Helical Upgrade Installation Manual

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GE MEDICAL SYSTEMS HELICAL UPGRADE INSTALLATION
REV 2 2151639
D THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.

WARNING D IF A CUSTOMER’S SERVICE PROVIDER REQUIRES A LANGUAGE OTHER
THAN ENGLISH, IT IS THE CUSTOMER’S RESPONSIBILITY TO PROVIDE
TRANSLATION SERVICES.
D DO NOT ATTEMPT TO SERVICE THE EQUIPMENT UNLESS THIS SERVICE
MANUAL HAS BEEN CONSULTED AND IS UNDERSTOOD.
D FAILURE TO HEED THIS WARNING MAY RESULT IN INJURY TO THE SERVICE
PROVIDER, OPERATOR OR PATIENT FROM ELECTRIC SHOCK,
MECHANICAL OR OTHER HAZARDS.
D CE MANUEL DE MAINTENANCE N’EST DISPONIBLE QU’EN ANGLAIS.

AVERTISSEMENT D SI LE TECHNICIEN DU CLIENT A BESOIN DE CE MANUEL DANS UNE AUTRE
LANGUE QUE L’ANGLAIS, C’EST AU CLIENT QU’IL INCOMBE DE LE FAIRE
TRADUIRE.
D NE PAS TENTER D’INTERVENTION SUR LES ÉQUIPEMENTS TANT QUE LE
MANUEL SERVICE N’A PAS ÉTÉ CONSULTÉ ET COMPRIS.
D LE NON-RESPECT DE CET AVERTISSEMENT PEUT ENTRAÎNER CHEZ LE
TECHNICIEN, L’OPÉRATEUR OU LE PATIENT DES BLESSURES DUES À DES
DANGERS ÉLECTRIQUES, MÉCANIQUES OU AUTRES.
D DIESES KUNDENDIENST–HANDBUCH EXISTIERT NUR IN

ENGLISCHER SPRACHE.
WARNUNG
D FALLS EIN FREMDER KUNDENDIENST EINE ANDERE SPRACHE BENÖTIGT,
IST ES AUFGABE DES KUNDEN FÜR EINE ENTSPRECHENDE ÜBERSETZUNG
ZU SORGEN.
D VERSUCHEN SIE NICHT, DAS GERÄT ZU REPARIEREN, BEVOR DIESES
KUNDENDIENST–HANDBUCH NICHT ZU RATE GEZOGEN UND VERSTANDEN
WURDE.
D WIRD DIESE WARNUNG NICHT BEACHTET, SO KANN ES ZU VERLETZUNGEN
DES KUNDENDIENSTTECHNIKERS, DES BEDIENERS ODER DES PATIENTEN
DURCH ELEKTRISCHE SCHLÄGE, MECHANISCHE ODER SONSTIGE
GEFAHREN KOMMEN.
D ESTE MANUAL DE SERVICIO SÓLO EXISTE EN INGLÉS.

AVISO D SI ALGÚN PROVEEDOR DE SERVICIOS AJENO A GEMS SOLICITA UN IDIOMA
QUE NO SEA EL INGLÉS, ES RESPONSABILIDAD DEL CLIENTE OFRECER UN
SERVICIO DE TRADUCCIÓN.
D NO SE DEBERÁ DAR SERVICIO TÉCNICO AL EQUIPO, SIN HABER
CONSULTADO Y COMPRENDIDO ESTE MANUAL DE SERVICIO.
D LA NO OBSERVANCIA DEL PRESENTE AVISO PUEDE DAR LUGAR A QUE EL
PROVEEDOR DE SERVICIOS, EL OPERADOR O EL PACIENTE SUFRAN
LESIONES PROVOCADAS POR CAUSAS ELÉCTRICAS, MECÁNICAS O DE
OTRA NATURALEZA.
a
REV 2 2151639
D ESTE MANUAL DE ASSISTÊNCIA TÉCNICA SÓ SE ENCONTRA

DISPONÍVEL EM INGLÊS.
ATENÇÃO
D SE QUALQUER OUTRO SERVIÇO DE ASSISTÊNCIA TÉCNICA, QUE NÃO A
GEMS, SOLICITAR ESTES MANUAIS NOUTRO IDIOMA, É DA
RESPONSABILIDADE DO CLIENTE FORNECER OS SERVIÇOS DE TRADUÇÃO.
D NÃO TENTE REPARAR O EQUIPAMENTO SEM TER CONSULTADO E
COMPREENDIDO ESTE MANUAL DE ASSISTÊNCIA TÉCNICA.
D O NÃO CUMPRIMENTO DESTE AVISO PODE POR EM PERIGO A SEGURANÇA
DO TÉCNICO, OPERADOR OU PACIENTE DEVIDO A‘ CHOQUES ELÉTRICOS,
MECÂNICOS OU OUTROS.
D IL PRESENTE MANUALE DI MANUTENZIONE È DISPONIBILE

SOLTANTO IN INGLESE.
AVVERTENZA
D SE UN ADDETTO ALLA MANUTENZIONE ESTERNO ALLA GEMS RICHIEDE IL
MANUALE IN UNA LINGUA DIVERSA, IL CLIENTE È TENUTO A PROVVEDERE
DIRETTAMENTE ALLA TRADUZIONE.
D SI PROCEDA ALLA MANUTENZIONE DELL’APPARECCHIATURA SOLO DOPO
AVER CONSULTATO IL PRESENTE MANUALE ED AVERNE COMPRESO IL
CONTENUTO.
D NON TENERE CONTO DELLA PRESENTE AVVERTENZA POTREBBE FAR
COMPIERE OPERAZIONI DA CUI DERIVINO LESIONI ALL’ADDETTO ALLA
MANUTENZIONE, ALL’UTILIZZATORE ED AL PAZIENTE PER
FOLGORAZIONE ELETTRICA, PER URTI MECCANICI OD ALTRI RISCHI.
b
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IMPORTANT! . . . X-RAY PROTECTION

X-ray equipment if not properly used may cause injury. Accordingly, the instructions herein contained should
be thoroughly read and understood by everyone who will use the equipment before you attempt to place this
equipment in operation. The General Electric Company, Medical Systems Group, will be glad to assist and
cooperate in placing this equipment in use.
Although this apparatus incorporates a high degree of protection against x-radiation other than the useful beam, no
practical design of equipment can provide complete protection. Nor can any practical design compel the operator to
take adequate precautions to prevent the possibility of any persons carelessly exposing themselves or others to
radiation.
It is important that everyone having anything to do with x-radiation be properly trained and fully acquainted with the
recommendations of the National Council on Radiation Protection and Measurements as published in NCRP Reports
available from NCRP Publications, 7910 Woodmont Avenue, Room 1016, Bethesda, Maryland 20814, and of the
International Commission on Radiation Protection, and take adequate steps to protect against injury.
The equipment is sold with the understanding that the General Electric Company, Medical Systems Group, its agents,
and representatives have no responsibility for injury or damage which may result from improper use of the equipment.
Various protective material and devices are available. It is urged that such materials or devices be used.

All electrical installations that are preliminary to positioning of the equipment at the site prepared for the equipment shall be
performed by licensed electrical contractors. In addition, electrical feeds into the Power Distribution Unit shall be performed
by licensed electrical contractors. Other connections between pieces of electrical equipment, calibrations, and testing shall
be performed by qualified GE Medical personnel. The products involved (and the accompanying electrical installations) are
highly sophisticated, and special engineering competence is required.
In performing all electrical work on these products, GE will use its own specially trained field engineers. All of GE’s electrical
work on these products will comply with the requirements of the applicable electrical codes.
The purchaser of GE equipment shall only utilize qualified personnel (i.e., GE’s field engineers, personnel of third-party
service companies with equivalent training, or licensed electricians) to perform electrical servicing on the equipment.
c
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DAMAGE IN TRANSPORTATION
All packages should be closely examined at time of delivery. If damage is apparent, have notation “damage in
shipment” written on all copies of the freight or express bill before delivery is accepted or “signed for” by a General
Electric representative or a hospital receiving agent. Whether noted or concealed, damage MUST be reported to the
carrier immediately upon discovery, or in any event, within 14 days after receipt, and the contents and containers held
for inspection by the carrier. A transportation company will not pay a claim for damage if an inspection is not requested
within this 14 day period.
Call Traffic and Transportation, Milwaukee, WI (414) 827–3449 / 8*285–3449 immediately after damage is found. At
this time be ready to supply name of carrier, delivery date, consignee name, freight or express bill number, item
damaged and extent of damage.
Complete instructions regarding claim procedure are found in Section “S” of the Policy & Procedure Bulletins.
OMISSIONS & ERRORS
GE personnel, please use the GEMS CQA Process to report all omissions, errors, and defects in this documentation.
Customers, please contact your GE Sales or Service represenatives.
d
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CAUTION
Do not use the following devices near this equipment. Use of these devices near this equipment could cause
this equipment to malfunction.
Devices not to be used near this equipment:
Devices which intrinsically transmit radio waves such as; cellular phone, radio transceiver, mobile radio transmitter,
radio–controlled toy, etc.
Keep power to these devices turned off when near this equipment.
Medical staff in charge of this equipment is required to instruct technicians, patients and other people who may be
around this equipment to fully comply with the above regulation.
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REVISION HISTORY
REV DATE PRIMARY REASON FOR CHANGE
0 . . January 15, 1996 . . . initial release.
1 . . . . . Sep. 30, 1996 . . . SIMM P/N changed, others
2 . . October 15, 1997 . . . For Renaissance 3
3 . . . August 31, 1998 . . . XG CPU PATCH
PAGE REV PAGE REV PAGE REV PAGE REV PAGE REV
Title page . . . . . . . . . . 3 B . . . . . . . . . . . . . . blank 1–2 . . . . . . . . . . . . blank 3–3 . . . . . . . . . . . . . . . . 0 3–10 . . . . . . . . . . . . . . . 2
a to e . . . . . . . . . . . . . . 2 i...................3 2–1 to 2–2 . . . . . . . . . . 2 3–4 . . . . . . . . . . . . . . . 3 3–11 to 3–17 . . . . . . . 3
f . . . . . . . . . . . . . . blank ii . . . . . . . . . . . . . . blank 3–1 . . . . . . . . . . . . . . . . 1 3–5 . . . . . . . . . . . . . . . . 1 3–18 . . . . . . . . . . . blank
A ..................3 1–1 . . . . . . . . . . . . . . . . 0 3–2 . . . . . . . . . . . . . . . 3 3–6 to 3–9 . . . . . . . . . . 0 4–1 to 4–2 . . . . . . . . . . 2
A
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B
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TABLE OF CONTENTS
SECTION PAGE
SECTION 1 – INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
SECTION 2 – MATERIAL LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
SECTION 3 – INSTALLATION PROCEDURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1

3–1 PREPARATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
3–2 INSTALLATION PROCEDURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3–3 MEMORY INSTALLATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3–4 SOFTWARE INSTALLATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–9
3–5 OGP ROM REPLACEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–10
3–6 PATCHING XG CPU FIRMWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–11
3–7 OPERATION CHECK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–16
SECTION 4 – COMPLETING THE UPGRADE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4–1 ATTACHING THE RATING PLATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4–2 SENDING THE PRODUCT LOCATOR CARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
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ii
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SECTION 1 – INTRODUCTION
This Option kit can extend the slice numbers in Helical scan as follows:
Helical Upgrade kit 2150486 30 slices to 60 slices
1–1
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1–2
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SECTION 2 – MATERIAL LIST
HELICAL UPGRADE KIT

(2150486)
ITEM PART NAME PART NO. QTY. DESCRIPTION

1 DISKETTE ASSY 2141556 1 Cooling V5
2 IC 2150858 4 4M SIMM
3 IC 2150860 4 32M SIMM
4 RATING PLATE 2111577 1
5 INSTALLATION MANUAL 2151639 1
7 ROM ASSY 2121676–3 1 OGP U15E

8 LABEL 2198133 1 2107556–4
HELICAL UPGRADE KIT

(2150488)

2 IC 2150860 4 32M SIMM
7 ROM ASSY 2121676–3 1 OGP U15E

8 LABEL 2198133 1 2107556–4
2–1
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HELICAL UPGRADE KIT

(2150491)

2 IC 2150858 4 4M SIMM
3 IC 2150860 8 32M SIMM
7 ROM ASSY 2121676–3 1 OGP U15E

8 LABEL 2198133 1 2107556–4
2–2
REV 1 2151639
SECTION 3 – INSTALLATION PROCEDURE
3–1 PREPARATION
1. Verify that the contents of this option kit are correct according to the Material List. See Section 2.
Note
Some kit contain the two types of SIMMs. Do not mix their SIMMs from the kit, and the SIMMs which
are currently installed on the IPU2 Board;
Keep these SIMMs separately with their part numbers as follows until they are installed into the cor-
rect sockets, since the provided SIMMs are not labelled, and should be installed into the specified
sockets according to the SIMM part number.
2150858 SIMMs
2150860 SIMMs
Currently installed SIMMs
The pouches or packages for the SIMMs carry their labels; follow these labels. If NOT labelled, differ-
entiate the SIMMs as follows (if not labelled ONLY):
2150858 SIMMs: ICs are mounted on one side of the SIMM board
2150860 SIMMs: ICs are mounted on both sides of the SIMM board
Since the above mount types may change in the future, follow the labels and IGNORE the mount
types.
3–1
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3–2 INSTALLATION PROCEDURES

The Illustration below shows the flow of the installation procedures of this option.
3–3 MEMORY INSTALLATION

MEMORY MODULE INSTALLATION
MEMORY CHECK
D TEST SCAN (60)
D PAGING TEST
D POST RECON TEST
3–4 SOFTWARE INSTALLATION
3–5 OGP ROM REPLACEMENT
3–6 PATCHING XG CPU FIRMWARE (90 SLICE OPTION ONLY)
3–7 OPERATION CHECK
3–3 MEMORY INSTALLATION
3–3–1 Memory Module Installation

1. Switch OFF the Operator Console power.
2. Remove the OC front cover.
NOTICE
Electrostatic discharge hazard. It is essential to link yourself to ground potential by wearing

an anti static wrist strap. No board should ever be accessed without this precaution.
3. Remove the IPU2 Board from the OC nest, slot #2.
3–2
REV 0 2151639
3–3–1 Memory Module Installation (Continued)

4. Install the SIMMs supplied with this kit as follows:
a. According to the table below, remove the SIMMs from the socket.
Upgrade Kit Number Removed SIMM

2150486 all
2150488 NO SIMM removed
2150491 all
MD EXT SW
(S7A1)
J10 12 14
11 13 J15
J20 22 24
21 23 J25
SIMM SOCKETS
3–3
REV 3 2151639

b. Insert and push the SIMMs into the sockets on the IPU2 Board, taking care that the direction of each SIMM is
correct (See Illustrations 3–1, 3–2, and 3–3).
c. Set up the SIMMs such that the metal latches hold each SIMM securely (See Illustrations 3–3).
2150486 KIT 2150488 KIT 2150491 KIT
ÊÊ
Ê ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
Ê
ÊÊ ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
Ê
ÊÊ ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
Ê
ÊÊ ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
Ê
ÊÊ
Ê
ÊÊ ÉÉ
ÉÉÉ
ÉÉ
É
ÉÉÉÉ
ÉÉ ÊÊ
ÊÊÊÊ
ÊÊ
Ê
ÊÊ
Ê
ÊÊ ÉÉ
ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
ÉÉÉÉ
É
ÉÉÉ
ÊÊ
Ê
ÊÊ
J10
11
12
13
14
J15
ÉÉÉÉ
J10
11
12
13
14
J15
ÊÊÊÊ
ÊÊ
J10
11
12
13
14
J15
Ê
ÊÊ ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
Ê
ÊÊ ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
Ê
ÊÊ
Ê
ÊÊ ÉÉ
ÉÉÉ
ÉÉ
É
ÉÉÉÉ
ÉÉ ÊÊ
ÊÊÊÊ
ÊÊ
Ê
ÊÊ ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
Ê
ÊÊ ÉÉÉ
ÉÉÉÉ ÊÊÊÊ
Ê
ÊÊ
Ê
ÊÊ ÉÉ
ÉÉÉ
ÉÉ
É
ÉÉÉÉ
ÉÉ ÊÊ
ÊÊÊÊ
ÊÊ
Ê
ÊÊ
J20
21
22
23
24
J25
ÉÉÉÉ
ÉÉÉ
J20
21
22
23
24
J25
ÊÊÊÊ
J20
21
22
23
24
J25
ÊÊ
ÊÊ SOCKETS FOR 2150858 SIMMs
SOCKETS FOR 2150860 SIMMs
ÉÉ
NO SIMM IS INSTALLED.
ÉÉ SIMMS THAT ALREADY HAVE BEEN INSTALLED: DO NOT REMOVE THEM.
SIMM LOCATIONS
ILLUSTRATION 3–1
3–4
REV 1 2151639
INSERT AND PUSH THE SIMM

SIMM INTO THE SOCKET IN
THIS DIRECTION
THE SMALL CUT OUT ARCH ON EACH

SIMM, MARKS THE POSITION OF PIN 1.
ENSURE THAT EACH SIMM IS

CORRECTLY ORIENTED, WITH
PIN 1 CORRESPONDING TO
SYMBOL FOR PIN 1 POSITION
THE MARKER SYMBOL.
INSTALLATION OF SIMM (1ST. STEP)

ILLUSTRATION 3–2
GENTLY PUSH FORWARD THE

SIMM UNTIL THE METAL LATCH
TOP VIEW HOLDS THE SIMM SECURELY.
SIMM
METAL LATCH
INSTALLATION OF SIMM (2ND. STEP)

ILLUSTRATION 3–3
3–5
REV 0 2151639

5. Set the MD EXT switch shown in Illustration 3–1 as per the following switch setting illustration.
D MD EXT SW (S7A1) – Set the switches to the proper setting as shown below:
2150486 KIT 2150488 KIT 2150491 KIT
ON B–8A ON B–8A ON B–8A

’1’ ’1’ ’1’
’0’ ’0’ ’0’

1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
$19 $1A $1A

6. Install the IPU2 Board into the OC nest, slot# 2.
7. Install the OC front cover.
3–3–2 P–ON Test Check

8. Run the P–ON test level 2 and verify that the system starts up with no errors.
To run the P–ON test level 2, refer to the following procedure;
a. On the CPW Board (slot #1), set the Dip SW 8A1 as follows:
ON
ON : 1
OFF: 0
1 2 3 4 5 6 7 8
SW 8A1
b. Switch ON the OC power. It takes approx. 14 minutes for the P–ON test level 2 to finish. The start up screen
will appear when the P–ON test has been completed normally.
c. After verification of the P–ON test level 2, set the SW 8A1 to the default setting.
ON
ON : 1
OFF: 0
1 2 3 4 5 6 7 8
SW 8A1
Note:
There is no need to turn OFF the OC power when the SW8A1 setting is changed. The new setting is
available at next power ON sequence.
3–6
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3–3–3 Memory Check

Refer to the Operator Manual when necessary to perform the procedures below.
1. Perform 60 axial scans using the water phantom. Select the minimum scan time (do not select the partial scan)
and the minimum MA. The “Auto View” function should be ON. Write down the Study and Series Nos.
Check that the scans are normally performed.
- Paging Test
2. Magnify the image as follows.
a. Press [Crsr] to display the crosshair. Use the trackball to move the cursor into an appropriate position.
b. Press [Mag], and enter a factor other than 1.0.
3. Perform the Paging function as follows;
a. Press [Option Soft] to display the OPTION SOFTWARE menu.
b. Select the PAGING function.
c. Select FULL PLANE.
d. Select USER DEFINE.
e. Enter the image IDs of the former half of the acquired images (i.e., 30; the total is 60) so that AAA (# of Images
selected) equals to BBB (Total # available; BBB: 30) as in
PAGING
(AAA/BBB)
the right illustration:

WORK
SCREEN FOR
PAGING
f. Select AUTO PAGING.

Roll the trackball away from you to increase the display rate or roll it toward you to decrease it.
Check that the Paging function is normally performed and the images are normal.
Perform these checks also for the latter half of the acquired images.
3–7
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3–3–3 Memory Check (Continued)
- Post Recon Test

4. Enter the Maintenance menu.
5. Insert the BOOT disk into the floppy disk drive.
6. Enter $$ to display the following Service Maintenance menu.
*** MAINTENANCE MENU ***

1. SUPPORT
.
.
.
Select No. =
7. Select POST RECON.
8. Enter a raw data ID No which was acquired previously (suppose it is A.B.C).
9. Enter 10 for “NO. OF IMAGE”. Use the default values for the other parameters.
10. Enter A.B.C;2 for the Image ID No.
11. Display the image whose ID No is A.B.C;1.
12. Press [Image Process].
13. Select SUBTRACTION.
14. Enter the image ID A.B.C;2. The displayed image is subtracted by the image entered.
Verify that a nil image is left with the settings of Window Width “2” and Window Level “0”.
15. Exit IMAGE PROCESSING.
16. Press [Display Normal] to restore the image (A.B.C;1).
17. Repeat the above check using images A.B.C;3 ~ A.B.C;11.
18. Press [Image Delete] and delete the images A.B.C;1 ~ A.B.C;11 and images created by the test scans.
3–8
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3–4 SOFTWARE INSTALLATION

BOOT
1. Insert the floppy into the disk drive.
2. Touch the ”Maint” key on the LCD screen.
3. Type ”$$”, and select CUSTOM PARAMETER.
4. Select Change parameters.
5. Press key until the ”FD CONTENTS” setting menu is displayed.
BOOT
6. Remove the floppy, insert the CLV5 (Cooling Version 5) floppy, and press the <Enter>
key.
The software will be loaded to the system so that “x” replaces the number on the FD CONTENTS menu.
7. Press the key until the following message appears.
** CUSTOM PARAMETERS END **

***********************************
* PULL THE SYSTEM RESET BUTTON !! *
***********************************
8. Remove the floppy, then pull the RESET switch.
9. Verify that the system starts up normally, with no errors during the power–on self test.
3–9
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3–5 OGP ROM REPLACEMENT

1. Remove the both side covers and front cover from the Gantry.
2. Remove the OGP Board cover by removing four setting nuts.
3. Check the Part Number of SP ROM on the OGP board.
ROM Location ROM Part No. ACTION To Be Taken

U15E 2121676–2 or lower Replace the current
ROM with a new one
(2121676–3) supplied
with this kit.
2121676–3 or later No Action
OGP BOARD
FRONT VIEW
4. In case the ROM has been replaced:

Attach the Part No. label 2107556–4 on the part No. label of the OGP Board.
5. Re–install the OGP Board cover.

Cover Nut Torque: 26.5 kg–cm
6. Install the Gantry front cover and both side covers.
3–10
REV 3 2151639
3–6 PATCHING XG CPU FIRMWARE

Note
This Section 3–6 is for 90 slice option kit ONLY.
For systems with XG CPU V3.10 or lower, when scanning with ‘140kV/160mA/Zj–a:Large Focus (Qj: 3 ~ 10 mm
thickness) /72 or 743 sec or more scan time’ is performed, XG ERROR 371 often occurs, causing scanning to be
canceled.
This error does NOT occur when small focus (or 1~2mm thickness) technique, ‘71 sec or less’ scan time, or kV/mA
other than 140/160 is used. However, for site with 90 slice helical upgrade option, there is a possibility that this error
occurs.
1. Does XG ERROR 371 occur when scanning of ‘140kV/160mA/10mm thickness/90 sec/1sec scan time’ is per-
formed?
D Yes –> go to next step 2.
D No –> go to next section 3–7.
2. Checking firmware version:
NOTICE
Normally, Firmware Version can be checked on the CRT monitor by using Generator test, but
in this time you MUST remove CPU board and check its part number to know CPU version.
This is why firmware version V3xx or V4xx might be displayed in complex indication (ex:
04V496 for V401...).
a. Turn the ‘Rotate’, ‘XG’, and ‘Slip Ring’ switches OFF at the rear base of the Gantry.
Rotate XG Table/Tilt Control Slip Ring

(Safety Loop) 115 V
OFF
(DAS/DET)
b. Switch ON the Service switch on the SUB board.
3–11
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3–6 PATCHING XG CPU FIRMWARE (Continued)

c. Rotate the Gantry by hand and position it so that you can access the X–ray generator electronic rack on the
right side of the Gantry.
d. Switch OFF the Service switch on the SUB board.
e. Remove the board security bar from the electronic rack.
f. Remove the CPU board from the Electronic rack and Check Part No. of the CPU Board.
TO TABLE
FRONT VIEW FROM TABLE
ELECTRONIC RACK
g. Follow ‘action to be taken’ of the table below.
CPU Board Part No. Firmware Version Action To be Taken

2130913–6 3.10 Go to ‘Changing Parameter’ .
2112352–2 3.10 Go to ‘Changing Parameter’ .
2179211 4.01 Cancel this solution.
h. Install the XG CPU Board in the Electronic rack.
3–12
REV 3 2151639

3. Changing Parameter:
a. Turn the ‘Rotate’ switch OFF at the rear base of the Gantry.
Rotate XG Table/Tilt Control Slip Ring

(Safety Loop) 115 V
OFF (DAS/DET)
Note
The ‘Slip Ring 115V’ switch must remain ON and the TGP Board Service Switch must remain set to
‘SYS’.
b. Enter ‘GENERATOR TEST’ mode (MAINTENANCE→SUPPORT→GENERATOR/TUBE→GENERATOR

TEST).
***GENERATOR TEST***
TO GENERATOR FROM GENERATOR

TO:
c. Enter the following in response to ‘TO:’ for entering Parameter Change Mode.
For the System with Common PDU (2121798)
TO:dc750 ‘CR’
TO:SS0 ‘CR’
Note
For ‘dc’, the lower case must be entered.
TO:d229 ‘CR’ (To display data of Address #229)

FROM:DARAM229=0710 or 0730
(0710/0730: Old Data of Address #229)
NOTICE
If ‘0710’ or ‘0730’ is NOT displayed as DARAM229, cancel this solution procedures (Enter ‘N’
+ ‘CR’ to exit from this mode) .
3–13
REV 3 2151639

TO:m229=0900 ‘CR’ (To modify data of Address #229)
To::d229 ‘CR’ (To check overwriting)
FROM:DARAM229=0900 (0900: New Data of Address #229)
Note
For ‘m’ and ‘d’, the lower case must be entered.
Register the modified parameters to the EPROM as follows:

Verify that ‘WRITE EEP OK’ is displayed in response to ‘FROM:’.
TO:SSW ‘CR’
TO:N ‘CR’ FROM:WRITE EEP OK
For the System with Old PDU (P9180AB or P9180AF)
TO:dc550 ‘CR’
TO:SS0 ‘CR’
Note
For ‘dc’, the lower case must be entered.

FROM:DARAM229=0710 or 0730
(0710 / 0730: Old Data of Address #229)
TO:m229=0900 ‘CR’ (To modify data of Address #229)

To::d229 ‘CR’ (To check overwriting)
FROM:DARAM229=0900 (0900: New Data of Address #229)
Note
For ‘m’ and ‘d’, the lower case must be entered.
Register the modified parameters to the EPROM as follows:

Verify that ‘WRITE EEP OK’ is displayed in response to ‘FROM:’.
TO:SSW ‘CR’
3–14
REV 3 2151639

4. Verification:
a. Press <End> key to terminate the Generator Test mode and pull the reset switch under the Operator Console.
b. Enter GENERATOR TEST mode again and verify that d282 or d229 address has new data:
For the System with Common PDU (2121798)
TO:dc750 ‘CR’
TO:SS0 ‘CR’

FROM:DARAM229=0900 (0900: New data)
For the System with Old PDU (P9180AB or P9180AF)
TO:dc550 ‘CR’
TO:SS0 ‘CR’

FROM:DARAM229=0900 (0900: New data)
c. Turn the ‘Rotate’ switch ON at the rear base of the Gantry.
d. Perform continuous scans on condition of 140kV/160mA/10mm thickness/90 sec/1sec scan time. Verify that
all scans can be performed without XG Err 371.
3–15
REV 3 2151639
3–7 OPERATION CHECK

Perform scans following the steps below. For details, refer to the Operator Manual.
3–7–1 Cooling Check

1. Register to following scan protocol to the Preset Scan Parameter.
To enter the registration panel, touch the following button in this order.
[Preset Prmtr] ”
SCAN PARAMETER ”
I–EXTR (Example; if the customer uses all of menu No. in this anatomic location, select other location.) ”
MULTI/DYNAMIC Menu ”
No.10 (Example; if the customer uses this menu No., select another menu No.)
2. Modify only the items in bold and underlined to the following values.
Menu No. Slice Count

10 18
AQ Location Tilt TIME kV mA Thick- Interval DELAY Voice–S Voice–E WW WL

ness
01 0.0 * 3.0 120 250 10 0.0 0.0 0 0 200 0

02 0.0 * 3.0 120 250 10 0.0 0.0 0 0 200 0
.
.
.
17 0.0 * 3.0 120 250 10 0.0 0.0 0 0 200 0

18 0.0 * 3.0 120 250 10 0.0 0.0 0 0 200 0
3. After setting all of the parameters above, press button.
4. Verify that ‘NOW COOLING CHECK’ message appears on lower rigtht side of the screen, then return to the
preset scan parameters screen.
Note
This means that cooling check can have been completed successfully. If cooling check error occured,
‘**COOLING OVER LIMIT’ message will appear.
5. Press button repeatedly to exit from the scan parameter menu.
3–16
REV 3 2151639
3–7–2 Test Scans

1. Place a 25 cm WTR phantom on the cradle.
2. Press the blinking [New Patient] key on the LCD screen.
3. Press the following keys on the LCD screen in the order indicated.
D [Neck] ! [35 cm] ! [Dynamic Scan] ! [Confirm]
4. The [Multi/Dynamic Scan] technique page appears. Touch the [Scan Screen] key to change the scan parameters
as described below. For the other parameters, use the defaults.
Scan Parameter to be 2150486 Upgrade Kit 2150488 Upgrade Kit 2150491 Upgrade Kit
changed
Slice Count 60 90 90
Time 1s 1s 1s
kV 80 80 80
mA 60 60 60
Thickness 10 mm 10 mm 10 mm
Interval 0 mm 0 mm 0 mm
5. Touch the [Comfirm] key.
6. Press the following scan buttons under the scan panel in the order that these buttons blink:
D [Table Set] ! [Scan Set] ! [Scan]
7. Verify that no error occurs during the scans and that images are displayed one after another.
Note
The ring artifacts due to low dose can be ignored.
3–17
blank 2151639
3–18
REV 2 2151639
SECTION 4 – COMPLETING THE UPGRADE
4–1 ATTACHING THE RATING PLATE

1. Attach the provided rating plate to the following location. See Illustration below.
Note
If other optional software have been installed in the system, other rating plates should have been
attached. In this case, attach this rating plate above the others.
OPTION SOFTWARE
RATING PLATE
OC REAR VIEW OC RATING PLATE
b. Instruct the Operators as to the appropriate operation procedures of this software described in the Operator’s
manual.
4–1
REV 2 2151639
4–2 SENDING THE PRODUCT LOCATOR CARD

1. Fill in the blanks on the Product locator card provided in this kit.
2. Send the Product locator card to the appropriate addresses provided below.
Address for GEMS–AM sites:
Send to the address printed on the Product Locator Card.
Address for GEMS–E sites:
Send to the address printed on the Product Locator Card.
Address for GEMS–A sites:
Send to the local PLS or Service Administrator.
4–2

Helical Upgrade Installation Manual

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

!&"$e    & " $"

D THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.

D CE MANUEL DE MAINTENANCE N’EST DISPONIBLE QU’EN ANGLAIS.

D DIESES KUNDENDIENST–HANDBUCH EXISTIERT NUR IN

D ESTE MANUAL DE SERVICIO SÓLO EXISTE EN INGLÉS.

D ESTE MANUAL DE ASSISTÊNCIA TÉCNICA SÓ SE ENCONTRA

D IL PRESENTE MANUALE DI MANUTENZIONE È DISPONIBILE

IMPORTANT! . . . X-RAY PROTECTION

  

OMISSIONS & ERRORS

Devices not to be used near this equipment:

SECTION 1 – INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

SECTION 2 – MATERIAL LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1

SECTION 3 – INSTALLATION PROCEDURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1

SECTION 4 – COMPLETING THE UPGRADE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

Helical Upgrade kit 2150486 30 slices to 60 slices

Helical Upgrade kit 2150488 60 slices to 90 slices

Helical Upgrade kit 2150491 30 slices to 90 slices

SECTION 2 – MATERIAL LIST

HELICAL UPGRADE KIT

ITEM PART NAME PART NO. QTY. DESCRIPTION

7 ROM ASSY 2121676–3 1 OGP U15E

HELICAL UPGRADE KIT

ITEM PART NAME PART NO. QTY. DESCRIPTION

7 ROM ASSY 2121676–3 1 OGP U15E

HELICAL UPGRADE KIT

ITEM PART NAME PART NO. QTY. DESCRIPTION

7 ROM ASSY 2121676–3 1 OGP U15E

SECTION 3 – INSTALLATION PROCEDURE

3–2 INSTALLATION PROCEDURES

3–3 MEMORY INSTALLATION

D TEST SCAN (60)

D POST RECON TEST

3–4 SOFTWARE INSTALLATION

3–5 OGP ROM REPLACEMENT

3–6 PATCHING XG CPU FIRMWARE (90 SLICE OPTION ONLY)

3–7 OPERATION CHECK

3–3 MEMORY INSTALLATION

3–3–1 Memory Module Installation

2. Remove the OC front cover.

Electrostatic discharge hazard. It is essential to link yourself to ground potential by wearing

3. Remove the IPU2 Board from the OC nest, slot #2.

3–3–1 Memory Module Installation (Continued)

Upgrade Kit Number Removed SIMM

3–3–1 Memory Module Installation (Continued)

2150486 KIT 2150488 KIT 2150491 KIT

SOCKETS FOR 2150860 SIMMs

ÉÉ SIMMS THAT ALREADY HAVE BEEN INSTALLED: DO NOT REMOVE THEM.

3–3–1 Memory Module Installation (Continued)

INSERT AND PUSH THE SIMM

THE SMALL CUT OUT ARCH ON EACH

ENSURE THAT EACH SIMM IS

INSTALLATION OF SIMM (1ST. STEP)

GENTLY PUSH FORWARD THE

INSTALLATION OF SIMM (2ND. STEP)

3–3–1 Memory Module Installation (Continued)

2150486 KIT 2150488 KIT 2150491 KIT

ON B–8A ON B–8A ON B–8A

’0’ ’0’ ’0’

$19 $1A $1A

7. Install the OC front cover.

3–3–2 P–ON Test Check

3–3–3 Memory Check

!&"$e & " $"

* MAINTENANCE MENU *

CUSTOM PARAMETERS END