz
Heater DC input voltage in standby 160V
kV Control:
DC bus measure at 400 VAC 560 V
ILR at full power at 400 VAC 500 A peak / 50 kHz
ILR at min power at 400 VAC 80 A peak / 25 kHz
ILP at full power at 400 VAC 150 A peak / 50 kHz
ILP at min power at 400 VAC 150 A peak / 25 kHz
31 XRAY GENERATOR
CT HISPEED SERIES
blank 2202124
32 XRAY GENERATOR
CT HISPEED SERIES
REV 0 2202124
APPENDIX A SYMBOLS AND CLASSIFICATION
Symbol Publication Description
4175032 Alternating Current
3351 Threephase Alternating Current

3
3351 Threephase Alternating Current with neutral con-

3N ductor
Direct Current
4175019 Protective Earth (Ground)
348 Attention, consult ACCOMPANYING DOCUMENTS
4175008 OFF (Power: disconnection from the mains)
4175007 ON (Power: connection to the mains)
Warning, HIGH VOLTAGE
Emergency Stop
A1
CT HISPEED SERIES
REV 0 2202124
Symbol Publication Description

Type B
4175339 Xray Source Assembly Emitting
4175009 Standby
Start
Table Set
Abort
Intercom
(on Operator Console)

Power On: light on
Standby: light off
A2
CT HISPEED SERIES
REV 0 2202124
Symbol Description
Microphone (Mic)
Contrast
Brightness
_
System storage prior to installation:
Maintain storage temperature between 10 C and +60 C
_
System storage prior to installation:

Maintain noncondensing storage
humidity below 95%
DO NOT store system longer than 90 days

System storage and shipment:

Maintain Air Pressure between 750 and 1060hPa

A3
CT HISPEED SERIES
REV 0 2202124
CLASS 1 EQUIPMENT
Any permanently installed equipment containing operator or patient accessible surfaces must provide backup protec-
tion against electric shock,in case the BASIC INSULATION fails. In addition to BASIC INSULATION,Class1 equip-
ment contains a direct connection to a PROTECTIVE(EARTH) CONDUCTOR which prevents shocks when a person
touches a broken piece of equipment or touches two different equipment surfaces simultaneously.
TYPE B EQUIPMENT
CLASS I, II, or III EQUIPMENT or EQUIPMENT with INTERNAL ELECTRICAL POWER SOURCES provide an ade-
quate degree of protection against electric shock arising from (allowable) LEAKAGE CURRENTS or a breakdown
in the reliability of the protective earth connection.
ORDINARY EQUIPMENT
Enclosed EQUIPMENT without protection against the ingress of water.
OPERATION 0f EQUIPMENT
CONTINUOUS OPERATION WITH INTERMITTENT LOADING.
Operation in which EQUIPMENT is connected continuously to the SUPPLY MAINS. The stated permissible loading
time is so short that the long term onload operating temperature is not attained. The ensuing interval in loading is,
however, not sufficiently long for cooling down to the long term noload operating temperature.
EQUIPMENT not suitable for use in the presence of a FLAMMABLE ANESTHETIC MIXTURE WITH AIR or WITH
OXYGEN or NITROUS OXIDE
CLEANING
The ProSpeed S series system is NOT WATERPROOF. It is NOT designed to protect internal components against
the ingress of liquids.Clean external system surfaces(Gantry,table,consoles and accessories)with a soft cloth dipped
in hot water and wrung DAMP/DRY. (NOT dripping!) IF NECESSARY, use only mild (dish washing liquid) soap to re-
move dirt.
NOTICE
Avoid damage to equipment! Some spray and wipecleaners etch and permanently cloud
clear plastic surfaces!! Use only warm water and mild liquid soap to clean surfaces.
A4
GE Medical Systems: Telex 3797371
P.O. Box 414, Milwaukee, Wisconsin 53201 U.S.A.
(Asia, Pacific, Latin America, North America)
GE Medical Systems Europe: Telex 698626

283, rue de la Minire, B.P. 34, 78533 Buc Cedex, France

Ge CT Hispeed Serie NP Theory of Operation Manual

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Copyrighte 1998 2003 by General Electric Company

D THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.

D CE MANUEL DE MAINTENANCE NEST DISPONIBLE QUEN ANGLAIS.

D DIESES KUNDENDIENSTHANDBUCH EXISTIERT NUR IN

D ESTE MANUAL DE SERVICIO SLO EXISTE EN INGLS.

D ESTE MANUAL DE ASSISTNCIA TCNICA S SE ENCONTRA

D IL PRESENTE MANUALE DI MANUTENZIONE DISPONIBILE

IMPORTANT! . . . X-RAY PROTECTION

  

OMISSIONS & ERRORS

Devices not to be used near this equipment:

LIST OF EFFECTIVE PAGES

Tab Section Page REV 3 (Table/Gantry) i 13

Title page 17 General Description 11 to 13 13

Scan Operation 31 to 310 16 General Description I 11 to 13 12

Host Processor 21 to 24 17 Appendix

Other OC Components 41 to 44 10 Blank/Rear cover

Operator Console Updated: NP Linux (Sec. 1, Sec.2)

16 4/15/02 System Updated: Warm up information (Sec. 3).

13 12/08/00 Table/Gantry Minor corrections: Sec. 1, 2.

DAS/Detector Minor corrections: Sec. 2, 3.

12 10/25/00 System Removed System Options (Sec. 1).

Operator Console Minor corrections: Sec. 1.

Table/Gantry Minor corrections: Sec. 1, 2.

DAS/Detector Minor corrections: Sec. 2, 3.

Xray Generator Minor corrections: Sec. 1, 2, 3.

10 7/5/00 System Adopted the new revision control for Sec. 1, 2, 3.

Operator Console Adopted the new revision control for Sec. 1, 2, 3, 4.

Table/Gantry Adopted the new revision control for Sec. 1, 2.

DAS/Detector Adopted the new revision control for Sec. 2, 3.

Xray Generator Adopted the new revision control for Sec. 1, 2.

9 5/19/00 Added Twin system related information.

8 4/20/00 NP++ mA.

7 2/25/00 200VPDU note.

6 12/17/99 Added a Jedi (for NP++) block diagram.

5 10/19/99 Added information about NP++ (HiSpeed ZX/i).

4 2/26/99 Hard disk capacity.

3 11/27/98 OC Vide signal specifications, other.

2 8/31/98 Revised Table/Gantry, DAS/Detector tabs.

0 3/27/98 Initial release.

SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

SECTION 2 POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

SECTION 3 SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

SECTION 1 GENERAL DESCRIPTION

This CT system is comprised of the following main components (called subsystems):

D Operator Console (called OC)

D Scanning Gantry (called gantry)

Xray Generator (called XG)

D Patient Table (called table)

D Power Distribution Unit (called PDU)

D Advantage Windows Image Workstation

1-2 HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN

System Notation (NP, NP+, ...)

D Selectable scan times, MA values, FOV dimensions

D Remote Tilt function

D Number of arrays of DAS/detector units, i.e., single or twin DAS/detector subsystem

Table 11 Hardware Constitution

Subsystem/Component NP NP+ NP++ NP+ Twin NP++ Twin

1-3 SYSTEM OVERVIEW

Illustration 11 System Block Diagram

Power Unit Auxiliary Unit

OGP Board Step Motor