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Technical Publications

2202124
Revision 14

CT HiSpeed Series Theory of Operation

Copyrighte 1998, 1999, 2000, 2001 by General Electric Company

Operating Documentation

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CT HISPEED SERIES THEORY OF OPERATION 2202124

D THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.

WARNING

D IF A CUSTOMERS SERVICE PROVIDER REQUIRES A LANGUAGE OTHER THAN ENGLISH, IT IS THE CUSTOMERS RESPONSIBILITY TO PROVIDE TRANSLATION SERVICES. D DO NOT ATTEMPT TO SERVICE THE EQUIPMENT UNLESS THIS SERVICE MANUAL HAS BEEN CONSULTED AND IS UNDERSTOOD. D FAILURE TO HEED THIS WARNING MAY RESULT IN INJURY TO THE SERVICE PROVIDER, OPERATOR OR PATIENT FROM ELECTRIC SHOCK, MECHANICAL OR OTHER HAZARDS.

D CE MANUEL DE MAINTENANCE NEST DISPONIBLE QUEN ANGLAIS.

AVERTISSEMENT

D SI LE TECHNICIEN DU CLIENT A BESOIN DE CE MANUEL DANS UNE AUTRE LANGUE QUE LANGLAIS, CEST AU CLIENT QUIL INCOMBE DE LE FAIRE TRADUIRE. D NE PAS TENTER DINTERVENTION SUR LES QUIPEMENTS TANT QUE LE MANUEL SERVICE NA PAS T CONSULT ET COMPRIS. D LE NON-RESPECT DE CET AVERTISSEMENT PEUT ENTRANER CHEZ LE TECHNICIEN, LOPRATEUR OU LE PATIENT DES BLESSURES DUES DES DANGERS LECTRIQUES, MCANIQUES OU AUTRES.

WARNUNG

D DIESES KUNDENDIENSTHANDBUCH EXISTIERT NUR IN ENGLISCHER SPRACHE. D FALLS EIN FREMDER KUNDENDIENST EINE ANDERE SPRACHE BENTIGT, IST ES AUFGABE DES KUNDEN FR EINE ENTSPRECHENDE BERSETZUNG ZU SORGEN. D VERSUCHEN SIE NICHT, DAS GERT ZU REPARIEREN, BEVOR DIESES KUNDENDIENSTHANDBUCH NICHT ZU RATE GEZOGEN UND VERSTANDEN WURDE. D WIRD DIESE WARNUNG NICHT BEACHTET, SO KANN ES ZU VERLETZUNGEN DES KUNDENDIENSTTECHNIKERS, DES BEDIENERS ODER DES PATIENTEN DURCH ELEKTRISCHE SCHLGE, MECHANISCHE ODER SONSTIGE GEFAHREN KOMMEN.

D ESTE MANUAL DE SERVICIO SLO EXISTE EN INGLS.

AVISO

D SI ALGN PROVEEDOR DE SERVICIOS AJENO A GEMS SOLICITA UN IDIOMA QUE NO SEA EL INGLS, ES RESPONSABILIDAD DEL CLIENTE OFRECER UN SERVICIO DE TRADUCCIN. D NO SE DEBER DAR SERVICIO TCNICO AL EQUIPO, SIN HABER CONSULTADO Y COMPRENDIDO ESTE MANUAL DE SERVICIO. D LA NO OBSERVANCIA DEL PRESENTE AVISO PUEDE DAR LUGAR A QUE EL PROVEEDOR DE SERVICIOS, EL OPERADOR O EL PACIENTE SUFRAN LESIONES PROVOCADAS POR CAUSAS ELCTRICAS, MECNICAS O DE OTRA NATURALEZA.

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ATENO

D ESTE MANUAL DE ASSISTNCIA TCNICA S SE ENCONTRA DISPONVEL EM INGLS. D SE QUALQUER OUTRO SERVIO DE ASSISTNCIA TCNICA, QUE NO A GEMS, SOLICITAR ESTES MANUAIS NOUTRO IDIOMA, DA RESPONSABILIDADE DO CLIENTE FORNECER OS SERVIOS DE TRADUO. D NO TENTE REPARAR O EQUIPAMENTO SEM TER CONSULTADO E COMPREENDIDO ESTE MANUAL DE ASSISTNCIA TCNICA. D O NO CUMPRIMENTO DESTE AVISO PODE POR EM PERIGO A SEGURANA DO TCNICO, OPERADOR OU PACIENTE DEVIDO A CHOQUES ELTRICOS, MECNICOS OU OUTROS.

AVVERTENZA

D IL PRESENTE MANUALE DI MANUTENZIONE DISPONIBILE SOLTANTO IN INGLESE. D SE UN ADDETTO ALLA MANUTENZIONE ESTERNO ALLA GEMS RICHIEDE IL MANUALE IN UNA LINGUA DIVERSA, IL CLIENTE TENUTO A PROVVEDERE DIRETTAMENTE ALLA TRADUZIONE. D SI PROCEDA ALLA MANUTENZIONE DELLAPPARECCHIATURA SOLO DOPO AVER CONSULTATO IL PRESENTE MANUALE ED AVERNE COMPRESO IL CONTENUTO. D NON TENERE CONTO DELLA PRESENTE AVVERTENZA POTREBBE FAR COMPIERE OPERAZIONI DA CUI DERIVINO LESIONI ALLADDETTO ALLA MANUTENZIONE, ALLUTILIZZATORE ED AL PAZIENTE PER FOLGORAZIONE ELETTRICA, PER URTI MECCANICI OD ALTRI RISCHI.

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IMPORTANT! . . . X-RAY PROTECTION


X-ray equipment if not properly used may cause injury. Accordingly, the instructions herein contained should be thoroughly read and understood by everyone who will use the equipment before you attempt to place this equipment in operation. The General Electric Company, Medical Systems Group, will be glad to assist and cooperate in placing this equipment in use. Although this apparatus incorporates a high degree of protection against x-radiation other than the useful beam, no practical design of equipment can provide complete protection. Nor can any practical design compel the operator to take adequate precautions to prevent the possibility of any persons carelessly exposing themselves or others to radiation. It is important that everyone having anything to do with x-radiation be properly trained and fully acquainted with the recommendations of the National Council on Radiation Protection and Measurements as published in NCRP Reports available from NCRP Publications, 7910 Woodmont Avenue, Room 1016, Bethesda, Maryland 20814, and of the International Commission on Radiation Protection, and take adequate steps to protect against injury. The equipment is sold with the understanding that the General Electric Company, Medical Systems Group, its agents, and representatives have no responsibility for injury or damage which may result from improper use of the equipment. Various protective material and devices are available. It is urged that such materials or devices be used.

CERTIFIED ELECTRICAL CONTRACTOR STATEMENT


All electrical installations that are preliminary to positioning of the equipment at the site prepared for the equipment shall be performed by licensed electrical contractors. In addition, electrical feeds into the Power Distribution Unit shall be performed by licensed electrical contractors. Other connections between pieces of electrical equipment, calibrations, and testing shall be performed by qualified GE Medical personnel. The products involved (and the accompanying electrical installations) are highly sophisticated, and special engineering competence is required. In performing all electrical work on these products, GE will use its own specially trained field engineers. All of GEs electrical work on these products will comply with the requirements of the applicable electrical codes. The purchaser of GE equipment shall only utilize qualified personnel (i.e., GEs field engineers, personnel of third-party service companies with equivalent training, or licensed electricians) to perform electrical servicing on the equipment.

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DAMAGE IN TRANSPORTATION
All packages should be closely examined at time of delivery. If damage is apparent, have notation damage in shipment written on all copies of the freight or express bill before delivery is accepted or signed for by a General Electric representative or a hospital receiving agent. Whether noted or concealed, damage MUST be reported to the carrier immediately upon discovery, or in any event, within 14 days after receipt, and the contents and containers held for inspection by the carrier. A transportation company will not pay a claim for damage if an inspection is not requested within this 14 day period. Call Traffic and Transportation, Milwaukee, WI (414) 8273449 / 8*2853449 immediately after damage is found. At this time be ready to supply name of carrier, delivery date, consignee name, freight or express bill number, item damaged and extent of damage. Complete instructions regarding claim procedure are found in Section S of the Policy & Procedure Bulletins.

OMISSIONS & ERRORS


GE personnel, please use the GEMS CQA Process to report all omissions, errors, and defects in this documentation. Customers, please contact your GE Sales or Service representatives.

CAUTION
Do not use the following devices near this equipment. Use of these devices near this equipment could cause this equipment to malfunction. Devices not to be used near this equipment: Devices which intrinsically transmit radio waves such as; cellular phone, radio transceiver, mobile radio transmitter, radiocontrolled toy, etc. Keep power to these devices turned off when near this equipment. Medical staff in charge of this equipment is required to instruct technicians, patients and other people who may be around this equipment to fully comply with the above regulation.

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LIST OF EFFECTIVE PAGES


Tab Section (Warning and other important information) (Revision Information) 1 (System)
General Description Power Distribution Scan Operation

Page
Title page Title page rear a to d

REV
14 blank 0

3 (Table/Gantry)
General Description SubAssembly Description

i 11 to 13 21 to 216 i 11 21 to 210 31 to 316 i 11 to 13 21 to 27 31

13 13 13 9 0 13 13 12 12 12 12

4 (DAS/Detector)
General Description Detector Data Acquisition System (DAS)

A to B i 11 to 16 21 to 210 31 to 39 i 11 to 18 21 to 24 31 to 36 41 to 44

14 14 14 10 14 9 12 10 10 10

5 (Xray Generator)
General Description I General Description II Typical Signals

2 (Operator Console)
General Description Host Processor Connector Boards Other OC Components

Appendix
Symbols and Classification A1 to A4 Blank/Rear cover 0

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REVISION HISTORY
REV
14

Date
3/08/01 System

Primary Reason for Change


Added the KVMA stations info for twin systems (Sec. 1). Added: New type warmup scan, Asymmetric Scan, Twin cine scan, Auto mA (Sec, 3). Operator Console Table/Gantry DAS/Detector Xray Generator Minor corrections: Sec. 1, 2. Minor corrections: Sec. 2, 3. Removed System Options (Sec. 1). Minor corrections: Sec. 3. Operator Console Table/Gantry DAS/Detector Xray Generator Minor corrections: Sec. 1. Minor corrections: Sec. 1, 2. Minor corrections: Sec. 2, 3. Minor corrections: Sec. 1, 2, 3. Modified the illustration of Detector Module for Twin (Sec. 2). Adopted the new revision control for Sec. 1, 2, 3. Adopted the new revision control for Sec. 1, 2, 3, 4. Adopted the new revision control for Sec. 1, 2. Adopted the new revision control for Sec. 2, 3. Adopted the new revision control for Sec. 1, 2. Added Twin system related information. NP++ mA. 200VPDU note. Added a Jedi (for NP++) block diagram. Added information about NP++ (HiSpeed ZX/i). Hard disk capacity. OC Vide signal specifications, other. Revised Table/Gantry, DAS/Detector tabs. Updated System option description; Added 200VPDU, Scan Operation, NAA1 block diagram, ST1800 description; Generally updated DAS and XG. Initial release.

13

12/08/00

Table/Gantry DAS/Detector

12

10/25/00

System

11 10

9/05/00 7/5/00

DAS/Detector System Operator Console Table/Gantry DAS/Detector Xray Generator

9 8 7 6 5 4 3 2 1 0

5/19/00 4/20/00 2/25/00 12/17/99 10/19/99 2/26/99 11/27/98 8/31/98 7/10/98 3/27/98

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SYSTEM

TABLE OF CONTENTS
SECTION SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1 1-2 1-3 1-4 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN . . . . . . . . . . . . . . . . . . SYSTEM OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SYSTEM SPECIFICATIONS AND DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PAGE 11
11 12 13 15

SECTION 2 POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


2-1 2-2 POWER DISTRIBUTION UNIT (PDU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . POWER DISTRIBUTION SEQUENCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-1 Power On/Off Timing Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-2 Safety Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

21
21 27 27 29

SECTION 4 SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


4-1 4-2 WARMUP SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AXIAL SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-2 Scan Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-3 Asymmetric Scan (for Twin Systems only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-4 Twin Cine Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-5 Auto mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCOUT SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31
31 34 34 34 36 38 38 39

4-3

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SECTION 1 GENERAL DESCRIPTION

1-1

INTRODUCTION

The features of this CT (Computed Tomography) system, one of the HiSpeed series CT scanners, include the following: Workstation type information processing system, Solidstate xray intensity detector, Continuous rotation type gantry with slip rings and high frequency coupling. This CT system is comprised of the following main components (called subsystems): D Operator Console (called OC) D Scanning Gantry (called gantry) This subsystem further includes the following subsystems: DAS/Detector Xray Generator (called XG) D Patient Table (called table) D Power Distribution Unit (called PDU) The system may include some of the following customer option equipments: D Advantage Windows Image Workstation D Image Camera

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1-2

HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN

System Notation (NP, NP+, ...) According to system models or customer options installed on the system, a number of system specifications or functions available may differ from system to system; such are: D Selectable scan times, MA values, FOV dimensions D Remote Tilt function D Number of arrays of DAS/detector units, i.e., single or twin DAS/detector subsystem D ... However, the HiSpeed series scanners are principally grouped into four, for which the following notations are given respectively: NP, NP+, NP++ and Twin In this Theory of Operation manual, these notations NP, NP+, NP++, and Twin are used to describe differences among these four groups and to make descriptions of this manual read simpler. (However, Twin is further grouped into two, that is, NP+ Twin and NP++ Twin. In general outline, NP+ Twin systems are NP/NP+ systems with a twin DAS/detector, and NP++ Twin systems are NP++ systems with a twin DAS/detector. These notations also will be used when required.) Table 11 describes the constitution of the major hardware of NP, NP+, NP++, and Twin.

Table 11

Hardware Constitution NP NP+ NP++ common Halogen Lamps Laser common Firmware only is different. Standard or Option Standard common common common common (Jedi) common (D3142T tube) NP++ Jedi D3152T tube common twin DAS twin detector Jedi D3142T tube NP++ Jedi D3152T tube Standard or Option Standard NP+ Twin NP++ Twin

Subsystem/Component OC Gantry Mechanics Positioning Light Mechanics others Electrics Table IMS (Intermediate Support) Others DAS Detector Xray Generator Xray Tube PDU

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1-3

SYSTEM OVERVIEW

Illustration 11 shows the system block diagram. The operator console (OC) controls the entire system, according to the operators operations. The OC sends instructions to the processor of the TGP board, which then controls the gantry and table subsystems according to the instructions. The TGP board processor also passes the OC instructions to the processor of the OGP board which is equipped on the gantry rotative frame. The OGP board controls the DAS subsystem, the collimator aperture, or positioning lights according to the passed instructions. The OGP board processor also passes the instructions from the TGP board to the processor of the xray generator subsystem. The XG processor controls the xray generator according to the instructions (originally from the OC). Reversely, the OC receives status information from the TGP board or other processors (via the TGP board).

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GE MEDICAL SYSTEMS REV 14 Illustration 11


Power Unit Interface Board KV Control Board AC/DC Converter DC Bus Filament Board + Inverter Low Voltage Power Supply Rotor Board + Inverter

CT HISPEED SERIES THEORY OF OPERATION 2202124 System Block Diagram


Auxiliary Unit

CAN Bus (Control Bus)

Gantry Rotative Block


Xray Generator = Power Unit + Auxiliary Unit

EMC Board

High Voltage Inverter

High Voltage Tank

High Voltage

Xray Tube

Temperature Controller Detector

RF Transmitter Optical Fiber OGP Board Coaxial Cable Slip Rings RF Receiver Optical Fiber Slip Rings SUB Board Cover Boards Tilt Pot. Servo Amp.

DTRF Board

DAS

Step Motor Encoder

Collimator

TGP Board

Cover Switches Pump/Valve for Gantry Tilt Servo Motor Encoder

Gantry Stationary Block

CDROM 5 MOD Host Processor

OPERATOR CONSOLE
PCI Bus Recon Engine

AC 115 V AC 380 480 V

AC 115 V

AC 200 V

Power Distribution Unit (PDU)


Table Connector Board Potentiometers for Horizontal, Height, (IMS) Touch Sensors Latch Switches Position Feedback Cradle Encoder Cradle Step Motor

Table Board Raw Data Disk DBPCI Power Supply (DC 24 V)

Speaker Foot SW

System Disk

Step Motor Driver

Servo Amp. Pump/Valve for Table Elevation Keyboard DASIFN Feedback For systems equipped with Intermediate Support (IMS) only

Servo Motor

TABLE

Intermediate Support (IMS)

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1-4

SYSTEM SPECIFICATIONS AND DATA

The following tables describe system specifications and data.

Table 12

Scan Time Scan Time [sec]

Standard (NP, NP+) 1.0 (Half scan) 1.5 2.0 3.0

with 1.0 sec Scan Option 0.7 (Half scan) 1.0 1.5 2.0 3.0

with 0.8 sec Scan Option, NP+ Twin 0.5 (Half scan) 0.8 1.0 1.5 2.0 3.0

Standard (NP++, NP++ Twin) 0.46 (Half scan) 0.7 1.0 1.5 2.0 3.0

Table 13

Scan/Recon/Cal FOV FOV for NP+, NP++, and Twin [cm] (or, for NP with 50 cm FOV Option) Scan/Recon FOV PHead (18) Head (25) Body (50) Cal FOV Small (25) Small (25) Large (50)

FOV for NP [cm] Scan/Recon FOV PHead (18) Head (25) Body (45.5) Cal FOV Small (25) Small (25) Large (50)

Table 14

Image Spatial Resolution Related No. of Detector Active Channels NP 717 NP+, NP++ 793 Twin 793 X 2 512 X 512 Recon Matrix

No. of Actual Scan Views Full Scan 972 Half Scan 635

For 50 cm or 45.5 cm scan FOV

The same type detector is used both for NP and NP+ & NP++; the difference between the numbers of active channels is realized by software.

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1-4

SYSTEM SPECIFICATIONS AND DATA (continued) Table 15 KV Standard for NP, NP+, NP+ Twin 80 60 150 10 150 10 150 (with 200 mA Option) 60 200 10 200 10 200 KVMA Stations MA (with 300 mA Option) 60 300 10 300 10 250 Standard for NP++, NP++ Twin 60 400 10 440 10 380

120 140

Note 1: MA: in 10 mA increments. For Twin systems with V/R 5.5 or later system software, it is in 5 mA increments. Note 2: NP++ systems use the 6.3 MHU cooling algorithm. However, one system model which is grouped into the NP++ Twin systems and called HiSpeed NX/i Plus uses 5.3 MHU cooling algorithm. And the maximum MA available for HiSpeed NX/i Plus is 350 mA (at 120 kV). The system automatically selects Large Focus or Small Focus according to a slice thickness selection as described in Table 16.

Table 16

Combination of Slice Thickness and Focus Size (for Customer) Slice Thickness [mm] Focus Size Twin 1i mode (1 image/rotation) 2i mode (2 images/rotation), or helical mode 0.5*, 1 2, 3, 5, 7 Small Large

except for Twin

1, 2 3, 5, 7, 10

1*, 2 4, 6, 10

Note *: available with 1mm or 0.5 mm Option.

Table 17

Other Specifications

Exposure Start Angle (Axial Scan) Head & Posteriafossa Studies: 90/270 deg. Other Studies: 0/180 deg.

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SECTION 2 POWER DISTRIBUTION

2-1

POWER DISTRIBUTION UNIT (PDU)

The power distribution unit (PDU) provides powers to all the subsystems. Two types of PDUs are available: 400VPDU and 200VPDU. Either one of two types is used according to the mains voltage (main power from the power distribution box of sites). (200VPDUs are used in Japan only.) See Illustration 21 (400VPDU) or 22 (200VPDU). These illustrations describe the following: D All the powers except XG Power are output from the system transformer on the PDU. (200VPDUs generate XG Power by a stepup transformer.) D XG Power powers the xray generator (XG) equipped on the gantry rotational block. Powers for xray tube high voltage, xray tube anode rotation, XG control circuit boards, etc. are derived from this power. However, the fan and pump for the xray tube are powered by SR115. D SR115 powers all the components equipped on the gantry rotational block except the xray generator. D TG115 powers all the components equipped on the gantry stationary block except the axial motor. The gantry tilt pump also is operated by this power. TG115 also powers the table subsystem. D TG200 powers the axial motor which rotates the gantry rotational block. D OC115 supplies power to the operator console.

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2-1

POWER DISTRIBUTION UNIT (PDU) (continued) Illustration 21 Mains AC 380 480 V Power Distribution to Subsystems (400VPDU) Slip Rings Xray Generator
BRK1

XG Power (AC 380 480 V) System Transformer SR115 (AC 115 V) TG115 (AC 115 V)

Rotational Block (Stationary Block)

SW1 TG200 (AC 200 V) OC115 (AC 115 V)

400VPDU

BRK2 Axial Motor

Gantry

Table

CB1

Noise Filter

To internal components CRT

CB2 Operator Console

External components

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2-1

POWER DISTRIBUTION UNIT (PDU) (continued) Illustration 22 Power Distribution to Subsystems (200VPDU) Slip Rings XG Power (AC 400/416 V) SR115 (AC 115 V)
BRK1

Mains AC 200/208 V

Stepup Transformer System Transformer

Xray Generator Rotational Block (Stationary Block)

TG115 (AC 115 V) SW1 TG200 (AC 200 V) OC115 (AC 115 V)

200VPDU

BRK2 Axial Motor

Gantry

Table

CB1

Noise Filter

To internal components CRT

CB2 Operator Console

External components

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2-1

POWER DISTRIBUTION UNIT (PDU) (continued)

Illustration 23 (400VPDU) or 24 (200VPDU) shows the simplified circuit diagram of the PDU. As shown; D (400VPDU): The voltage of mains power should be within a range of 380 V 480 V. The system transformer provides terminals for 380 V, 400 V, ... , 480 V to connect power to the nearest voltage terminal. D (200VPDU): The system transformer provides terminals for 200 V and 208 V to connect power to the nearest voltage terminal. D The SR115 output is not controlled by any relay contacts; the power is always present in the CT system unless circuit breakers CB2 or CB5 are turned off. D The RMT CNT board contains relays which turn on/off K5, K6, K7, or K19 according to signals from the operator console and gantry. D The relay K1 is turned on some delay time later after K21 is turned on. The resisters connected to the relay K21 suppress rush currents. Earlier PDU models have the following circuits between Mains and XG Power, instead of the circuits shown in Illustration 23 or 24. (The relay K20 is turned on some delay time later after K1 is turned on. The resisters connected to the relay K20 suppress rush currents.) Mains K1 K20 XG Power

CB1

CB2 However, the further earlier PDU models do not have K20 and connected resisters. D Circuit breakers CB1, CB2, ... , CB6 can turn OFF powers, as written below: CB1: XG Power CB2: TG200, TG115, SR115, OC115 CB3: TG200 CB4: TG115 CB5: SR115 CB6: OC115

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2-1

POWER DISTRIBUTION UNIT (PDU) (continued) Illustration 23 Inside of PDU (400VPDU) K1 XG Power

Mains (3 Phase, 380 480 V)

CB1 System Transformer

K21

F10

CB2

480

CB3
460 440 415 400 380 0 0 115 200

K2

TG200

CB4

K3

TG115

CB5

SR115

CB6 CB1 CB6: Circuit Breakers

K4

OC115

PON FAN AL From OC EOFFO RSTEM SAFEO K5 SAFEG From Gantry RSTEMG EOFFG (The above means: for example, When K6 is turned on, then K3 and K2 are turned on.)
K21 K19

K1 K4 K3 K2

RMT CNT Board

K7 K6

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2-1

POWER DISTRIBUTION UNIT (PDU) (continued) Illustration 24 Inside of PDU (200VPDU)

Mains (3 Phase, 200/208 V) Stepup Transformer CB1 System Transformer

K1

XG Power

K21

F10

CB2

208

CB3
200 200

K2

TG200

CB4
115

K3

TG115

CB5
0 0

SR115

CB6 CB1 CB6: Circuit Breakers

K4

OC115

PON FAN AL From OC EOFFO RSTEM SAFEO K5 SAFEG From Gantry RSTEMG EOFFG (The above means: for example, When K6 is turned on, then K3 and K2 are turned on.)
K21 K19

K1 K4 K3 K2

RMT CNT Board

K7 K6

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2-2 2-2-1

POWER DISTRIBUTION SEQUENCE Power On/Off Timing Chart

The power on/off controls of XG Power, TG200, TG115, etc. shown in Illustration 21 or 23 (or, 22 or 24, for 200VPDU) are shown in Illustration 25. In the illustration; EOFF turns close or open when either EOFFO or EOFFG turns close or open. That Safety Loop turns close or open means the system safety loop is closed or opened, including both SAFEO and SAFEG turns close or open. (See the Safety Loop description on page 210) Reset Emergency turns close or open when either RSTEM or RSTEMG turns close or open. Illustration 25 describes the following: D Timing B: Only when Safety Loop turns close, XG Power turns ON. D Timing E: When EOFF turns open, XG Power, TG200, and TG115 turn OFF; however, OC115 remains ON. If pins 1 and 2 of JP1 are shorted on the RMT CNT board and the TGP board is at revision 4 or later (has a cradle emergency deceleration function), TG200 and TG115 turn OFF 0.4 sec 0.5 sec later after EOFF turns open; during this period, the cradle is decelerated to a halt. D Timing I: When Reset Emergency turns open, TG200 and TG115 are brought to ON. D Timing J: When FAN AL turns open, XG Power, TG200, TG115 and also OC115 all turn OFF.

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POWER DISTRIBUTION SEQUENCE (continued) Illustration 25 A


close

Power Distribution Sequence B C D E F G H I J K L M N

P ON EOFF Safety Loop


Reset Emergency

open close open close open close open close open ON OFF ON OFF ON OFF

FAN AL OC115 XG Power SR115

ON

TG200 TG115

OFF ON OFF

Pins 2 and 3 of JP1 are shorted on the RMT CNT board.


ON

TG200 TG115

OFF ON OFF

Pins 1 and 2 of JP1 are shorted on the RMT CNT board; and the TGP board is at revision 4 or later (has a cradle emergency deceleration function). Note Safety Loop is always closed in normal conditions after the system is switched ON or reset; this means that XG Power is always supplied to the gantry in normal conditions.

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POWER DISTRIBUTION SEQUENCE (continued) Safety Loop

Illustration 26 shows a diagram of the system safety loop. As shown, components on the gantry rotational block are not involved in the safety loop. Illustration 26 Safety Loop

Switch on the Gantry Rear Base SAFEG

TGP Board

Gantry

RMT CNT Board

PDU Operator Console Host Processor REAR CN1 Board SAFEO PCI Bus DBPCI Board

K5 Relays K1 XG Power

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2-2

POWER DISTRIBUTION SEQUENCE (continued)

Open of Safety Loop The safety loop can be opened by any of the following: D Switch equipped on the gantry rear base. D Control by the TGP board: The TGP board opens the safety loop in any of the following cases: When the TGP board receives from the OGP board a safety loop open demand due to an overtime of xray exposure. When the TGP board detects abnormal communication with the OGP board or the operator console (host processor) during xray exposure. D Control by the host processor (i.e., system software): The host processor opens the safety loop in any of the following cases: When the host processor receives a safety loop open demand from the TGP board. When the host processor detects an overtime of xray exposure. When the host processor detects an extra scan (other than scans which the host processor instructed the TGP board to perform) performed. D Signals such are EOFF, FAN AL, etc.

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SECTION 3 SCAN OPERATION

3-1

WARMUP SCAN

for Systems with earlier than V/R 5.5 System Software The system requires the Warmup scans to warmup the xray tube prior to starting the first scan after poweron , or when more than two hours have elapsed since the last scan. The warmup scans also have to be performed before performing phantom calibration which updates the calibration files (CAL files), if more than three hours have elapsed since the last scan. The following scans are performed during the warmup scan sequence.

Table 31 Purpose for xray tube warming for calibration

Warmup Scans (earlier than V/R 5.5) No. of Scans (Until the tube case temperature reaches 30%.) 3

The first series of scans warmup the xray tube. During the last three scans the system collects data to analyze it, and update CAL files: The system stores the data and checks whether the data falls within the specified range. If the data is out of range, the system reports a WARMUP ERROR. If the data is within range, the system compares the data with the previous warmup data and calculates correction factors for CAL files, and updates them. Illustration 31 shows the warmup scan sequence.

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WARMUP SCAN (continued) Illustration 31 Warmup Sequence Start Tube warmup scans Error Message Error & Error code Yes Any error? No Scans & Data collection Raw Data Disk

Data check Error Message Warmup Error No Within range? Yes Calculates correction factors CAL files correction End

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Raw data files

CAL files

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3-1

WARMUP SCAN (continued)

for Systems with V/R 5.5 or later System Software The system requires the Warmup scans to warmup the xray tube prior to starting the first scan after poweron , or when more than two hours have elapsed since the last scan. The warmup scans also have to be performed before performing phantom calibration which updates the calibration files (CAL files), if more than three hours have elapsed since the last scan. The operator selects either the Tube Warmup or Daily Calibration warmup scans, as listed in Table 32.

Table 32 Type Tube Warmup Daily Calibration

Warmup Scans (V/R 5.5 or later) Purpose for xray tube warming for xray tube warming for calibration and xray alignment for system diagnostics (IQ Performance Measurement Scan) No. of Scans (Until the tube case temperature reaches 13%.) (Until the tube case temperature reaches 30%.) 11 (8: calibration 3: xray alignment) 7

The Tube Warmup type scans or the first series of scans of Daily Calibration warmup the xray tube. This means that Tube Warmup only warms the xray tube. During the scans for calibration (eight scans) the system collects data to analyze it, and update CAL files: The system stores the data and checks whether the data falls within the specified range. If the data is out of range, the system reports a WARMUP ERROR. If the data is within range, the system compares the data with the previous warmup data and calculates correction factors for CAL files, and updates them. During the scans for xray alignment (three scans), the system collects data to analyze the xray alignment.

IQ Performance Measurement Scan During the IQ Performance Measurement scans the system collects data to analyze it, and displays the result in the Status column. Analyzed data: Offset mean, Offset SD, Stability of air calibration, mAdependent DAS linearity variation, Scan time dependent DAS linearity variation, A/B ratio. For details, refer to the Home descriptions, in Section Service Tool, System tab, of the Diagnostics manual.

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AXIAL SCAN General

Prior to the actual xray exposure, the system collects 256 views of offset data generated from the DAS. The offset data is used to correct actual xray data. The system performs a full 360 deg. scan (clockwise direction only) during 0.7 (for NP++, NP++ Twin only), 0.8, 1.0, 1.5, 2.0, or 3.0 sec. These are called scan speeds or scan times, and not all of the them are available to all the systems; the available scan speeds or times vary according to system models or options installed on the systems. During a scan, the system collects 972 views of data. A view period differs according to the scan speed. The following table shows this relation: Scan Speed (sec) 0.7 (NP++, NP++ Twin only) 0.8 1.0 1.5 2.0 3.0 View Period (sec/view) 720 823 1029 1543 2058 3086

The view period is synchronized with the azimuth encoder pulse. Axial scans are initiated from either 0 deg. or 180 deg. azimuth angle except for helical scans; during helical scans, scans can be initiated from any azimuth angle. The system knows gantry azimuth position by azimuth encoder pulse counts and the Gantry Pulse which indicates that the gantry azimuth is at this moment at 0 deg., i.e., home position).

3-2-2

Scan Sequence

Illustration 32 shows the axial scan sequence.

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AXIAL SCAN (continued) Illustration 32 Axial Scan Sequence

Parameters change? (No)

(Yes) Scan parameters setting Cradle positioning Rotor start Gantry acceleration Offset data collection High Voltage ON Das enable Data collection High Voltage OFF Gantry deceleration (KV, MA, Slice Thickness, Scan Time, Slice Interval) (Patient is moved into the gantry scan plane) (The rotor is accelerated to operation speed) (Gantry is accelerated to the constant scan speed) (256 views of offset DAS data are collected ) (Start xray exposure) (DAS is enabled to collect data) (972 views of actual DAS data are collected; view period is synchronized with gantry azimuth position)

(Yes) Next scan? (No) End

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AXIAL SCAN (continued) Asymmetric Scan (for Twin Systems only)

Asymmetric Mode In scanning, you can choose either symmetric or asymmetric slices from the twindetector. There are three choices in the Asymmetric Mode. D [ OFF ] mode : (Symmetric is OFF) acquires slices with the same thickness (symmetric). D [ 10:1 ] ([ 10:2 ], [ 6:1 ]) mode : acquires slices with different thickness (asymmetric). [ 10:1] : provides 10 mm and 1 mm slices. [ 10:2] : provides 10 mm and 2 mm slices. [ 6:1] : provides 6 mm and 1 mm slices. Illustration 33 shows how asymmetric slices are obtained. In Asymmetric Mode, the slice, whose thickness is shown at the Axial Thickness field, asymmetrically straddles the center of the twindetector. This slice is called fused, whereas the other thinner slice is derived from one detector.

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AXIAL SCAN (continued) Illustration 33 Asymmetric Slice Asymmetric slices of [10:1]


Collimator

Radiation area

Center between detectors A and B

1mm slice 9mm Detector A 10mm slice Detector B

Asymmetric slices of [10:2]


Collimator

Radiation area

Center between detectors A and B

2mm slice 8mm Detector A 10mm slice Detector B

Asymmetric slices of [6:1]


Collimator

Radiation area

Center between detectors A and B

1mm slice 5mm Detector A 6mm slice Detector B

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In Cine scan, continuous multiple 360degree data acquisition is achieved without table travel or at the same location. In Twin Cine scan, images are displayed in the 1i mode during prospective recon; on the other hand, in retrospective recon, images from Detector A and images from Detector B can be displayed alternately (2i mode). The 1i mode display is also possible in retrospective recon. 3-2-5 Auto mA

The Auto mA feature enables the system to reduce mA and patient dose with negligible effect on image quality. The system varies mA according to patient shape and a predetermined algorithm for scan location. The Auto mA feature requires one Scout scan, either AP or LAT in the illustration below, to obtain necessary information on Xray attenuation. (The last scout scan data is used for the Auto mA scan.) The system automatically increases mA at the scan locations where Xray attenuation is relatively high and decreases mA at the scan locations where Xray attenuation is relatively low. In the example below, the mA is set low at the start scan location (lung area), then the mA will increase at the location of liver area, and then it will decline at the location of abdomen area. Illustration 34 Auto mA
0degree Scout (AP) Tube

Patient

90degree Scout (LAT) Tube

Start

End

mA

0
Start End

Scan location

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3-3

SCOUT SCAN

Prior to the actual xray exposure, the system collects 64 views of offset data generated from the DAS. The offset data is used to correct actual xray data. The system advances the cradle and collects data from 793 (or 717 for NP) active channels. The cradle speed is 75 mm/sec, and data collection timing is synchronized with the cradle encoder pulse. Illustration 35 shows the scout scan sequence. Illustration 35 Scout Scan Sequence (KV, MA, Scan Range) (Cradle is moved to the Start + 20 mm position) (The rotor is accelerated to operation speed) (64 views of offset DAS data are collected ) (Cradle is accelerated to the constant scan speed) (Start xray exposure) (DAS is enabled to collect data) (Actual DAS data are collected; view period is synchronized with cradle position)

Scan parameters setting Cradle positioning Rotor start Offset data collection Cradle acceleration High Voltage ON Das enable Data collection High Voltage OFF Cradle Stop

Cradle move start

Start position Cradle stop

High Voltage ON Cradle acceleration

DAS enable Data collection

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OPERATOR CONSOLE

TABLE OF CONTENTS
SECTION SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1 1-2 1-3 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MAIN COMPONENT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OPERATIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PAGE 11
11 14 17

SECTION 2 HOST PROCESSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


2-1 2-2 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BUILTIN I/O (INPUT/OUTPUT) DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

21
21 24

SECTION 3 CONNECTOR BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


3-1 3-2 CONNECTOR BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . REAR CN1 BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2-1 Filter Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2-2 Audio Mixer Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31
31 31 31 33

SECTION 4 OTHER OC COMPONENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


4-1 4-2 4-3 4-4 4-5 KEYBOARD, MOUSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CRT DISPLAY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NAA1 (NP/NP+ AUDIO AMPLIFIER 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PCI EXPANSION UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ST1800 (SERIAL PORT EXTENSION BOX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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SECTION 1 GENERAL DESCRIPTION

1-1

OVERVIEW

The information processing system (operator console) is based on the PCI (Peripheral Component Interconnect) bus architecture. The host processor of the operator console is a Unix workstation, which is on the market. (Workstation: The physical hardware that contains the CPU and graphics boards, a system disk, and a power supply. You connect it to a monitor, keyboard, and mouse to configure a working system.) The model type of this workstation is called O2. Illustration 11 or 12 shows a block diagram of the operator console of this CT system.

O2 System Software O2 System Software is the standard IRIX operating system software for the O2 and Silicon Graphics tools that come on the system disk and on the CDROM that you use in the event of a system crash. (IRIX: Silicon Graphicss version of the UNIX operating system)

PCI Bus PCI stands for Peripheral Component Interconnect a bus specification. The PCI bus is a highperformance local bus used to connect peripherals to memory and a microprocessor. A wide range of vendors make devices that plug into the PCI bus. The PCI bus can be operated at its intended highperformance by using DMA transfers. To perform DMA transfers with the PCI bus, a DMA controller should be equipped on the connected peripheral.

Address Map For a PCI bus based computer system, memory address mapping and I/O address mapping of PCI devices are determined during Configuration Cycle which the host processor generates when the system is powered on. Each of the PCI devices requests its required address space size from the host processor during the cycle. The PCI devices also (such are DBPCI, NPRIF, others) within this operator console are relocatable in the PCI address space. This means that address mappings of the PCI devices are not fixed. The physical addresses assigned by the host processor can be known by reading a set value on a base address register within configuration registers of each PCI device. (With a VME bus, base addresses are determined by dip switches.)

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GE MEDICAL SYSTEMS REV 12 Illustration 11 Operator Console Block Diagram (NP, NP+, NP++)

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HIS/RIS Ethernet Analog RGB 21 Color Monitor PS/2 Mouse Scan Panel PS/2 103 Keyboard Keyboard PDU Laser Camera RS232C Laser Camera Interface (DASM) ST1800 (Serial Port Extension Box) Ultra/Wide SCSI Bit3 Backplane Card Raw Data Disk Raw Data Disk(Option) RS232C Ultra/Wide SCSI (Internal) Host Processor Bit3 PCI Host Card Bit3 PCI Backplane Controller Card PCI Bus NPRM

NPRS

System Disk System Disk (Option) Ultra/Wide SCSI (External) CDROM 5 MOD

NPRIF

5 MOD (Option) AHA2940UW

RS232C Scan Room TGP

DBPCI

Gantry Mic Table Speaker

NAA1

OC Speaker

Includes Rear CN1 Board, Rear CN2 Board, VSPL Board, and IST Board (for SmartView) DASIFN

DAS Heart Gate Trigger Optical Fiber NPRIF: Recon Engine Interface NPRM: Recon Engine Master NPRS: Recon Engine Slave DBPCI: DAS Buffer DASIFN: DAS Interface

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GE MEDICAL SYSTEMS REV 12 Illustration 12 HIS/RIS Ethernet Analog RGB 21 Color Monitor PS/2 Mouse Scan Panel PS/2 103 Keyboard Keyboard PDU Laser Camera RS232C Laser Camera Interface (DASM) ST1800 (Serial Port Extension Box) RS232C Ultra/Wide SCSI (Internal) Host Processor Bit3 PCI Host Card Operator Console Block Diagram (Twin)

CT HISPEED SERIES THEORY OF OPERATION 2202124

Bit3 PCI Backplane Controller Card PCI Bus

NPRS

System Disk System Disk (Option) Ultra/Wide SCSI (External) CDROM 5 MOD

NPRM

NPRIF

5 MOD (Option) AHA2940UW Ultra/Wide SCSI Bit3 Backplane Card

RS232C Scan Room TGP

Raw Data Disk

DBPCI

DBPCI

Gantry Mic Table Speaker

NAA1

OC Speaker

Includes Rear CN1 Board, Rear CN2 Board, VSPL Board, and IST Board (for SmartView) DASIFN2

DAS Heart Gate Trigger Optical Fiber NPRIF: Recon Engine Interface NPRM: Recon Engine Master NPRS: Recon Engine Slave DBPCI: DAS Buffer DASIFN: DAS Interface

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MAIN COMPONENT DESCRIPTION

Host Processor The host computer performs all of the following operations: User interface Image processings/display (all processings except recon) Communication Database control Raw data/image data flow control Image storage Scan/recon control System Disk (Ultra/Wide SCSI; within the Host Processor) The host processor includes a hard disk drive which is used as the system disk. This system disk mainly stores the followings: System and application software Images Calibration files System parameters D Capacity: 4 GB or 9 GB In the case of a 4 GB disk, Image Storage: 4000 images (take up 2 GB (1 image/0.5 MB)) (The remained 2 GB storage is used for System software/swapping space + Application software) For NP++ and Twin systems, 9 GB disk drives are used. NPR (NP/NP+ Recon Engine) This is a unit for performing highspeed recon operations. This unit consists of the following three kinds of circuit boards: D NPRIF (NPR Interface): Performs interfaces between the PCI bus and the NPRM. D NPRM (NPR Master): Includes one master DSP (Digital Signal Processor), main memory called Global Memory 0, others. D NPRS (NPR Slave): Includes two slave DSPs which perform arithmetic operations under the NPRM control. The NPRS is a piggyback board equipped on the NPRM, and up to eight NPRS boards can be equipped on the NPRM (i.e., up to 16 slave DSPs can be equipped). The NPRIF only is connected to a PCI slot. The NPRIF and NPRM are connected by cables.

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MAIN COMPONENT DESCRIPTION (continued)

DBPCI (DAS Buffer for PCI Bus) This is a circuit board, serving as a ring buffer whose capacity is 4 MB. This buffer temporarily stores DAS data. This board also includes control registers for the OC keyboard, safety loop, others.

DASIFN (DAS Interface for NP/NP+/NP++) DASIFN2 (for Twin) This is a circuit board which converts raw data sent from the gantry in optical serial signals into electric parallel signals. During conversion, this board performs transfer error corrections. This board also includes one channel for receiving Heart Gate Trigger inputs.

PCI Expansion Unit Consists of PCI Host Card, PCI Backplane Controller Card, PCI Backplane Card. Increases the number of slots which are connected to the PCI bus of the host processor. Circuit boards for scan/recon are connected to these slots (NPRIF, DBPCI, AHA2940UW).

REAR CN1 This is a circuit board which mainly has two functions: Signal filtering and Audio control. This board is connected to OC external components such are keyboard, TGP board on the gantry, or Power Distribution Unit (PDU), and is also connected to OC internal components such are DBPCI board, NAA1 board, or others.

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MAIN COMPONENT DESCRIPTION (continued)

Raw Data Disk (Ultra/Wide SCSI) This is a highspeed hard disk drive for storing raw data. D Capacity: 2 GB Raw Data Storage: 450 raw data files (70% of the disk space is used for raw data storage; 30 % of it is not used, because of low read/write rate) For NP++, the capacity is 4 GB. For Twin, the capacity is 9 GB, and two drives of this are used.

Archive Equipment (MOD) MOD is used for archiving images/raw data. MOD is also used during system software installation to temporarily store data. D Capacity: 2.3 GB, Density: 4x (Hitachi/Sony MOD) Images: DICOM format Raw data: YMS format as Unix files (Includes Cal files, others)

CDROM Drive Used for system software loading.

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1-3

OPERATIONAL DESCRIPTION

Scan Data Main Flow Illustration 13 or 14 shows: Raw data acquired during scans is first buffered by DBPCI; The raw data is then stored to a hard disk drive which is a highspeed type and exclusively used for raw data storage; The raw data is then transferred to the NPR where recon processing is performed; The reconstructed images are then read by the host processor which converts the image data to video signal, as well as stores the image data to the system disk, which also stores system software. As shown, raw data and image data are mainly transferred over the PCI bus. Illustration 13 Scan Data Main Flow (NP, NP+, NP++) Scan

Raw Data CRT Display PCI Bus

Video Signal Host Processor Raw Data

DBPCI

Raw Data Disk System Disk Image Data Raw Data NPR Recon

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OPERATIONAL DESCRIPTION (continued) Illustration 14 Scan Data Main Flow (Twin) Scan

Raw Data CRT Display PCI Bus Ach Video Signal Host Processor Raw Data Raw Data Disk System Disk Image Data Raw Data NPR Recon Raw Data Disk Bch

DBPCI

DBPCI

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SECTION 2 HOST PROCESSOR

2-1

OVERVIEW

The host processor is a Unix workstation; its product name is O2. The host processor is the central unit within the operator console, performing various operations such are described below: D Controls data transfer between data storage units and memory devices located on NPR, etc. D Controls the entire scan sequence; it sends necessary instructions to relevant processors and devices, and receives status information from those processors and devices. D Controls the NPR (NP Recon Engine). D Performs graphics operations. The host processor includes a DC power supply (175 watts); it requires AC 115 V power.

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2-1

OVERVIEW (continued)

Table 21 shows main specifications of the host processor.

Table 21

Host Processor Specifications Component Specification Model Operating Frequency Cache Memory MIPS R5000SC or Rm5200 200 MHz or 300 MHz (Rm5200) 32 kB data/32 kB instruction primary cache 1 MB secondary cache 64 MB (32 MB DIMM X 2) or128 MB (64 MB DIMM X 2) Synchronous DRAM, 100 MHz, 4 banks, 288bit wide up to 256 MB with 16 Mbit SDRAM up to 1 GB with 64 Mbit SDRAM 4 GB (5400 rpm) or 9 GB (7200 rpm) 12 X 1280 x 1024 pixels 75.03 Hz Frame Rate 1024 x 768, 800 x 600, 640 x 480 also supported Frame Buffer Formats 32 + 32 bit FB (32 + 32 double buffered) 32 bit FB (16 + 16 double buffered) 16 bit FB (8 + 8 double buffered) 8 bit overlay Video Signal Horizontal Statistics Horizontal Front Porch Horizontal Back Porch Horizontal Sync Horizontal Active Horizontal Line Rate First Field Statistics Vertical Front Porch Vertical Back Porch Vertical Sync Vertical Active Vertical Sync Pulse : 118.52 nsec ; 16 pixels : 1.84 sec ; 248 pixels : 1.07 sec ; 144 pixels : 9.48 sec ; 1280 pixels : 79.98 KLines/sec : 12.50 sec : 475.14 sec : 37.51 sec : 12.80 msec : 38.58 sec ; 1.00 lines ; 38.00 lines ; 3.00 lines ; 1024.00 lines ; 3.09 lines

Central Processor

Main Memory

Capacity (standard) Type Upgrade

Hard Disk Drive (System Disk) CDROM Graphics

Capacity Type Resolution

Pixel Clock : 135.00 MHz

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2-1

OVERVIEW (continued) Table 21 Host Processor Specifications (continued) Component Builtin I/O (Input/Output) Specification PC (PS/2) compatible keyboard and mouse 2 x Ultra Fast/Wide SCSI singleended, 1 internal, 1 external (40 MB/sec each) 2 x Serial 460 kbps (DB9) 1284 Parallel (C miniature) 10BaseT/100BaseTX Ethernet standard (RJ45) Audio Expansion Slot Analog stereo input/output One halflength, 64bit PCI slot (10 W) IRIX 6.5 with XFS or later

Operating System

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2-2

BUILTIN I/O (INPUT/OUTPUT) DESCRIPTION

The host processor has input/output ports for the following:

Display Analog RGB signals are output from this port.

Keyboard/Mouse A PS/2 keyboard and a mouse are connected these ports, respectively.

10BaseT/100BaseTX Ethernet A diagnostic console, an independent console, or an HIS/RIS is connected to this port. DICOM compatible; the operator console can send (push) images to those devices using DICOM protocols at a 10 Mbits/sec maximum (the transfer speed varies according to receiver models, the size of transfer data, protocols, etc.).

Ultra/Wide SCSI (Internal This port is provided within the host processor) The O2 host processor includes a hard disk drive. This drive is used as the system disk, and is connected to this port. The disk is also used for storing images.

Ultra/Wide SCSI (External) Since this port is a wide SCSI, the data bus of this port is 16bit wide. However, within this OC, devices which handle eightbit data such are CDROM drive, MOD drive, or Camera Interface are connected to this port in daisy chain.

Serial Port (RS232C) Provides two serial ports; one is used for communication with the TGP board, and the other is used for communication with scan keys (on the keyboard).

Audio Provides audio input/output ports. The host processor can record audio signals from a microphone or other sources, and can play recorded audio data. This function is used for Autovoice.

PCI Bus Slot The host processor is equipped with one PCI slot. In order to expand the PCI bus, a PCI Host Card is connected to this slot. The PCI Host Card is a component of the PCI Expansion Unit.

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SECTION 3 CONNECTOR BOARDS

3-1

CONNECTOR BOARDS

All the signal cables connected between the operator console (OC) and subsystems/components outside the OC run through these connector boards. The connector boards mainly include filters for each signal line to improve the EMC (ElectroMagnetic Compatibility) performance of the OC. The REAR CN1 board also includes an audio mixer, relay for the safety loop, and others.

3-2

REAR CN1 BOARD

Illustration 31 shows a block diagram of the REAR CN1 board. The REAR CN1 board is connected to a slot of the connector box of the OC, and as shown in Illustration 31, the board is connected to OC external components such are the keyboard, TGP board on the gantry, or the Power Distribution Unit (PDU), and is connected to OC internal components such are DBPCI board, NAA1 board, or others. The board functionally consists of the following two blocks: D Filter Block D Audio Mixer Block

3-2-1

Filter Block

As shown in Illustration 31, this block includes the following interface circuits: D Keyboard Interface: Mainly interfaces between the keyboard (including the scan buttons) and the host processor. D TGP Interface: Mainly interfaces RS232/RS422 communications and Direct Lines between the TGP board located on the gantry and the host processor or keyboard. D PDU Interface: Mainly interfaces Power On/Off, Emergency, Safety Loop, or other signals between the Power Distribution Unit (PDU) and the keyboard or the FRONT PNL board of the OC.

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3-2

REAR CN1 BOARD (continued) Illustration 31 REAR CN1 Block Diagram REAR CN1 Scan Panel Keyboard RS232 KB Reset Emergency Stop/Rest Direct Line PS/2 from/to Patient, Auto Voice, Foot SW, Xray On Direct Line TGP Reset Xray On RS422 NAA2 from Patient to Patient Speaker on Table Fan Alarm PDU
Emergency Stop/Rest

Filter Block PS/2 Fan Alarm

RS232 RS232

Host Processor

Thermal Guard Front Panel

Gantry

Power On Shutdown KB Reset Safety Loop Shutdown TGP Reset Xray LED

PCI Bus (via PCI Expansion Unit)

TGP Board

DBPCI Board

Talk On

Safety Loop Power On External Speaker (option)

Audio Mixer Block

Xray On Alert On CSA/WRA ACKA Address (4:0) Data (7:0) Line OUT Line IN

DBPCI Board (only for Twin)

from Patient Foot SW

CD Line OUT CDROM Drive from Patient NAA1

Foot Switch

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REAR CN1 BOARD (continued) Audio Mixer Block

The audio mixer block of the REAR CN1 board Includes registers for audio function, and also includes an audio amplifier for headphones or external speakers (which are not the OC speaker which is driven by the NAA1 board). See Illustration 32. As shown, audio signals from several sources are mixed in this block. D Audio Input Sources: Microphone on the gantry (Intercom: From Patient) Microphone on the OC keyboard (Intercom: To Patient) Audio output on the host processor (Auto Voice play) Audio output on the CDROM drive (BGM, or other) Synthesized sounds on the REAR CN1 board (Xray On, Alert) These are generated using a programmable timer which is controlled by software. D Audio Output Destinations: Speaker on the gantry Speaker on the OC Audio input on the host processor (for recording Auto Voice messages)

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3-2

REAR CN1 BOARD (continued)

Audio Input Switch As shown in Illustration 32, analog switches are used to switch audio input sources, and are controlled by the Talk On button on the keyboard or a foot switch connected to the keyboard. D An intercom function is provided between the OC room and the gantry room. The Talk On button on the keyboard switches communication direction, as described below: While Talk On is pressed, communication of OC room gantry room is enabled; and both of Auto Voice (both in the OC room and the gantry room) and sound from the CDROM drive (both in the OC room and the gantry room) are disabled. While Talk On is released, communication of gantry room OC room is enabled. If a foot switch is provided, this also serves as the Talk On button. D The Xray On sound and alert sounds in the OC room are always enabled, even when Talk On is pressed. D Auto Voice messages can be recorded by using the microphone equipped on the keyboard while pressing the Talk On button. While Auto Voice is being played, communication of gantry room OC room can be disabled. This prevents Auto Voice sound degradation on the OC side, because: Auto Voice is played both in the OC room and the gantry room. If communication of gantry room OC room is enabled, the Auto Voice messages are doubled on the OC side, which degrades the sounds.

Volume Control The following two kinds of volume control are provided. D The following can be adjusted with the manual volumes on the keyboard: Volume of communication of OC room gantry room (through the keyboard microphone) Recording level of Auto Voice messages (through the keyboard microphone) Auto Voice volume in the gantry room Volume of communication of gantry room OC room (through the gantry microphone) D The electronic volumes are controlled by software, controlling the following: Auto Voice volume in the OC room Sound volume from the CDROM drive both in the gantry room and the OC room Alert sounds in the OC room Xray On sound in the OC room

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GE MEDICAL SYSTEMS REV 10 3-2 REAR CN1 BOARD (continued) Illustration 32 Audio Mixer Block Stereo Signal Monaural Signal Xray Sound Programmable Timer Modulation

CT HISPEED SERIES THEORY OF OPERATION 2202124

from/to DBPCI Xray On/Off Alert On Address (4:0) Data (7:0)

Analog Switch OP. Amp.

Frequency & Alert Sound Alert pulse width controller (one shot) Electronic Volume Sound Volume Control Register to Electronic volume control

from CD Drive from Host Processor Line OUT from Gantry Mic from OC Mic to Patient Volume

from Patient Volume

Lowpass Filter

Auto Voice Volume

Scan Keyboard Volumes

to Host Processor Line IN

to Gantry Speaker

to OC Speaker

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3-2

REAR CN1 BOARD (continued)

Audio Register Address Map Illustration 33 shows an address map of audio control registers. The addresses shown are mapped at an area within the DBPCI Input/Output address space of the host processor. Registers mapped within the I/O register bases $50 $7F are located on the DBPCI board. These are controlled by the host processor, and control signals only are sent from DBPCI to the REAR CN1 board. Registers mapped within the I/O register bases $80 $FF are located on the REAR CN1 board. These registers and the DBPCI board are connected via a dedicated bus. Illustration 33 Audio Register Address Map D7 D0

$b4 $b0 $ac $a8 $a4 $a0 CD GA Volume Register CD OC Volume Register AV OC Volume Register Alert Volume Register Xray Volume Register PIT1 Register $90 PIT0 Register $80

$60

AUX0 Auto Voice Playback Register

Note: CD: CDROM Drive GA: Gantry OC: Operator Console AV: Auto Voice PIT: Sound Pulse Width Control

$54 IO Register Base $50

Alert Sound Register Xray On Sound Register

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SECTION 4 OTHER OC COMPONENTS


4-1 KEYBOARD, MOUSE D 103 Keyboard, Mouse: This 103 keyboard and the mouse have a PS/2 interface for connecting themselves to the host processor. D Scan Keys, Microphone: Keys used for scanning, and a microphone used for an intercom are incorporated into the keyboard. These keys are connected to the host processor via RS232C. The keyboard and the TGP board are connected by Direct Lines for the remote cradle and gantry tilt control. 4-2 CRT DISPLAY D 21 color monitor D The resolution used for the CRT Display is 1280 x 1024 matrix. The refresh rate used is 75 Hz. 4-3 NAA1 (NP/NP+ AUDIO AMPLIFIER 1)

The keyboard used for this operator console integrates the following components:

This is an amplifier board for the OC speaker. See the following block diagram. Illustration 41 NAA1 Block Diagram Power Amplifier Preamplifier

+ + CN2 From REAR CN1 OUT OUT CN1 To OC Speaker

Muting

Voltage Regulator

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4-4

PCI EXPANSION UNIT

The host processor only provides one PCI slot. This unit expands this one slot to seven slots available. This unit consists of the following three boards (designed by Bit3): PCI Host Card PCI Backplane Controller Card PCI Backplane Card The main devices on these boards are PCIPCI Bridge chips, which expand the number of slots in stages. Illustration 42 shows a block diagram of the PCI Expansion Unit. Table 41 describes installed circuit boards at those slots which are made available by the PCI Expansion Unit.

Table 41 Slot Slot 1 Slot 2 Slot 3 Slot 4 Slot 5 Slot 6 Slot 7

PCI Slot Board Board NPRIF DBPCI DBPCI (for Twin only) AHA2940UW (space) (space) (space)

AHA2940UW Card This is a SCSI card of Adaptec. To this card, up to two hard disk drives can be connected for onthefly (high speed) raw data storage.

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4-4

PCI EXPANSION UNIT (continued) Illustration 42 PCI Expansion Unit

PCI Host Card PCI PCI Bridge Chip Cable

PCI Backplane Controller Card PCI PCI Bridge Chip

PCI Bus

PCI Backplane Card PCI Slot 1 PCI Slot 2 PCI Slot 3 PCI Bus

PCI Bus (Host) PCI PCI Bridge Chip

PCI Slot 4 PCI Slot 5 PCI Slot 6 PCI Slot 7

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4-5

ST1800 (SERIAL PORT EXTENSION BOX)

The host processor only provides two serial ports. To increase the number of available serial ports, the ST1800 unit is used. See Illustration 11 for the connection of the ST1800 unit within the operator console. The unit is connected to the ultra/wide SCSI port of the host processor, and provides four serial ports available. The serial ports may be used for connection with an InSite modem, a trackball, etc.

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TABLE/GANTRY

TABLE OF CONTENTS
SECTION SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1 1-2 1-3 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMPONENTS INTERCONNECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PAGE 11
11 12 13

SECTION 2 SUBASSEMBLY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


2-1 2-2 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . STATIONARY GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-1 TGP board Service Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-2 TGP Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ROTATING GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SLIP RING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-1 MECHANISM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

21
21 22 29 210 212 214 214 215

2-3 2-4 2-5

TABLE/GANTRY

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SECTION 1 GENERAL DESCRIPTION

1-1

INTRODUCTION

The TGP (Table Gantry Processor) board is the main controller of the Table/Gantry subsystem. The TGP board receives command from the Operator Console and sends control commands to Table, Stationary Gantry and Rotational Gantry including OGP (On Gantry Processor), DAS and Xray Generator. Although the DAS/Detector and Xray Generator are in the Gantry, they are not explained in this subsystem. The Table/Gantry consists of the following components:

D TGP board D OGP board D SUB board D Table board D Servo Amp/Servo Motor D Gantry Display D Gantry Switch D Collimator D Positioning Light D Hydraulic System (Gantry Tilt and Table elevation) D Touch Sensors D Cradle drive system D IMS (Intermediate Support)

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1-2

COMPONENTS INTERCONNECTION

The illustration 11 shows the components of the Table/Gantry. Illustration 11 Table/Gantry

GANTRY SWITCH PANEL

GANTRY DISPLAY

TILT POTENTIOMETER TABLE HEIGHT POTENTIOMETER IMS POTENTIOMETER CRADLE POSITION POTENTIOMETER CRADLE ENCODER AZIMUTH ENCODER FOOT SWITCHES GANTRY PULSE TABLE TOUCH SENSORS GANTRY TOUCH SENSORS LATCH SWITCHES TGP BOARD OGP BOARD SUB BOARD SERVO AMP/MOTOR STEPPING MOTOR DRIVER TABLE BOARD SERVO AMP FOR IMS CRADLE DRIVER

AXIAL MOTOR TILT HYDRAULIC SYSTEM APERTURE MOTOR CRADLE MOTOR TABLE VALVE SOLENOID TABLE HYDRAULIC SYSTEM LOOK GUIDE IMS MOTOR APERTURE SENSORS EMERGENCY SWITCHES

FOR TWIN ONLY

ZAXIS LIMIT SENSORS DAS ZAXIS MOTOR

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1-3

SPECIFICATIONS

The specifications of the Table/Gantry is as follows:

Gantry Rotation Speed 0.7 (NP++, NP++ Twin), 0.8, 1, 1.5, 2, 3 sec/rot.

Tilt Angle 30_ 0.5_

Tilt Speed BWD 30_ ~ FWD 30_ : 60 6 sec

Table Height 400 ~ 950 mm

UP/Down Speed From 400 mm to 950 mm height: 30 sec 5 sec +10 sec.

Cradle Speed Slow Fast Scout Home 20 mm/sec 100 mm/sec 75 mm/sec 100 mm/sec

IMS Speed 50 mm/sec

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SECTION 2 SUBASSEMBLY DESCRIPTION

2-1

OVERVIEW

The Table/Gantry consists of table and Gantry. The Gantry is divided into Stationary Gantry and Rotating Gantry. The communication between stationary and rotating Gantry is made by slipring, a rotation mechanism that permits electrical power and signals exchange. The illustration 21 shows the Table/Gantry block diagram. Illustration 21 Table/Gantry Block Diagram GANTRY
PDU

STATIONARY GANTRY

ROTATING GANTRY

POWER OC TGP BOARD GANTRY SWITCH OGP BOARD GANTRY TILT HYDRAULIC SYSTEM POSITIONING LIGHT COLLIMATOR GANTRY DISPLAY

SUB BOARD

SERVO AMP

SERVO MOTOR

SLIP RIN G

DAS

XG

TABLE
CRADLE IN/OUT TABLE BOAR D IMS (*) TOUCH SENSORS

Collimator DAS line to control Zaxis is for the Twin ONLY.

TABLE ELEVATION HYDRAULIC SYSTEM

(*) Standard or Option, depending on a system.

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2-2

STATIONARY GANTRY

The stationary Gantry is mainly controlled by the TGP (Table Gantry Processor) board. The Illustration 22 shows the main components of the stationary Gantry. The TGP board communicates with Operator Console and Table via cables and with the OGP board located in rotating Gantry via cable and slip ring. Illustration 22 Stationary Gantry main components
OGP (SLIP RING) 115VAC MICROPHONE GANTRY SWITCH PS1 PS2 FCV BOAR D PS 3 DISPLAY BOARD TOUCH SENSOR BREATH NAVI EMERGENCY SWITCH

OC TGP BOARD TABLE MICROPHONE GANTRY SWITCH XDISP BOARD TOUCH SENSOR RCV BOAR D BREATH NAVI EMERGENCY SWITCH

GANTRY TILT PUMP & VALVE TABLE ELEVATION PUMP & VALVE SUB BOARD AXIAL MOTOR

SIDE COVER SWITCHES

M
FRONT AND REAR COVER SWITCHES

The functions of the parts of the stationary Gantry are as follows:

PS1 and PS2 Supply power to TGP board and SUB board. PS1 supplies +5V, +12V and 12V. PS2 supplies +24V.

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2-2

STATIONARY GANTRY (continued)

FCV (Front Cover) Board RCV (Rear Cover) Board Contains connection circuitry to display board, touch sensors, breath navis and emergency switches. See Illustration 23 and 24. Illustration 23 FCV Block Diagram
FCV BD ASSY CN1 TGP TGP BD ASSY (CN8) +24V,+5V,GND,SHIELD,XLED,PLLED, A0,A1,B0,B1,B2,B3,SL0,SL1,SL2 CN2 DISP GNTDISP BD ASSY CN5 LG LG1 BD ASSY FLED LG2 BD ASSY CN3 LSW LSW BD ASSY CN4 RSW

+24V,+5V,SHIELD,FLED,SLED CUNTL0,CUNTL1, CUNTL2,CUNTL3, CUNTH0,CUNTH1, CUNTH2,CUNTH3 7seg DECODE & DRIVE CIRCUIT

La,Lb,Lc,Ld,Le,Lf,Lg, Ha,Hb,Hc,Hd,He,Hf,Hg

SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED +5V SWENBL* K1 +5VSW

EMERGENCY SW RSW BD ASSY

INR,OUTR,FAST,IMSR,INLMR,EXLMR,RANGE, UPR,DNR,FWDR,BWDR,POSL,PRACTICE EMERGENCY

EMERGENCY SW

TCH*

TOUCH SW DETECT CIRCUIT

CN6 TSW TSNS,CONNECTOR

TOUCH SW ASSY

NAA2 ASSY (CN2)

CN8 MICOUT MIC+,MIC,MICGND

CN7 MIC MIC ASSY

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2-2

STATIONARY GANTRY (continued) Illustration 24 RCV Block Diagram


R CV BD ASSY CN1 TGP +24V,+5V,GND,SHIELD,XLED,PLLED, A0,A1,B0,B1,B2,B3,SL0,SL1,SL2 CN2 DISP

TGP BD ASSY (CN9)

CN8 XDISP +24V,XLED,PLLED CN5 LG LG1 BD ASSY FLED LG2 BD ASSY SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED +5VSW TEMP+5V K2 K1 RENBL CN4 LSW RSW BD ASSY CN3 RSW LSW BD ASSY XDISP BD ASSY

+24V,+5V,SHIELD,FLED,SLED CUNTL0,CUNTL1, CUNTL2,CUNTL3, CUNTH0,CUNTH1, CUNTH2,CUNTH3 7seg DECODE & DRIVE CIRCUIT

La,Lb,Lc,Ld,Le,Lf,Lg, Ha,Hb,Hc,Hd,He,Hf,Hg

+5V SWENBL*

POSL,INLMR,RANGE,PRACTICE (+5VSW) INR,OUTR,FAST,EXLMR,UPR,DNR,FWDR,BWDR (TEMP+5V) CN10 EOFF SW EMERGENCY

EMERGENCY SW CN6 TSW TSNS,CONNECTOR

TCH*

TOUCH SW DETECT CIRCUIT

TOUCH SW ASSY

NAA2 ASSY (CN3)

CN9 MICOUT MIC+,MIC,MICGND

CN7 MIC MIC ASSY

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2-2

STATIONARY GANTRY (continued)

Display Board and XDISP board Display board is the display located at middle upper side of the Gantry front cover. XDISP board is the smaller display located at middle upper side of the Gantry rear cover.

Gantry Switches Located at left and right of both front and at rear Gantry cover. These switches are used to tilt manage Gantry tilt, table and cradle movement and positioning light.

Gantry Microphone Located at upper portion of the entrance of the Gantry opening, at the front and the rear side.

Touch Sensor Located at front and at rear upper side of the Gantry cover to protect patient during tilt. When touch sensor at the front cover hit something during forward tilt, the tilt stops. When touch sensor at the rear cover hit something during backward tilt, the tilt stops.

Breath Navi Located at upper portion of the entrance of the Gantry opening, at the front and the rear side to notify patient to breath, hold breath and show remaining scan time.

Emergency Switch Located at left and right of both front and at rear Gantry cover.

SUB Board The SUB board contains control circuitry for Gantry tilt, table elevation and servo amp for axial motor. Control these functions according to the command received from TGP board. Contains also connection to Gantry cover switches. See Illustration 25.

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2-2

STATIONARY GANTRY (continued) Illustration 25 SUB Board Block Diagram

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2-2

STATIONARY GANTRY (continued)

TGP BOARD There are three micro processors on the TGP Board. One controls the GANTRY Rotation, one controls the Table and the other controls the arbitration of commands from the gantry processor, table processor, scan processor (located on the OGP board) and the OC. See Illustration 26. D Processor A for GANTRY CONTROL (GP) D Processor B for TABLE CONTROL (TP) D Processor C for MANAGEMENT (MP) The Management processor communicates with the OC through serial links. The other processors (Gantry Processor and Table Processor) communicate with the Management Processor, and can receive commands from the OC via the Management Processor. The Gantry Processor and Table Processor also contain a serial communication port which is not used for communication between OC or other Processors, but rather is used for Data correction from the sensor switches. The TGP Board issues commands to and receives status from the components it controls. The TGP oversees the following functions: D AXIAL Drive control D TILT Drive control D CRADLE IN/OUT Drive control D IMS IN/OUT Drive control D TABLE Elevation Drive control D GANTRY Display control D Breath Navi Display control D GANTRY panel switch/Foot switch control D Error Detection

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GE MEDICAL SYSTEMS REV 13 2-2 STATIONARY GANTRY (continued) Illustration 26 TGP Block Diagram

CT HISPEED SERIES THEORY OF OPERATION 2202124

TGP Bd PDU PDU Safety Loop Gantry Processor (uPD78310) SRAM Flash Memory G Test SW Status LED Management Processor (uPD78310) SRAM OC OC OC Direct Line Flash Memory Flash Memory Dual Port RAM Service SW M Test SW Status LED Table Processor (uPD78310) DAS Trig 9600bps SIO CT Lock &Alarm Control Breath Navi Control IMS Control Flash Add Cont

Emergency Rot Safe GPulse Rot Count 12bit DAC Rotate Control Azimuth Servo AMP C M Enc

Test 0,1 Reset SW Reset Patarn

Dual Port RAM

Slice Count

C Slip Ring Slip Ring Relay

OC

OC Comm unication

Breath Navi IMS Servo AMP IMS Pot HIT Pot TILT Pot M Enc

SRAM Flash Memory T Test SW Status LED

12bit ADC Cradle Control Table Control Tilt Control Display Control T/G SW Port Flash Add Cont

Cradle Pot Cradle Motor Driver Up/Dwn Relay Tilt Relay M Enc P,V P,V Gantry Display Gantry SW Table SW Fluoro SW Audio Amp Mic Spk

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There are five service switches at right upper side of the TGP board which are used to control the Gantry Rotation manually. Illustration 27 TGP Board Service Switches

SPD1

MNL

FIX

SVE

SPD0

SLOW

90DEG

TGP BOARD

GANTRY LEFT SIDE

SYS :
SYS OFF

System Position. When the switch is in this position, the Gantry is controlled by the Operator Console. Disable the Gantry rotation. Servo Amplifier is disabled and Static brake activated.

OFF

MNL

MNL Manual Position. When the switch is in this position, the Gantry rotation is controlled manually, by the other switches described below. ABT : Arbitrary Mode. This switch is a spring loaded switch that enables Gantry rotation toward the direction selected by the rotation Direction switch (CNT/HOME/90DEG), by the fixed speed of XXX seconds per revolution. Servo Enable. Servo Amplifier is enabled and voltage command is 0 volts, that means there is no rotation at this position.

ABT SVE

SVE : FIX :

FIX

Rotates Gantry according to the selection of the Speed Selection switches (SPD2/SPD1/SPD0 and FAST/MID/SLOW) and Direction switch (CNT/ HOME/90DEG).

29

HOME

SYS OFF

ABT

SPD2

FAST MID

CNT

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2-2-1
SPD2

TGP board Service Switches (continued)


FAST SPD1 MID

and

These two switches sets the rotation speed See table below

SPD0

SLOW

SPD2/SPD1/SPD0 FAST/MID/SLOW SPEED (sec/rot)


HOME CNT

SPD2 FAST 0.7

SPD2 MID 0.8

SPD2 SLOW 1.0

SPD1 FAST 1.5

SPD1 MID 2

SPD1 SLOW 3

SPD0 FAST 5

SPD0 MID 10

SPD0 SLOW 15

CNT

: Clockwise rotation

HOME : Home position (Xray tube at zero degree position) 90DEG : 90 degree position (Xray tube at 90 degree position)

90DEG

2-2-2

TGP Processors

The TGP board contains three processors:

Management Processor (MP) The Management Processor oversees the functions of the Table/Gantry. It communicates with OC and according to the message received from OC, sends corresponding commands to Gantry processor, Table processor and OGP board. The main functions of the Management processor are: D Communication with OC serial link D Communication with OGP serial link through slip ring D IMS movement control D Xray ON LED (on Gantry panel) control D Positioning Light ON LED (on Gantry panel) control D Look guide control D Practice Switch (for look guide) control D Tilt position, table height and cradle position adjustment. There is a ROM connected to management processor that contains adjustment data. The management processor reads this data, compares with the current positions and make adjustment as needed.

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2-2-2

TGP Processors (continued)

Gantry Processor (GP) The Gantry processor control the following functions: D Positioning light switch D Gantry rotation

Table Processor (TP) The table processor control the following functions: D Cradle In/Out D Gantry Tilt D Table Up/Down D Gantry Display D Gantry Switch D Interlock

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The Illustration 28 shows the main components of the rotating Gantry. The functions of the parts of the stationary Gantry are as follows: OGP Board The OGP (On Gantry Processor) performs the following functions: D Xray exposure on/off control D DAS data transfer timing D Collimator control D Beam Tracking Control (For Twin System ONLY) D Positioning light control D Scan control D The automatic shutoff of the Tube Fan/Pump Power Supply after 30 minutes when the OC has been powered down. Illustration 28 Rotating Gantry main components
PHOTO SENSOR MOTOR DRIVER MOTOR DRIVER TO TGP (SLIP RING) POSITIONING LIGHT (FOR LASER) POSITIONING LIGHT (FOR HALOGEN) TRANS- RELAY FORMER SWITCHING POWER SUPPLY 1 115VAC SWITCHING POWER SUPPLY 2 TEMP CONT ASSY 115V OGP BOARD MOTOR COLLIMATOR

SHADED PARTS IS FOR TWIN SYSTEM ONLY. GPLS

DAS

MOTOR

ENOCODER

PHOTOSENSOR

TO DAS BUFFER

RF XMT

DTRF

DAS/DETECTOR

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Switching Power Supply 1 Supply power to the OGP board, DTRF board, RF transmitter and positioning light. Switching Power Supply 2 Supply power to the DAS and Temperature Control Box. Collimator Located at the exposure window of the Xray tube, controls the aperture of the Xray beam by moving the blades. Single Detector: The aperture can be 1,2,3,5,7 or10 mm. Twin Detector: The aperture can be (0.5x2,) 1x2, 2x2, 3x2, 5x2, 7x2 or10x2 mm. The Twin System contains the collimator with Zaxis beam control mechanism. Motor Driver Generates five phase pulses to control the stepping motor of the collimator. Receives pulse command from OGP board and convert it to other type of pulses. Encoder Sends the feedback pulse to the OGP to show the moved amount of the blades. Photo Sensor Detects when the collimator blades are in 1mm aperture DAS Data Acquisition System. Processes the data received from detector and send it to operator console. The detailed explanations are in the DAS/Detector sections. Temp Cont Assy Device that controls the Detector temperature DTRF (or DTRF2 for Twin) Receives parallel data from DAS and convert them to serial data. The detailed explanations are in the DAS/Detector sections. RF XMT Converts Serial signal from DTRF to RF signal. GPLS Notify TGP and OGP board when the Gantry is at zero degree tube position.

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2-4

SLIP RING

The SLIP RING transfers the following signals; D DAS Data D DAS Trigger D TGP and OGP Communication message 2-4-1 MECHANISM

This Gantry slip ring system utilizes: D ETC Slip Ring: Nine 480VAC power brushes (3 power lines x3 brushes) HSDCD Slip Ring: Twentyseven 480VAC power brushes (3 power lines x9 brushes) D ETC Slip Ring: Four 115VAC power brushed (2 power lines x2 brushes) HSDCD Slip Ring: Ten 115VAC power brushed (2 power lines x5 brushes) D ETC Slip Ring: Three ground brushes (1 ground line x3 brushes) HSDCD Slip Ring: Six ground brushes (1 ground line x6 brushes) D ETC Slip Ring: Twentyfour signal brushes (6 signal lines x 4 brushes) HSDCD Slip Ring: Thirtysix signal brushes (6 signal lines x 6 brushes) D RF transmitter / receiver modules Every slip ring has a corresponding terminator located on the opposite side of the transmitter terminal. See illustration 29. Illustration 29 Slip Ring Terminator

TERMINATE RESISTOR

SIGNAL

SLIP RING

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2-5

TABLE

The Illustration 210 shows the main components of the table. The description of the parts of the Table follows:

Table board This is an interface board between TGP board and servo amp, stepping motor driver, and table CONN board.

TBL CONN board This is an interface between Table board and potentiometers, touch sensors and latch switches. This board has only connectors. For detail information, see schematic diagrams. Illustration 210 Table
HEIGHT POTENTIOMETER PUMP FROM SUB BOARD VALVE TABLE UP/DOWN HYDRAULIC SYSTEM (*) SERVO AMP (*) Standard or Option, depending on a system.

(*) IMS POTENTIOMETER M (*)SERVO MOTOR (IMS)

(*) ENCODER FROM TGP BOARD

TABLE BOARD

TABLE CONN BOARD LATCH SWITCHES

TOUCH SENSORS FOOT SWITCHES SPEAKER E STEP MOTOR (CRADLE) SW P.S. STEP MOTOR DRIVER ENCODER M ENCODER POTENTIOMETER

FROM GANTRY NF2

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2-5

TABLE (continued)

Foot Switches Pedals that controls Table Up/Down. When the Table is raised or lowered using foot switches, there is no cradle compensation.

Hydraulic System Consists of pump, hose and cylinder. it is used for Table Up/Down.

Cradle Portion of the Table that executes longitudinal movement. It is controlled by step motor and motor driver.

IMS (Intermediate Support) Mechanism that aids the longitudinal movement in order to improve scannable range. It is controlled by Servo Amp and Motor. Some systems equips this function as a standard.

Latch Switches Positioned at both right and left sides of the Table, these switches release or latch the cradle. When both switches are pressed, the cradle is latched. When one of the switches is depressed, the cradle is released. They are for safety purpose.

Potentiometers There are three potentiometers: IMS position potentiometer, height potentiometer and Encoder (tilt) potentiometer. They are used for feedback purpose.

Touch Sensors Located at under surface of the Table. They are for safety purpose.

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DAS/DETECTOR

TABLE OF CONTENTS
SECTION SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PAGE 11
11

SECTION 2 DETECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HILIGHT DETECTOR MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CHANNEL DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DAS/DETECTOR CONNECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . QCAL CHANNELS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AFTER GROW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HEATER AND TEMPERATURE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

21
21 21 22 24 26 28 29 210

SECTION 3 DATA ACQUISITION SYSTEM (DAS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


3-1 3-2 3-3 3-4 3-5 3-6 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CIF BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAM BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DDP BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DTRF BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31
31 39 310 311 315 316

DAS/DETECTOR

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SECTION 1 GENERAL DESCRIPTION

1-1

OVERVIEW

DAS/Detector subsystem consists of Solid State Detector and Data Acquisition System (DAS) that are located on the rotationary Gantry. Xray data acquired by the detector is converted to light, then to electrical signal in the detector and then sent to DAS. The DAS digitizes, serializes and performs offset corrections on the signal and sends to the Operator Console for image reconstruction. The Xray exposure through the scanning object is detected by these modules, converted to light, then converted to electrical signal and sent to to the DAS. The DAS digitizes and sends this data by RF slipring and fiber optics to the Operator Console, where it is processed for image reconstruction. Illustration 11 Xray Exposure and Data Flow Block Diagram

OBJECT XRAY

XRAY TUBE

DETECTOR

DATA ACQUISITION SYSTEM

DAS Data

DATA PROCESSING UNIT

Illustration 12

Xray Exposure and DAS/Detector

XRAY TUBE

XRAY BEAM DETECTOR DAS


11 DAS/DETECTOR

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SECTION 2 DETECTOR

2-1

OVERVIEW

The detector consists of housing, collimator and detector modules. The detector module is made of scintillator (Lumex crystal), photodiode and connector. When the Xray exposure is performed, the Xray enters through the collimator and hits the scintillator. The scintillator is made of a material that emits light when hit by Xray. The scintillator is in contact with photodiode so that the light generated by Xray is converted into electrical current. The generated current is sent to the DAS (Data Acquisition System) to be processed.

2-2

SPECIFICATIONS

Distance from Focus to ISO: 541 mm. Distance from Focus to Detector surface: 949.075 mm. Detector Channel Pitch: 1.15 mm. Detector Channel angle: 0.06946 degree. View Number: S S Offset: 256 views (for Twin and systems with V/R 4.0 or later), 64 views (other) Active: 972 views

Channel Distribution: TWIN A Slice 793 20 3 0 B Slice 793 20 3 0

NP Active Channel Reference Channel QCAL Channel GND Channel 717 20 3 12

NP+/NP++ 793 20 3 0

21

DAS/DETECTOR

GE MEDICAL SYSTEMS REV 13 2-3 HILIGHT DETECTOR MODULE

CT HISPEED SERIES THEORY OF OPERATION 2202124

The module consists of Scintillator cells, Collimator, Photo Diode, Reflex Films and Connector (illustration 21. The Xray enters through the collimator (tungsten plates) and is absorbed by the Scintillator. The Scintillator is made of Lumex Crystal, the material that emits light when absorbs Xray radiation. The Scintillator is optically coupled with Photo Diode which converts light to electrical current. The Photo Diode is electrically connected to DAS through the connector. Illustration 21 DETECTOR MODULE FOR TWIN

COLLIMATOR (IN THE DETECTOR HOUSING) XRAY

HILIGHT MODULE

LUMEX CRYSTAL

LIGHT PHOTO DIODE

CHANNEL B CHANNEL A

CONNECTOR (TO DAS)

22

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2-3

HILIGHT DETECTOR MODULE (continued) Illustration 22 DETECTOR MODULE FOR SYSTEMS OTHER THAN TWIN

COLLIMATOR (IN THE DETECTOR HOUSING) XRAY

HILIGHT MODULE

LUMEX CRYSTAL

LIGHT

PHOTO DIODE

CONNECTOR (TO DAS)

23

DAS/DETECTOR

GE MEDICAL SYSTEMS REV 13 2-4 CHANNEL DISTRIBUTION

CT HISPEED SERIES THEORY OF OPERATION 2202124

The illustrations 23, 24 and 25 show the channel distribution of each system model. Illustration 23 TWIN DETECTOR CHANNEL DISTRIBUTION

1 MODULE (16 Channels)

49 MODULES

1 MODULE (16 Channels)

A SLICE
1~3 (3 CH) QCAL 4 ~ 13 (10 CH) REF. 3 CHANNELS

14 ~ 806 (793 CH) ACTIVE 14 ~ 806 (793 CH) ACTIVE

6 CHANNELS

807 ~ 816 (10 CH) REF. 807 ~ 816 (10 CH) REF.

1~3 (3 CH) QCAL

4 ~ 13 (10 CH) REF.

3 CHANNELS

6 CHANNELS

B SLICE Illustration 24 NP+/NP++ DETECTOR CHANNEL DISTRIBUTION

1 MODULE (16 Channels)

49 MODULES

1 MODULE (16 Channels)

1~3 (3 CH) QCAL

4 ~ 13 (10 CH) REF.

3 CHANNELS

14 ~ 806 (793 CH) ACTIVE

6 CHANNELS

807 ~ 816 (10 CH) REF.

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2-4

CHANNEL DISTRIBUTION (continued) Illustration 25 DUMMY NP DETECTOR CHANNEL DISTRIBUTION DUMMY

1 MOD 1 MOD 1 MOD 1 MOD

44 MODULES

1~3 (3 CH) QCAL

4 ~ 13 14 ~ 16 (10 CH) (3 CH) REF. GND

17 ~ 19 (3 CH) GND

13 CH

20 ~ 736 (717 CH) ACTIVE

25


(6 CH) GND

1 MOD 1 MOD 1 MOD

737~ 742 743~752 (10 CH) REF.

DAS/DETECTOR

GE MEDICAL SYSTEMS REV 13 2-5 DAS/DETECTOR CONNECTOR

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The detector module consists of 32 channels (A Slice and B Slice) for Twin and 16 channels for others. The illustrations 26 and 27 show the flexible PWB that connects detector modules to the DAS (CAM boards) and its pin configuration. Illustration 26 DAS/DETECTOR CONNECTOR FOR TWIN

48 PIN CONNECTOR D C B A 1 2 3 4 5 6 7 8 9 10 11 12

A 1 2 3 4 5 6 7 8 9 10 11 12 2SG 2SG

B 2SG 2SG

C 2SG 2SG

D 2SG 2SG

A1ch B1ch A16ch B16ch A2ch B2ch A15ch B15ch A3ch B3ch A14ch B14ch A4ch B4ch A13ch B13ch A5ch B5ch A12ch B12ch A6ch B6ch A11ch B11ch A7ch B7ch A10ch B10ch A8ch B8ch A9ch B9ch FG FG FG FG FG FG FG FG

FLEXIBLE PWB

Note SG: Signal Ground FG: Frame Ground

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2-5

DAS/DETECTOR CONNECTOR (continued) Illustration 27 DAS/DETECTOR CONNECTOR FOR SYSTEMS OTHER THAN TWIN A 1 D C B A 1 2 3 4 5 6 7 8 9 10 11 12 2 3 4 5 6 7 8 9 FLEXIBLE PWB 10 11 12 SG SG A8ch A7ch A6ch A5ch A4ch A3ch A2ch A1ch FG FG B SG SG FG FG FG FG FG FG FG FG FG FG C SG SG A9ch A10ch A11ch A12ch A13ch A14ch A15ch A16ch FG FG D SG SG FG FG FG FG FG FG FG FG FG FG

48 PIN CONNECTOR

24 PIN CONNECTOR d c b a 1 2 3 4 5 6 1 2 3 4 5 6

a CH 7 CH 5 CH 3 CH 1 FG FG

b CH 8 CH 6 CH 4 CH 2 FG FG

c CH 9 CH11 CH13 CH15 SG SG

d CH10 CH12 CH14 CH16 SG SG

Note SG: Signal Ground FG: Frame Ground

27

DAS/DETECTOR

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The Xray exposure can move along the Zaxis. It can be due to mechanical adjustment or to tube temperature (the angle of the Xray output can vary according to the temperature). There is three channels in the left most positioned detector module that is used for Zaxis data correction. In this module there is a wedge shaped lead block, called ZWEDGE (illustration 28). The outputs of the three channels are tied together so that only one data is taken for three channels. The corresponding intensity according to the position of the Xray exposure along the Zaxis is detected (as can be seen at right side of the illustration 28), so that the system recognizes the current Xray position (along the Zaxis). There is a remaining data for Zaxis data correction in the system. Therefore, the correction is made according to the data acquired by the QCAL channels. Illustration 28
ZWEDGE

QCAL CHANNELS FOR SYSTEMS OTHER THAN TWIN

QCAL CHANNELS

X Illustration 29

GROUND CHANNEL

QCAL CHANNELS FOR TWIN


QCAL CHANNELS

A Slice

B Slice

Z
QCAL CHANNELS

XRAY INTENSITY DETECTED ACCORDING TO THE BEAM POSITION ALONG THE ZAXIS

28


A Slice XRAY EXPOSURE B Slice

XRAY INTENSITY DETECTED ACCORDING TO THE BEAM POSITION ALONG THE ZAXIS

XRAY EXPOSURE

DAS/DETECTOR

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The Lumex crystal scintillator has a property represented in the illustration 210. The scintillator continues emitting light even after the Xray radiation is stopped. This phenomenon is called AFTER GROW. This remaining scintillation provides incorrect data, but the system performs the error correction to eliminate this portion. Illustration 210 AFTER GROW

XRAY ON

scintillation

XRAY OFF

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2-8

HEATER AND TEMPERATURE CONTROL

The detector comprises a heater unit. The heater keeps the detector temperature constant, what is needed for detector accuracy. The heater is controlled by the Temperature Control Box which supplies power to the heater. The detector also comprises a thermistor that feeds back the temperature information to the Temperature Control box. Approximately three hours is needed after turning ON the power to the Temperature Control box to stabilize the detector temperature. The temperature is controlled to 35 0.5 C. The illustration 211 shows its block diagram. Illustration 211 TEMPERATURE CONTROL BLOCK DIAGRAM

Thermistor Heater

DETECTOR DC24V 60W

INPUT POWER 24V DC

Driver for Heater

PS (+24V > +12V)

PS (+12V > +5V)

(OP Amp Comparator)

CPU

ROM

Switch TEMPERATURE CONT BOX

LED indication

210

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SECTION 3 DATA ACQUISITION SYSTEM (DAS)

3-1

OVERVIEW

The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back Board). Each box contains the set of boards as follows:

For TWIN S S S RBB CBB LBB 18 CAM boards 18 CAM boards 18 CAM boards, 2 DDP boards, 1 CIF board

The Illustration 31 shows the DAS boxes. Illustration 31 DAS (RBB, CBB, LBB) LBB ASSY CONTROL BOARDS CBB ASSY CONNECTOR (TO DETECTOR) RBB ASSY

B Slice DDP

A Slice DDP

CAM ASSY

#36

#19 FLEXIBLE CABLE

CAM Assy nomenclature: Odd Number CAM ASSYs represent A Slice Even Number CAM ASSYs represent B Slice

31

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3-1

OVERVIEW (continued)

For systems other than Twin S S S RBB CBB LBB 9 CAM boards 9 CAM boards 9 CAM boards, 1 DDP board, 1 CIF board

The Illustration 32 shows the DAS boxes. Illustration 32 DAS (RBB, CBB, LBB) LBB ASSY CBB ASSY CONNECTOR (TO DETECTOR) RBB ASSY

CONTROL BOARDS CAM ASSY

FLEXIBLE CABLE

The DAS channels number is as follows: TWIN NP Active Channel Reference Channel QCAL Channel Ground Channel 717 10 + 10 3 3+3+6 NP+/NP++ 793 10 + 10 3 0 A Slice 793 10 + 10 3 0 B Slice 793 10 + 10 3 0

32

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3-1

OVERVIEW (continued)

The illustrations 34 and 33 show DAS block diagram for Twin and systems other than Twin, respectively. The data coming from the detector is taken by the CAM boards, sequentially channel by channel, digitized, converted to parallel, go through offset correction, then sent to the Operator Console. The CIF board is an interface with OGP (On Gantry Processor) receiving control and timing signals, and generates the timing signals for data gathering. The DDP board performs offset correction and generates the test pattern. Illustration 33 DAS/Detector Structure for TWIN DETECTOR

A Slice B Slice CAM BOARDS

DC+12V Analog #53 #52 #51 DC12VAnalog #54 POWER DC+5V CAM SUPPLY (B Slice) (A Slice) (B Slice) (A Slice)

#6

#5

#4

#3

#2

#1

(B Slice) (A Slice) (B Slice) (A Slice) (B Slice) (A Slice)

DC +5V Digital

CIF Board Control from OGP

Control

Control

DDP Board (B Slice) 16 Bit Data to DTRF2 DDP Board (A Slice) 16 Bit ata to DTRF2 LBB ASSY

33

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3-1

OVERVIEW (continued) Illustration 34 DAS/Detector Structure for systems other than Twin
DETECTOR

DETECTOR MODULES

Front End Circuit for 16 channels DC +12V Analog DC 12V Analog DC +5V CAM POWER SUPPLY Gate Array Control circuit for 2 Front End

CAM BOARDS

Control Signal from OGP

DC +5V Digital
CIF BOARD

Control Signal

Control Signal

16 Bit Data to DTR

DDP BOARD

LBB ASSY

34

DAS/DETECTOR

GE MEDICAL SYSTEMS REV 13 3-1 OVERVIEW (continued) Illustration 35 DAS Power Connection for Twin

CT HISPEED SERIES THEORY OF OPERATION 2202124

CIF ASSY B SLICE DDP ASSY A SLICE DDP ASSY CAM ASSY #54 CAM ASSY #53 CAM ASSY #52 CAM ASSY #51 CAM ASSY #50 CAM ASSY #49 CAM ASSY #48 CAM ASSY #47 CAM ASSY #46 CAM ASSY #45 CAM ASSY #44 CAM ASSY #43 CAM ASSY #42 CAM ASSY #41 CAM ASSY #40 CAM ASSY #39 CAM ASSY #38 CAM ASSY #37

CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM

ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY

#36 #35 #34 #33 #32 #31 #30 #29 #28 #27 #26 #25 #24 #23 #22 #21 #20 #19

CASE
CAM ASSY #18 CAM ASSY #17 CAM ASSY #16 CAM ASSY #15 CAM ASSY #14 CAM ASSY #13 CAM ASSY #12 CAM ASSY #11 CAM ASSY #10 CAM ASSY #9 CAM ASSY #8 CAM ASSY #7 CAM ASSY #6 CAM ASSY #5 CAM ASSY #4 CAM ASSY #3 CAM ASSY #2 CAM ASSY #1

CAM Assy nomenclature: Odd Number CAM ASSYs represent A Slice Even Number CAM ASSYs represent B Slice

35

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3-1

OVERVIEW (continued) Illustration 36 DAS Power Connection for systems other than Twin

36

DAS/DETECTOR

GE MEDICAL SYSTEMS REV 13 3-1 OVERVIEW (continued) Illustration 37 DAS Signal Connection for Twin

CT HISPEED SERIES THEORY OF OPERATION 2202124

CIF ASSY B SLICE DDP ASSY A SLICE DDP ASSY CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY #54 #53 #52 #51 #50 #49 #48 #47 #46 #45 #44 #43 #42 #41 #40 #39 #38 #37 CN51 CN50 CN49 CN48 CN47

CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM

ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY

#36 #35 #34 #33 #32 #31 #30 #29 #28 #27 #26 #25 #24 #23 #22 #21 #20 #19

CAM ASSY #18 CAM ASSY #17 CAM ASSY #16 CAM ASSY #15 CAM ASSY #14 CAM ASSY #13 CAM ASSY #12 CAM ASSY #11 CAM ASSY #10 CAM ASSY #9 CAM ASSY #8 CAM ASSY #7 CAM ASSY #6 CAM ASSY #5 CAM ASSY #4 CAM ASSY #3 CAM ASSY #2 CAM ASSY #1

CAM Assy nomenclature: CN4 CN3 CN2 CN1 Even Number CAM ASSYs represent B Slice

Odd Number CAM ASSYs represent A Slice

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3-1

OVERVIEW (continued) Illustration 38 DAS Signal Connection for systems other than Twin

38

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3-2

DATA FLOW

The illustration 39 shows the data flow. The Detector generates an electrical current proportional to Xray intensity. The electrical current is converted to voltage signal in the CAM board. The voltage signal is amplified to an appropriate level, converted to digital data (serial), then converted to parallel data, also in the CAM board. The offset correction of the data is performed in the DDP board. The data is then sent to to DTRE board where it is converted back to serial, conditioned and then sent to Operator Console through the RF Slip ring. Illustration 39
DAS

DAS block diagram

CAM board
Signal Conditioner Analog DATA A/D Converter

FPGA
Digital Serial data Serial/Parallel Conversion Digital Parallel data

Electrical

DETECTOR

Current

CAM control signal generator

Timing Control

Digital Parallel data

Timing Control DDP board Offset Correction

CIF board

SLIP RING
DTRF2 Board (for Twin) or DTRF Board (other than Twin)

FEC Encoder

Parallel/Serial Conversion

39

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3-3

CIF BOARD

The CIF board performs the following functions: D OGP Interface: exchange signals with OGP to control and synchronize the data acquisition. D Control signals: generates control and timing signals to the other boards in the DAS for data acquisition. D Zaxis beam tracking (only for Twin): controls the Xray intensity between the CAMs A and B Slices.

OGP Interface The DAS subsystem receives scan control signals from OGP board, by which the CIF board generates control signals for data acquisition. The exchanged signals with OGP are shown in illustration 310 and the functions of the signals is as follows: DTRIG : DAS trigger This is the timing signal initiates for data acquisition. AXIAL 16pulses/view SCOUT 1pulse/view DENBL : DAS enable indicates that the data is valid. H : data valid L : data invalid SDCOM : Serial Communication data from OGP to CIF (including signals, ZERO DETECT and OVER RANGE). DSCOM : Serial Communication data from CIF to OGP (including signals, ZERO DETECT and OVER RANGE). GPLS2 : Home Position H : home position L : not in home position AC/OF : Signal to indicate if the scan is active or offset. XRON : Signal to indicate that Xray exposure is On. RESET : Reset signal for microprocessor in the DAS.

310

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3-3

CIF BOARD (Continued) Illustration 310 CIF board block diagram for systems other than Twin to CAM CIF 24.8832 MHz CLK Generator AZCLK CAM CLK

DTRIG DENBL AC/OF SDCOM DSCOM OGP RESET

32.0000 MHz

CLK Generator

ADCLK

micro processor

CIF control circuit

GPLS2 XRON data select circuit ROM

ADTR3

ROM

SCAN MODE

ROM

CAM data

DDP

311

DAS/DETECTOR

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3-3

CIF BOARD (Continued) Illustration 311 CIF board block diagram for Twin Motor Driver for Zaxis control to CAM CIF 24.8832 MHz CLK Generator AZCLK CAM CLK

DTRIG DENBL AC/OF SDCOM DSCOM OGP RESET

32.0000 MHz

CLK Generator

ADCLK

micro processor

CIF control circuit

GPLS2 XRON data select circuit ROM

ADTR3

ROM

SCAN MODE

ROM

CAM data

DDP

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The CAM board performs the following functions: D Conversion of electrical current signals from the detector to voltage signals. D Signal level conditioning D Analog to Digital conversion D Serial to parallel (digital data) conversion. D Generation of the timing signals for data gathering See Illustration 312. The signal from the detector with the level proportional to the Xray intensity is fed to the CAM board. The signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed to the Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data. The serial data is then sent to the control logic and converted to parallel data. The control logic also generates the timing for data gathering, so that 1 channel data is taken at a time. This part of circuit works synchronized with other CAM boards so that the data in entire DAS is taken a determined sequence. Illustration 312 DETECTOR
DAS

CAM board block diagram

CAM ASSY
Electrical Current ANALOG DATA DIGITAL SERIAL DATA

A/D Converter

32 CHANNELS

A/D Converter

CONTROL LOGIC (FPGA) DIGITAL PARALLEL DATA (TO DDP)

CONTROL SIGNALS (FROM CIF)

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3-4

CAM BOARD (Continued) Illustration 313 Control Logic (FPGA) block diagram

FPGA
CCLK master signal for CAM control from CIFside CAM 7bit data master signal for CAM control to next CAM 7bit data ADTR1 ADTR2 ADTR3 shift resistor 1CLK unit1 control

CAM control logic generator

shift resistor 2CLK

shift resistor 1CLK

SAMPLE for A/D sample generator

ACT/ REF select

FPNR
head Amp 2nd Amp. 3rd Amp.

x64 x16 SAMPLE SCLK BUSY

x4

x1

314

output data to DDP 9bit data

parallel data data selector serial / parallel conversion

Comparator

A/D

MCLK RST

unit2 control

from A/D Sdata : serial data SCLK Busy

to FPNR ranging data x 64 x 16 x 4 x 1

serial data

DAS/DETECTOR

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The DDP board performs two functions: Offset data correction and test patter generation. Offset Correction The digital data coming from CAM board contains offset portion due to electronic circuitry and offset scan. The illustration 314 shows a simplified block diagram of the offset cancel circuit in the DDP board. The multiplex blocks MUX1 select inputs ports A or B according to the data type. Port A or B is selected if the data is or active respectively. These multiplexers shift data by 4 bits. Both offset and active data are 16 bits long. When first offset data comes, the multiplexers MUX2 select port B so that 0 is added (by ALU Arithmetic Logic Unit) to the offset data. The result of this operation is then latched to the block LATCH in illustration 314. From the next offset data on, the multiplexers MUX2 select input A so that the latched former result is added to new offset data. this operation is repeated 16 times, what leads to 20 bits data.Only 16 most significant bits are taken, which results in the average of the sum. This data is taken as a subtraction factor for offset correction. During normal scan operation, the average of the offset data is subtracted from the active data in the ALU. This data is then sent to a ROM for the purpose of data alteration. Illustration 314 Offset correction circuit
LATCH DATA FROM SPC function (CAM FPGA circuit) D15D12

A MUX1 B

A MUX2 B ALU DATA TO DTRF

D15D12 D11D9

A MUX1 B

A MUX2 B ALU

D3D0

A MUX1 B

A MUX2 B ALU

Test Pattern Generation The Test Pattern is for test purpose (DAS data pattern test) that checks the link between DDP board to DAS IFN board (Operator Console).

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DAS/DETECTOR

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3-6

DTRF BOARD

The DTRF (Data Transfer with Forward Error Correction) executes the following functions: D Error correction code generation D Parallel/Serial conversion D View packing D Electric to light signal conversion Illustration 315 DTRF2 for Twin

A Slice From DAS B Slice

FEC Encoder TAXI Transmitter (P/S conversion) Optical Transmitter fiber optics RF Transmitter To RF OC Receiver fiber optics

FEC Encoder

Illustration 316

DTRF for systems other than Twin

From DAS

FEC Encoder

TAXI Transmitter (P/S conversion)

Optical Transmitter fiber optics

RF Transmitter

To RF OC Receiver fiber optics

Error correction code is added for checking the transmitted data at DASIFN assy in the Operator Console to assure data accuracy. The optical transmitter converts the electric signal to light signal, which is sent to RF transmitter by cable optics. The RF transmitter sends the signal to RF receiver on the stationary gantry, where the signal is again converted to light signal and sent to Operator Console by fiber optics. For details about data communication, error correction and other information, refer to DASIFN in the Operator Console.

316

DAS/DETECTOR

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XRAY GENERATOR

TABLE OF CONTENTS
SECTION SECTION 1 GENERAL DESCRIPTION I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1 1-2 GLOSSARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . JEDI HIGH LEVEL BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PAGE 11
11 12

SECTION 2 GENERAL DESCRIPTION II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


2-1 2-2 2-3 2-4 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . STANDARD FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-1 A Kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-2 Options Depending on the Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-3 A Packaging Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

21
21 21 22 23 23 23 25

SECTION 3 TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


3-1 JEDI TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31
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SECTION 1 GENERAL DESCRIPTION I

1-1

GLOSSARY

Glossary of terms used in this document:

Term
ABC AEC CAN CPU EPLD EMC FPGA

Definition
Automatic Brightness Control. Regulation loop which makes the measured brightness equal to brightness demand Automatic Exposure Control. Exposure cut off technique which uses the brightness signal to cut the exposure Controller Area Network. A network used for localized control. Control Processor Unit. Microprocessor and peripherals which run the software/firmware Erasable Programmable Logic Device. Electro Magnetic Compatibility. The EMC function prevents the generator from polluting the power source. Field Programmable Gate Array. It is programmed by the CPU core after the reset and handles all the exposure control logic including the system interface real-time lines. High voltage variations due to inverter current pulses. Typically a few percent. Software or hardware function which handles the state of a system and authorize to go to the next state upon reception of specific events. Insulated gate bipolar transistor. A type of power switch HV power inverter parallel resonant current; current in the parallel inductor HV power inverter serial resonant current; current in the serial inductor. Metal Oxide Semiconductor. A type of power switch On Gantry Processor. Unit which drives the generator in CT systems Power Distribution Unit Root Mean Square

HV Ripple State Machine

IGBT

Ilp Ilr
MOS OGP PDU RMS

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REV 12

1-2 JEDI HIGH LEVEL BLOCK DIAGRAM

GE MEDICAL SYSTEMS

JEDI GENERATOR / NP, NP+ FUNCTIONAL ARCHITECTURE


System System Interface Control Bus

Illustration 11 Jedi Generator / NP, NP+ Functional Architecture

kV Control

Heater

heater supply bus

Low Voltage Power Supply

Rotation

DC Bus AC/DC
12 XRAY GENERATOR

rotation phases

High Voltage EMC Filter Inverter

High Voltage Tank

HV Cables

CT HISPEED SERIES THEORY OF OPERATION

1 phase 3 phase power tube cooling input input

X-Ray Tube 1

2202124

GE MEDICAL SYSTEMS REV 12 Illustration 12

CT HISPEED SERIES THEORY OF OPERATION 2202124 Jedi Generator / NP++, NP++ Twin Functional Architecture

JEDI GENERATOR / Np++, NP++ TWIN FUNCTIONAL ARCHITECTURE

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SECTION 2 GENERAL DESCRIPTION II

2-1

INTRODUCTION

Jedi is the engineering name for a family of compact high frequency XRay generators. This generator family covers a wide range of applications from mobile equipment up to vascular systems:
D D D D D

JEDI 1225 kW: JEDI 2448 kW: JEDI 3250 kW: JEDI 100 kW:

Mobile applications CT applications RAD applications VASCULAR applications

JEDI 506580 kW: RF applications

2-2

STANDARD FEATURES

Jedi is a family of 150 kV generators operating from 12 kW up to 100 kW for all the major radiological, fluoroscopic and CT applications. The family handles 1 ms to continuous exposures with tube currents ranging from 0mA up to 1000 mA. The generators feature the very latest technology available:
D D D

Constant potential independent of line voltage variations Power generation by a highfrequency converter (High voltage ripple: 40 kHz140 kHz) Distributed microprocessor controlled functions (CAN bus)

Other features include:


D D D

Single phase, three phase or battery power source Very low kV and mA ripple, excellent accuracies and dose reproducibility Compatible with a wide range of tubes, high speed or low speed, can supply up to 3 different tubes. Thermal load interactive integrator ensuring optimum use of the heat protection curve of the xray tube Available in various packaging configurations: gantry, undertable, cabinet Serviceability: high reliability, fast installation (no generator calibration), application error codes ensure fast troubleshooting Meets CE marking (and in particular EMC), IEC, UL, CSA, MHW regulations (if required) Optional pulsed fluoroscopy

D D

D D

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2-3

APPLICATIONS

RAD
3 Points Mode 2 Points Mode 1 Point Mode 0 Point Mode AEC Tomography AET Continuous/Pulsed Fluoroscopy Rad Exposures Cinema 30 fr/s Cinema 90 fr/s ABC Variable mA Scans Low mA Fluoroscopy

Surgery

RF x x x x x x x x

x x x x x x x x x

Vascular/ Cardiac x x x x x

CT

x x x x

Legend:
AEC Automatic Exposure Control AET Automatic Tomographic Exposure ABC Automatic Brightness Control in fluoroscopy

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2-4

ARCHITECTURE

Refer to Illustration 21: Jedi Generator / Functional Architecture The Jedi family is composed of 3 elements:
2-4-1
D D D D D D D D

A Kernel

High voltage chain composed of kV control, HV power inverter and HV tank Anode rotation function Tube filaments heater function Control bus for communication between the functions DC bus for power distribution to each function Input voltage to DC conversion: AC/DC function Low voltage power supply Application software, running on the kV control board

These functions are the Jedi core. They are present in all versions of the generator. A function can be unique for all products, or can have several different releases based on product specification. Examples: The anode rotation function is available in 2 releases:
D D

low speed rotation for applications where the tube has a max rotation of 3000 rpm high speed/low speed rotation for applications where at least one of the tubes can use 800010000 rpm

The control bus is unique.


2-4-2
D

Options Depending on the Application

A System Interface which can be: CT interface RAD interface (console interface, room interface, AEC management present or not) ATLAS interface EMC function Grid function (RF, vascular) Bias function (RF, vascular) Tube management (2 tubes or 3 tubes option)

D D D D

23

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REV 12

GE MEDICAL SYSTEMS

JEDI GENERATOR / FUNCTIONAL ARCHITECTURE


System Interface Control Bus

Illustration 21

System

Jedi Generator / Functional Architecture

kV Control
preload (1 phase)

Heater

heater supply Low bus

Voltage Power Supply

Rotation

DC Bus AC/DC
inverter controls HV measures fil. drives

24 XRAY GENERATOR

Tube Selection
rotation phases +safeties+fans

Tube Management
rotation phases +safeties+fans

EMC Filter

High Voltage Inverter

High Voltage HV Cables Tank

CT HISPEED SERIES THEORY OF OPERATION

Grid/Bias X-Ray Tube 1 1 phase or 1 phase tube phase power cooling input input

X-Ray Tube 2

Chiller

2202124

GE MEDICAL SYSTEMS REV 12 2-4-3 A Packaging Architecture

CT HISPEED SERIES THEORY OF OPERATION 2202124

The packaging architecture consists in a set of boxes which can be put together in several ways to make Jedi fit either in a cabinet, or a console foot, or a table foot. The boxes can also be split in 2 units distant of several meters (example: CT gantry). Refer to Illustration 22. The boxes normally consist of the following:
Auxiliaries Box
D D D

Rotation function Heater function Low voltage power supply (which can also be in the AC/DC box)

This box is always present.


Power Box
D D D D

HV tank HV power inverter kV control System interface (for the less complex system interface)

This box is always present.


AC/DC Box
D D D

MC filter (optional) AC/DC function Low voltage power supply (which can also be in the auxiliaries box)

This box is always present.


System Interface Box
D D

RAD interface AEC interface

This box is present in the RAD product.

25

XRAY GENERATOR

GE MEDICAL SYSTEMS REV 12 HEMIT (High efficiency motor insulated transformer)


D D

CT HISPEED SERIES THEORY OF OPERATION 2202124

HV HEMIT Tank (transformers in high voltage) DCDisch board (to discharge the recovered energy of the rotor and securities)

This box is present with non insulated stator tubes (Performix on NP++ and NP++ Twin, for example)
Optional Boxes
D D

Tube selection Grid/Bias control

26

XRAY GENERATOR

GE MEDICAL SYSTEMS REV 12 Illustration 22 Jedi Generator / Packaging Architecture

CT HISPEED SERIES THEORY OF OPERATION 2202124

Inverter Assembly
Dual Snub Tube HV Gate Command Board

+
KV Measure HV Tank

CT Interface

KV Control Board EMC Filter (Optional)

POWER BOX

LVPS Board (for NP and Emperor)

Heater Board

Rotation Board

Rotation Capacitor

Rotation Capacitor

(optional) AUXILIARIES BOX OPTIONAL BOXES


LVPS Board (for TIGER) AC/DC BOX RAD Interface Tube Selection 27

AC/DC Board

Rectifier Block

AEC Interface

SYSTEM INTERFACE BOX FOR THE RAD PRODUCT

Grid/Bias Control

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SECTION 3 TYPICAL SIGNALS

3-1

JEDI TYPICAL SIGNALS

The following table describes the main signals of the generator. For each of them, typical values are presented for the main applications:

Signal/Application Anode Rotation: Phase P current during high speed run Phase A current during high speed run Filament Drive: Inverter current in standby 2.5 A Heater DC input voltage in standby kV Control: DC bus measure at 400 VAC ILR at full power at 400 VAC ILR at min power at 400 VAC ILP at full power at 400 VAC ILP at min power at 400 VAC 560 V

Values
(36 kW max, Qj tube)

2 A peak / 144 Hz 2 A peak / 144 Hz 3.3 A peak / 35 kHz 160V

500 A peak / 50 kHz 80 A peak / 25 kHz 150 A peak / 50 kHz 150 A peak / 25 kHz

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APPENDIX A SYMBOLS AND CLASSIFICATION


Symbol Publication Description

4175032

Alternating Current

3351 3 3351 3N

Threephase Alternating Current

Threephase Alternating Current with neutral conductor

Direct Current

4175019

Protective Earth (Ground)

348

Attention, consult ACCOMPANYING DOCUMENTS

4175008

OFF (Power: disconnection from the mains)

4175007

ON (Power: connection to the mains)

Warning, HIGH VOLTAGE

Emergency Stop

A1

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Symbol

Publication

Description Type B

4175339

Xray Source Assembly Emitting

4175009

Standby

Start

Table Set

Abort

Intercom

(on Operator Console) Power On: light on Standby: light off

A2

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Symbol

Description Microphone (Mic)

Contrast

Brightness

eb_C

System storage prior to installation: Maintain storage temperature between 10 C and +60 C

acb_C System storage prior to installation: Maintain noncondensing storage humidity below 95% DO NOT store system longer than 90 days

m wuqu dagd. l pv quys C yqry o u y

Au P r r fdbacbebtPo

System storage and shipment: Maintain Air Pressure between 750 and 1060hPa

A3

GE MEDICAL SYSTEMS REV 0 CLASS 1 EQUIPMENT

CT HISPEED SERIES THEORY OF OPERATION 2202124

Any permanently installed equipment containing operator or patient accessible surfaces must provide backup protection against electric shock,in case the BASIC INSULATION fails. In addition to BASIC INSULATION,Class1 equipment contains a direct connection to a PROTECTIVE(EARTH) CONDUCTOR which prevents shocks when a person touches a broken piece of equipment or touches two different equipment surfaces simultaneously.

TYPE B EQUIPMENT CLASS I, II, or III EQUIPMENT or EQUIPMENT with INTERNAL ELECTRICAL POWER SOURCES provide an adequate degree of protection against electric shock arising from (allowable) LEAKAGE CURRENTS or a breakdown in the reliability of the protective earth connection.

ORDINARY EQUIPMENT Enclosed EQUIPMENT without protection against the ingress of water.

OPERATION 0f EQUIPMENT

CONTINUOUS OPERATION WITH INTERMITTENT LOADING.


Operation in which EQUIPMENT is connected continuously to the SUPPLY MAINS. The stated permissible loading time is so short that the long term onload operating temperature is not attained. The ensuing interval in loading is, however, not sufficiently long for cooling down to the long term noload operating temperature. EQUIPMENT not suitable for use in the presence of a FLAMMABLE ANESTHETIC MIXTURE WITH AIR or WITH OXYGEN or NITROUS OXIDE

CLEANING The ProSpeed S series system is NOT WATERPROOF. It is NOT designed to protect internal components against the ingress of liquids.Clean external system surfaces(Gantry,table,consoles and accessories)with a soft cloth dipped in hot water and wrung DAMP/DRY. (NOT dripping!) IF NECESSARY, use only mild (dish washing liquid) soap to remove dirt.

NOTICE
Avoid damage to equipment! Some spray and wipecleaners etch and permanently cloud clear plastic surfaces!! Use only warm water and mild liquid soap to clean surfaces.

A4

GE Medical Systems: Telex 3797371 P.O. Box 414, Milwaukee, Wisconsin 53201 U.S.A. (Asia, Pacific, Latin America, North America) GE Medical Systems Europe: Telex 698626 283, rue de la Minire, B.P. 34, 78533 Buc Cedex, France